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    • 16. 发明授权
    • Methods of forming a floating junction on a solar cell with a particle masking layer
    • 在具有颗粒掩蔽层的太阳能电池上形成浮点的方法
    • US08513104B2
    • 2013-08-20
    • US13172040
    • 2011-06-29
    • Malcolm AbbottMaxim KelmanEric RosenfeldElena RogojinaGiuseppe Scardera
    • Malcolm AbbottMaxim KelmanEric RosenfeldElena RogojinaGiuseppe Scardera
    • H01L21/22H01L21/38
    • H01L21/2255H01L31/022425H01L31/068H01L31/1804Y02E10/547Y02P70/521
    • A method of forming a floating junction on a substrate is disclosed. The method includes providing the substrate doped with boron atoms, the substrate comprising a front surface and a rear surface. The method also includes depositing a set of masking particles on the rear surface in a set of patterns; and heating the substrate in a baking ambient to a first temperature and for a first time period in order to create a particle masking layer. The method further includes exposing the substrate to a phosphorous deposition ambient at a second temperature and for a second time period, wherein a front surface PSG layer, a front surface phosphorous diffusion, a rear surface PSG layer, and a rear surface phosphorous diffusion are formed, and wherein a first phosphorous dopant surface concentration in the substrate proximate to the set of patterns is less than a second dopant surface concentration in the substrate not proximate to the set of patterns. The method also includes exposing the substrate to a set of etchants for a third time period, wherein the front surface PSG layer and the rear surface PSG layer are substantially removed; depositing a front surface SiNx layer and a rear surface SiNx layer; and forming a rear metal contact on the rear surface through the rear surface SiNx layer proximate to the set of patterns.
    • 公开了一种在衬底上形成浮点的方法。 该方法包括提供掺杂有硼原子的衬底,该衬底包括前表面和后表面。 该方法还包括在一组图案中的后表面上沉积一组掩模颗粒; 以及在烘烤环境中将基底加热到第一温度并且持续第一时间段以便产生颗粒掩蔽层。 该方法还包括在第二温度和第二时间段内将衬底暴露于磷沉积环境中,其中形成前表面PSG层,前表面磷扩散层,后表面PSG层和后表面磷扩散层 ,并且其中靠近所述图案集合的所述衬底中的第一磷掺杂剂表面浓度小于所述衬底中不接近所述图案集合的第二掺杂剂表面浓度。 该方法还包括将衬底暴露于一组第三时间的蚀刻剂,其中基本上去除了前表面PSG层和后表面PSG层; 沉积前表面SiNx层和后表面SiNx层; 以及通过靠近所述一组图案的后表面SiNx层在后表面上形成后金属接触。