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11. 发明授权

US06670282B2 Method and apparatus for producing silicon carbide crystal 有权
公开(公告)号：US06670282B2
公开(公告)日：2003-12-30
申请号：US09954209
申请日：2001-09-18
申请人： Haruyoshi Kuriyama , Hiroyuki Kondo , Shouichi Onda , Kazukuni Hara
发明人： Haruyoshi Kuriyama , Hiroyuki Kondo , Shouichi Onda , Kazukuni Hara
IPC分类号： H01L2131
CPC分类号： C30B23/02 , C30B23/00 , C30B23/002 , C30B29/36 , Y10S438/909 , Y10S438/931
摘要： To produce a SiC crystal in a shape which is used as a wafer, a guide is disposed around a SiC crystal substrate so as to cover a peripheral portion of the SiC crystal substrate. Temperature of the guide may be made higher than the sublimation temperature of the SiC when a SiC crystal is disposed upon and caused to grow on the SiC crystal substrate, thereby controlling and restricting the SiC crystal growth in the direction of the guide. Additionally, when the guide is formed in a substantially hexagonal tube shape, the SiC crystal can be produced in a hexagonal pole shape. In this case, when alignment is made between each diagonal passing through a center of the hexagon shape of the guide and specific direction ( or of the SiC crystal substrate), the SiC crystal becomes aligned accordingly.

12. 发明授权

US06545272B1 Apparatus and methods for monitoring contamination of an optical component in an optical system 失效
标题翻译：用于监测光学系统中的光学部件的污染的装置和方法
公开(公告)号：US06545272B1
公开(公告)日：2003-04-08
申请号：US09587626
申请日：2000-06-05
申请人： Hiroyuki Kondo
发明人： Hiroyuki Kondo
IPC分类号： G01N2188
CPC分类号： G03F7/70916 , G01N22/00 , G01N23/225
摘要： Apparatus and methods are disclosed for measuring the state of contamination of one or more optical components in an optical system, such as in an X-ray optical system. Also disclosed are microlithography systems including a device for monitoring accumulation of a contaminant substance on a surface of an optical component of the system. The optical component is irradiated with a beam of electromagnetic radiation or a beam of charged particles (e.g., electron beam). The state of contamination of the optical component is measured by detecting electrons emitted from the optical component as the optical component is being irradiated with the beam. Electrons are quantified that are within a specified energy range of emitted electrons.
摘要翻译：公开了用于测量诸如在X射线光学系统中的光学系统中的一个或多个光学部件的污染状态的装置和方法。还公开了微光刻系统，其包括用于监测系统的光学部件的表面上的污染物质的累积的装置。用电磁辐射束或带电粒子束（例如电子束）照射光学部件。通过在用光束照射光学部件时检测从光学部件发射的电子来测量光学部件的污染状态。在发射电子的指定能量范围内量化电子。

13. 发明授权

US06385290B1 X-ray apparatus 有权
标题翻译： X光装置
公开(公告)号：US06385290B1
公开(公告)日：2002-05-07
申请号：US09395163
申请日：1999-09-14
申请人： Hiroyuki Kondo , Noriaki Kandaka
发明人： Hiroyuki Kondo , Noriaki Kandaka
IPC分类号： G21K106
CPC分类号： B82Y10/00 , G03F7/70025 , G03F7/70033 , G03F7/70041 , G03F7/707 , G03F7/70708 , G03F7/70916 , G03F7/70925
摘要： A x-ray apparatus includes an x-ray source, an x-ray optical system, wherein the x-ray optical system extracts x-rays of a specific wavelength from the x-ray source and converts the x-rays into a beam, and an irradiation source that causes radiation to be incident on surfaces of optical elements contained in the x-ray apparatus.
摘要翻译： X射线装置包括x射线源，X射线光学系统，其中x射线光学系统从x射线源提取特定波长的x射线，并将x射线转换成光束，以及使辐射入射到包含在x射线装置中的光学元件的表面上的照射源。

14. 发明授权

US06324255B1 X-ray irradiation apparatus and x-ray exposure apparatus 有权
标题翻译： X射线照射装置和X射线曝光装置
公开(公告)号：US06324255B1
公开(公告)日：2001-11-27
申请号：US09372596
申请日：1999-08-12
申请人： Hiroyuki Kondo , Noriaki Kandaka
发明人： Hiroyuki Kondo , Noriaki Kandaka
IPC分类号： H05G200
CPC分类号： H05G2/003 , B82Y10/00 , G03F7/70033 , G03F7/7085 , H05G2/008
摘要： An x-ray irradiation apparatus and x-ray exposure apparatus provide improved x-ray generation. The x-ray irradiation apparatus includes a target material feed-out device to provide a target material in a feed-out direction to a specified target position and a laser to provide laser light to the specified target position to cause the target material to emit x-rays. In some configurations, an x-ray generation position control device may be used to determine and control a position of x-ray generation, a rotary mechanism may be operatively connected to the target material feed-out device to axially rotate the target material feed-out device about the feed-out direction, and/or a target feed-out control device may be used to detect and control the position of the target material feed-out device.
摘要翻译： X射线照射装置和X射线曝光装置提供改善的x射线产生。 X射线照射装置包括：目标材料送出装置，用于在指定目标位置的送出方向上提供目标材料;以及激光器，用于向指定的目标位置提供激光以使靶材料发射x 数字在一些配置中，可以使用x射线产生位置控制装置来确定和控制X射线产生的位置，旋转机构可以可操作地连接到目标材料送出装置以轴向旋转靶材料馈送装置，可以使用关于送出方向的出料装置和/或目标送出控制装置来检测和控制目标材料送出装置的位置。

