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    • 1. 发明授权
    • Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques
    • 用于通过工艺数据采集和衬底成像技术增强嵌入式衬底检查的方法和装置
    • US06813032B1
    • 2004-11-02
    • US09680226
    • 2000-10-06
    • Reginald Hunter
    • Reginald Hunter
    • G01N2188
    • G01N21/94G01N21/8903G01N21/9501G01N21/956
    • The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a par of light sources is used in conjunction with an optical receiving device, such as a camera having a CCD, to illuminate and inspect a substrate for various optical signatures. The substrate signatures are then used to generate images of obstructions in three dimensions (3-D) for further analysis. In one embodiment, the substrate is scanned in two or more directions with a first light source and then scanned in two or more directions with a second light source. A receiver captures the reflected and/or scatted signals from sources comprising two or more different images. The light illumination from the first and second light sources impinges on substrate surface obstructions from two differing angles (i.e. perspectives). Therefore, the image from the first light source obtains information pertaining to one side of obstructions while the image from the second light source offers information pertaining to the opposite side of the obstruction. Differentiation between the images is provided by either different perspective angles and/or different optical filtering configurations.
    • 本发明总体上提供了一种在处理系统中检查基板的装置和方法。 在一个方面,光源的一部分与诸如具有CCD的照相机的光学接收装置结合使用以照亮和检查用于各种光学特征的基板。 然后使用底物特征来产生三维障碍物(3-D)的图像用于进一步分析。 在一个实施例中,用第一光源以两个或更多个方向扫描基板,然后用第二光源以两个或更多个方向扫描基板。 接收器捕获来自包括两个或更多个不同图像的源的反射和/或散射信号。 来自第一和第二光源的光照射从两个不同的角度(即透视图)撞击基板表面的障碍物。 因此,来自第一光源的图像在来自第二光源的图像提供关于障碍物的相对侧的信息的同时获得与障碍物的一侧有关的信息。 图像之间的差异由不同的透视角度和/或不同的光学滤波配置提供。
    • 2. 发明授权
    • System and method for inspecting semiconductor wafers
    • 用于检查半导体晶片的系统和方法
    • US06791680B1
    • 2004-09-14
    • US09474941
    • 1999-12-30
    • Eliezer RosengausSteven R. Lange
    • Eliezer RosengausSteven R. Lange
    • G01N2188
    • G01N21/95623G01N21/9501G01N2021/8822H01L21/67155
    • A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtered. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.
    • 提供了一种用于检查半导体晶片的方法,其中多个独立的,低成本的光学检查子系统被封装和集成,以同时对晶片的部分进行并行检查,相对于被检查的晶片位置被控制,使得 整个晶片由光学子系统的系统以光栅扫描模式成像。 单色相干光源照亮晶片表面。 暗场光学系统使用傅立叶滤波来收集散射光并滤除由有效周期性晶片结构产生的图案。 滤波后的光由通用数字信号处理器处理。 图像减法方法用于检测晶片缺陷,报告给主计算机,以帮助进行统计过程控制,特别是制造设备。
    • 3. 发明授权
    • Substrate defect inspection method and substrate defect inspection system
    • 基板缺陷检查方法和基板缺陷检查系统
    • US06724005B2
    • 2004-04-20
    • US09982339
    • 2001-10-17
    • Toshifumi Tokumoto
    • Toshifumi Tokumoto
    • G01N2188
    • G01N21/9501
    • When performing a defect inspection of a wafer W, defect observation equipment 3 first inputs defect position data from defect detection equipment 2. After a plurality of measurement points are set, the amount of position shift between the detection coordinate system and the observation coordinate system is measured for each measurement point. Then, the defect observation equipment 3 creates a first-order defect position correction formula in order to make reasonable the defect position in the detection coordinate system, based on the position shift amounts of the measurement points. This first-order defect position correction formula has three terms, for the offset component, the magnification component, and the rotation component of the observation coordinate system with respect to the detection coordinate system. Next, using the defect position correction formula, a defect position detected by the defect detection equipment 2 is corrected. By this means, the resolution of the defect observation equipment is raised, and the precision of substrate defect inspection is improved.
    • 当对晶片W进行缺陷检查时,缺陷观察设备3首先从缺陷检测设备2输入缺陷位置数据。在设置了多个测量点之后,检测坐标系和观察坐标系之间的位置偏移量为 测量每个测量点。 然后,缺陷观察设备3基于测量点的位置偏移量,创建一级缺陷位置校正公式,以使检测坐标系中的缺陷位置合理化。 该一阶缺陷位置校正公式对于观察坐标系相对于检测坐标系的偏移分量,放大分量和旋转分量具有三个项。 接下来,使用缺陷位置校正公式,校正由缺陷检测设备2检测到的缺陷位置。 通过这种方式,提高了缺陷观察设备的分辨率,提高了基板缺陷检查的精度。
    • 5. 发明授权
    • Particle detection and embedded vision system to enhance substrate yield and throughput
    • 粒子检测和嵌入式视觉系统,以提高底物产量和产量
    • US06707544B1
    • 2004-03-16
    • US09391341
    • 1999-09-07
    • Reginald HunterSagie Tsadka
    • Reginald HunterSagie Tsadka
    • G01N2188
    • G01N21/956G01N21/94G01N21/9501
    • The present invention generally provides an apparatus and a method for scanning a substrate in a processing system. A transmitter unit and a receiver unit are disposed on a processing system and cooperate to transmit and detect energy, respectively. The transmitter unit is positioned to transmit a signal onto the substrate surface moving between vacuum chambers, one of which is preferably a transfer chamber of a cluster tool. Features disposed on the substrate surface, which may include particles, devices, alphanumeric characters, the substrate edges, notches, etc., cause a scattering or reflection of a portion of the signal. The receiver unit is disposed to collect the scattered/reflected portion of the signal and direct the same to a processing unit. Preferably, the transmitter unit comprises a laser source and the receiver unit comprises a charged-coupled device (CCD). Preferably, the invention is integrally positioned in a processing system to allow substrate inspection during normal operation and provide real-time information.
    • 本发明总体上提供了一种用于在处理系统中扫描衬底的装置和方法。 发射机单元和接收机单元设置在处理系统上,并分别协同传输和检测能量。 发射器单元被定位成将信号传输到在真空室之间移动的衬底表面上,其中一个优选地是簇工具的传送室。 设置在基板表面上的特征可以包括颗粒,装置,字母数字字符,基板边缘,凹口等,导致信号的一部分的散射或反射。 接收器单元设置成收集信号的散射/反射部分并将其引导到处理单元。 优选地,发射器单元包括激光源,并且接收器单元包括电荷耦合器件(CCD)。 优选地,本发明整体地定位在处理系统中,以允许正常操作期间的基板检查并提供实时信息。