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    • 13. 发明授权
    • Stacked semiconductor module
    • 堆叠式半导体模块
    • US06720643B1
    • 2004-04-13
    • US09792788
    • 2001-02-22
    • Thomas F. FoxSayeh KhaliliBelgacem HabaDavid NguyenRichard WarmkeXingchao Yuan
    • Thomas F. FoxSayeh KhaliliBelgacem HabaDavid NguyenRichard WarmkeXingchao Yuan
    • H01L2302
    • G11C5/02G11C5/04G11C29/08G11C2029/4402H01L23/5382H01L25/0657H01L2924/0002H01L2924/00
    • The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dies positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dies. The programmable memory device is programmable to identify the integrated circuit dies that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dies and the programmable memory device. The integrated circuit dies of the plurality of integrated circuit dies that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dies.
    • 提供了半导体模块,其包括半导体壳体和位于壳体内的多个集成电路模具。 该半导体模块还包括位于壳体内并可电耦合到多个集成电路管芯的可编程存储器件。 可编程存储器件可编程以识别满足预定标准(例如工作频率要求或核心定时等级)的集成电路管芯。 此外,提供了一种用于访问半导体模块的方法。 提供上述壳体以封闭多个集成电路管芯和可编程存储器件。 然后识别满足预定标准的多个集成电路管芯的集成电路管芯。 随后编程可编程存储器件以识别所选择的集成电路管芯。