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11. 发明申请

US20120132925A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE 审中-公开
标题翻译：制造半导体结构的方法和相应的半导体结构
公开(公告)号：US20120132925A1
公开(公告)日：2012-05-31
申请号：US13366067
申请日：2012-02-03
申请人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
发明人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
IPC分类号： H01L29/24
CPC分类号： H01L21/228 , H01L21/02378 , H01L21/02381 , H01L21/02532 , H01L21/02658 , H01L21/02667 , H01L21/223 , H01L21/225 , H01L21/324
摘要： A method for manufacturing a semiconductor structure is provided which includes the following steps: a crystalline semiconductor substrate (1) is supplied; a porous region (10) is provided adjacent to a surface (OF) of the semiconductor substrate (1); a dopant (12) is introduced into the porous region (10) from the surface (OF); and the porous region (10) is thermally recrystallized into a crystalline doping region (10′) of the semiconductor substrate (1) whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate (1). A corresponding semiconductor structure is likewise provided.
摘要翻译：提供一种制造半导体结构的方法，包括以下步骤：提供晶体半导体衬底（1）; 邻近半导体衬底（1）的表面（OF）设置多孔区域（10）; 从表面（OF）将掺杂剂（12）引入多孔区域（10）中; 并且多孔区域（10）被热再结晶成半导体衬底（1）的结晶掺杂区域（10'），其掺杂类型和/或掺杂浓度和/或掺杂分布与半导体衬底基板（1）。同样提供相应的半导体结构。

12. 发明申请

US20100035068A1 Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type 失效
标题翻译：具有改性表面性质的硅衬底的制造方法和所述类型的硅衬底
公开(公告)号：US20100035068A1
公开(公告)日：2010-02-11
申请号：US12308200
申请日：2007-04-27
申请人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
发明人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
IPC分类号： C25D5/00 , B32B17/06 , H01L21/30
CPC分类号： H01L21/02008 , H01L21/02381 , H01L21/02529 , H01L21/02573 , H01L21/02601 , H01L21/02612 , H01L21/02656 , H01L21/02658 , H01L21/02667 , H01L33/346
摘要： A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.
摘要翻译：一种制造硅衬底的方法，包括以下步骤：提供具有基本平坦的硅表面的硅衬底，产生具有多个孔的多孔硅表面，特别是具有大孔和/或介孔和/或纳米孔，要插入硅的材料，其直径小于孔的直径，如果需要，将填充材料插入孔中并除去多余的填充材料形成硅表面，并回火硅衬底配备有已经填充到孔中的填充材料，温度约为 1000℃和约 1400℃，以便再次闭合所产生的孔并包围填充材料。

13. 发明申请

US20080245764A1 Method for producing a device including an array of microneedles on a support, and device producible according to this method 审中-公开
标题翻译：用于制造包括支撑体上的微针阵列的装置的方法，以及根据该方法可制造的装置
公开(公告)号：US20080245764A1
公开(公告)日：2008-10-09
申请号：US12009498
申请日：2008-01-18
申请人： Tjalf Pirk , Michael Stumber , Joachim Rudhard , Ando Feyh , Christina Leinenbach , Christian Mauerer
发明人： Tjalf Pirk , Michael Stumber , Joachim Rudhard , Ando Feyh , Christina Leinenbach , Christian Mauerer
IPC分类号： C23F1/00 , A61M5/158
CPC分类号： B81C99/008 , A61M37/0015 , A61M2037/0046 , A61M2037/0053 , B81B2201/055
摘要： A method for producing a device which is suitable for delivering a substance into or through the skin and includes an array of microneedles developed out of an Si semiconductor substrate, the microneedles being affixed on and/or inside a flexible support made from a polymer material. A device producible by this method.
摘要翻译：一种用于生产适合于将物质输送到皮肤中或穿过皮肤的装置的方法，包括由Si半导体衬底形成的微针阵列，所述微针固定在由聚合物材料制成的柔性支撑体上和/或内部。可通过该方法生产的装置。

14. 发明授权

US10717645B2 Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment 有权
公开(公告)号：US10717645B2
公开(公告)日：2020-07-21
申请号：US15535687
申请日：2015-12-17
申请人： Robert Bosch GmbH , Ando Feyh , Gary O'Brien
发明人： Ando Feyh , Gary O'Brien
IPC分类号： H01L31/02 , H01L27/146 , H01L21/56 , B81C1/00 , H01L23/28 , H01L23/31 , H01L23/24 , G01L19/14 , G01L19/00 , B81B7/00
摘要： A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface.

15. 发明授权

US10224540B2 Li-ion battery with alumina coated porous silicon anode 有权
公开(公告)号：US10224540B2
公开(公告)日：2019-03-05
申请号：US14910695
申请日：2014-08-08
申请人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh , Robert Bosch GmbH
发明人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh
IPC分类号： H01M4/36 , H01M10/0525 , H01M10/0562 , C23C16/40 , C23C16/455 , C23C16/52 , H01M4/04 , H01M4/38 , H01M4/134 , H01M10/058 , C23C16/04 , H01M4/02
摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.