15. 发明授权

US5080615A Bulb socket and method of manufacturing the same 失效
标题翻译：灯泡插座及其制造方法
公开(公告)号：US5080615A
公开(公告)日：1992-01-14
申请号：US641864
申请日：1991-01-16
申请人： Hiroyuki Kondo
发明人： Hiroyuki Kondo
IPC分类号： H01R33/09
CPC分类号： H01R33/09
摘要： A bulb socket for holding a bulb having wedge-shaped contact portions comprises (a) a socket housing (E) composed of a bulb holding portion (E1) and a connector holding portion (E2) formed integral with each other; and (b) two socket terminals (F) each composed of a bulb contact portion (F1) with a roughly rectangular base plate portion (1) and a pair of opposing extensional side walls (5) bent at both sides of and perpendicular to the base plate portion (1) so as to form a pair of opposing inwardly bent convex contact portions (3) at each free end of each extensional side wall (5), respectively; and a connector contact portion (F2) formed integral with the bulb contact portion (F1). Since the bulb contact portions (3) of the terminal can be formed by simply bending the extensional side walls (5) inwardly, respectively and further these bulb contact portions (F1) can be protected by an outer end (4) of the terminal base plate portion (1), the socket terminal (F) can be simplified in structure and therefore reduced in insertion molding cost by using a simple molding die including a simple core.
摘要翻译：用于保持具有楔形接触部分的灯泡的灯泡插座包括（a）由灯泡保持部分（E1）和彼此一体形成的连接器保持部分（E2）组成的插座壳体（E）和（b）两个插座端子（F），每个由具有大致矩形的基板部分（1）的灯泡接触部分（F1）和一对相对的延伸侧壁（5）构成，基板部分（1），以分别在每个拉伸侧壁（5）的每个自由端处形成一对相对的向内弯曲的凸形接触部分（3）; 以及与灯泡接触部（F1）一体形成的连接器接触部（F2）。由于端子的灯泡接触部分（3）可以通过简单地将伸展侧壁（5）向内弯曲而形成，并且另外这些灯泡接触部分（F1）可以被端子基座的外端（4）保护板部分（1），插座端子（F）的结构可以简化，并且因此通过使用包括简单的芯的简单成型模具来降低插入成型成本。

16. 发明授权

US4222613A Pressure control valve assembly for brake systems 失效
标题翻译：用于制动系统的压力控制阀组件
公开(公告)号：US4222613A
公开(公告)日：1980-09-16
申请号：US24257
申请日：1979-03-27
申请人： Hiroshi Takeshita , Takashi Nagashima , Hiroyuki Kondo
发明人： Hiroshi Takeshita , Takashi Nagashima , Hiroyuki Kondo
IPC分类号： B60T8/26 , B60T13/00
CPC分类号： B60T8/265
摘要： A pressure control valve assembly in a split brake system having two separate pressure lines comprises two valve pistons subjected to pressure from separate pressure sources so as to control the outlet pressure admitted to the respective rear wheel brakes. The valve assembly further comprises two movable members each in alignment with each of two valve pistons and subjected to the pressure of two pressure lines at each end thereof and two springs each interposed between a respective piston and movable member for normally urging the piston in the valve closing direction. The hydraulic failure of one of two pressure lines causes the movable member to move in the direction wherein no biasing force of the spring may be imparted to the valve piston.
摘要翻译：具有两个分开的压力管线的分离制动系统中的压力控制阀组件包括经受来自分开的压力源的压力的两个阀活塞，以便控制进入各个后轮制动器的出口压力。阀门组件还包括两个可动构件，每个可移动构件与两个阀活塞中的每一个对准，并且在每个端部承受两条压力管线的压力，并且两个弹簧分别插入在相应的活塞和可动构件之间，用于正常地推动阀门中的活塞关闭方向。两个压力管线中的一个的液压故障使得可动构件沿其中不向阀活塞施加弹簧的偏压力的方向移动。

17. 发明授权

US09153556B2 Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method 有权
标题翻译：用于制造半导体器件的粘合片，使用该片的半导体器件的制造方法以及通过该方法获得的半导体器件
公开(公告)号：US09153556B2
公开(公告)日：2015-10-06
申请号：US12759470
申请日：2010-04-13
申请人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
发明人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/00 , H01L23/00 , H01L23/31 , H01L25/065 , H01L25/00
CPC分类号： H01L24/83 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/98 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/3011 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/0532 , H01L2924/04642 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.
摘要翻译：用于制造半导体器件的粘合片是用于制造半导体器件的粘合片，当将半导体元件粘合到被粘物并且半导体元件被引线接合时使用，并且是可剥离的粘合片，其中180度剥离粘合强度相对于硅晶片为5（N / 25mm宽）或更小。

18. 发明授权

US08627046B2 Data processing device 有权
标题翻译：数据处理装置
公开(公告)号：US08627046B2
公开(公告)日：2014-01-07
申请号：US13113511
申请日：2011-05-23
申请人： Sugako Ohtani , Hiroyuki Kondo
发明人： Sugako Ohtani , Hiroyuki Kondo
IPC分类号： G06F7/52
CPC分类号： G06F9/3001 , G06F9/3016 , G06F9/30167 , G06F9/325
摘要： A data processing device has an instruction decoder, a control logic unit, and ALU. The instruction decoder decodes instruction codes of an arithmetic instruction. The control logic unit detects the effective data width of operation data to be processed according to the decode result from the instruction decoder and determines the number of cycles for the instruction execution corresponding to the effective, data width. The ALU executes the instruction with the number of cycles of the instruction execution determined by the control logic unit.
摘要翻译：数据处理装置具有指令译码器，控制逻辑单元和ALU。指令译码器解码算术指令的指令码。控制逻辑单元根据来自指令解码器的解码结果检测要处理的操作数据的有效数据宽度，并确定与有效数据宽度对应的指令执行的周期数。 ALU以由控制逻辑单元确定的指令执行的周期数执行指令。

19. 发明申请

US20130020724A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED THEREIN, AND SEMICONDUCTOR DEVICE OBTAINED THEREBY 有权
标题翻译：半导体器件的制造方法，其使用的粘合片及其获得的半导体器件
公开(公告)号：US20130020724A1
公开(公告)日：2013-01-24
申请号：US13615221
申请日：2012-09-13
申请人： Sadahito Misumi , Takeshi Matsumura , Kazuhito Hosokawa , Hiroyuki Kondo
发明人： Sadahito Misumi , Takeshi Matsumura , Kazuhito Hosokawa , Hiroyuki Kondo
IPC分类号： C09J163/00 , H01L21/56 , H01L23/28 , C09J133/00
CPC分类号： H01L25/0657 , H01L23/293 , H01L24/73 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , Y10T428/1462 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.
摘要翻译：本发明包括临时固定步骤，将半导体元件临时固定在粘合片之间的粘附片上，将导线接合到半导体元件的引线键合步骤以及用密封树脂密封半导体元件的步骤，以及其中175℃下的粘合片的损耗弹性模量为2000Pa以上。

20. 发明申请

US20120168246A1 SOUNDPROOFING COVER AND METHOD OF MANUFACTURING SAME 有权
标题翻译：防震罩及其制造方法
公开(公告)号：US20120168246A1
公开(公告)日：2012-07-05
申请号：US13420659
申请日：2012-03-15
申请人： Hiroyuki Kondo , Yukio Hatanaka
发明人： Hiroyuki Kondo , Yukio Hatanaka
IPC分类号： E04B1/82 , B29C67/20 , B29C45/14
CPC分类号： F02B77/13 , F02F7/006
摘要： A soundproofing cover that has a sufficiently high soundproofing performance and that allows another member to be reliably attached to the soundproofing cover with a screw-fastening structure is provided. The soundproofing cover includes a cover body, a sound absorbing layer made of a urethane foam and formed integrally with the back surface of the cover body, and a nut member having a threaded hole that opens at both sides of the nut member in an axial direction. The nut member is embedded in the cover body in a manner such that an opening of the threaded hole in the nut member at a first end in the axial direction opens at a front surface of the cover body and an opening of the threaded hole at a second end in the axial direction is blocked by a blocking portion that is formed integrally with the cover body.
摘要翻译：提供了具有足够高的隔音性能并且允许另一个构件以螺钉紧固结构可靠地附接到隔音罩的隔音罩。隔音盖包括盖体，由聚氨酯泡沫制成的吸音层，与盖体的后表面一体形成，以及螺母构件，具有螺纹孔，该螺纹孔在螺母构件的轴向方向上开口。螺母构件以这样的方式嵌入盖体中，使得在轴向的第一端处的螺母构件中的螺纹孔的开口在盖体的前表面处开口，并且螺纹孔的开口在沿轴向的第二端被与盖体整体形成的阻挡部分阻挡。

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