16. 发明申请

US20160190564A1 Li-Ion Battery with Alumina Coated Porous Silicon Anode 审中-公开
标题翻译：锂离子电池与氧化铝涂层多孔硅阳极
公开(公告)号：US20160190564A1
公开(公告)日：2016-06-30
申请号：US14910695
申请日：2014-08-08
申请人： Ashwin K. SAMARAO , Gary O'BRIEN , Ando FEYH , ROBERT BOSCH GMBH
发明人： Ashwin K. Samarao , Gary O'Brien , Ando Feyh
IPC分类号： H01M4/36 , H01M4/38 , C23C16/40 , H01M4/04 , C23C16/455 , C23C16/52 , H01M10/0525 , H01M10/0562
CPC分类号： H01M4/366 , C23C16/045 , C23C16/403 , C23C16/45555 , C23C16/52 , H01M4/0428 , H01M4/134 , H01M4/382 , H01M4/386 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/021 , H01M2220/20 , H01M2220/30 , H01M2300/0071 , H01M2300/0094 , Y02E60/122 , Y02T10/7011
摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.
摘要翻译：一个实施方案中的锂离子电池包括阴极中的锂基化合物，阳极中的第一多孔硅部分和涂覆第一多孔硅部分并与阴极接触的原子层沉积（ALD）氧化物层。

17. 发明授权

US08779533B2 MEMS with single use valve and method of operation 有权
标题翻译： MEMS单用阀和操作方法
公开(公告)号：US08779533B2
公开(公告)日：2014-07-15
申请号：US13180954
申请日：2011-07-12
申请人： Ando Feyh , Po-Jui Chen
发明人： Ando Feyh , Po-Jui Chen
IPC分类号： H01L29/84
CPC分类号： F16K99/003 , F16K99/0044
摘要： In one embodiment, a method of opening a passageway to a cavity includes providing a donor portion, forming a heating element adjacent to the donor portion, forming a first sacrificial slab abutting the donor portion, wherein the donor portion and the sacrificial slab are a shrinkable pair, forming a first cavity, a portion of the first cavity bounded by the first sacrificial slab, generating heat with the heating element, forming a first reduced volume slab from the first sacrificial slab using the generated heat and the donor portion, and forming a passageway to the first cavity by forming the first reduced volume slab.
摘要翻译：在一个实施例中，将通道打开到空腔的方法包括提供供体部分，形成邻近供体部分的加热元件，形成邻接供体部分的第一牺牲板，其中供体部分和牺牲板是可收缩的形成第一空腔，由第一牺牲板限定的第一空腔的一部分，用加热元件产生热量，使用产生的热量和供体部分从第一牺牲板形成第一减小体积的板坯，并形成通过形成第一减小体积的板坯到第一空腔的通道。

18. 发明授权

US08749013B2 Sensor and method for its production 有权
标题翻译：传感器及其生产方法
公开(公告)号：US08749013B2
公开(公告)日：2014-06-10
申请号：US12302677
申请日：2007-04-23
申请人： Hubert Benzel , Simon Armbruster , Arnim Hoechst , Christoph Schelling , Ando Feyh
发明人： Hubert Benzel , Simon Armbruster , Arnim Hoechst , Christoph Schelling , Ando Feyh
IPC分类号： H01L31/058
CPC分类号： B81B3/0081 , B81B2201/0278 , B81B2203/0109 , B81B2207/015 , B81C2201/0109 , G01J5/06 , G01J5/20
摘要： A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm.
摘要翻译：特别是用于空间分辨检测的传感器包括基板，至少一个微图案化的传感器元件，其具有值随温度变化的电特性，以及在空腔上方的至少一个隔膜，传感器元件设置在所述至少一个隔膜的下侧，并且所述传感器元件经由连接线接触，所述连接线在隔膜的顶部或下方延伸。特别地，多个传感器元件可以形成为通过外延形成的单晶层内的二极管像素。可以在隔膜内形成以弹性和绝缘方式容纳各个传感器元件的悬挂弹簧。

19. 发明授权

US08556504B2 Thermally decoupled micro-structured reference element for sensors 有权
标题翻译：用于传感器的热分解微结构参考元件
公开(公告)号：US08556504B2
公开(公告)日：2013-10-15
申请号：US13061670
申请日：2009-07-02
申请人： Ingo Herrmann , Daniel Herrmann , Frank Freund , Ando Feyh , Martin Eckardt
发明人： Ingo Herrmann , Daniel Herrmann , Frank Freund , Ando Feyh , Martin Eckardt
IPC分类号： G01K7/00 , B32B3/00
CPC分类号： H01L27/14669 , G01J5/02 , G01J5/0225 , G01J5/024 , G01J5/06 , G01J5/20 , H01L31/09
摘要： A micro-structured reference element for use in a sensor having a substrate and a dielectric membrane. The reference element has an electrical property which changes its value on the basis of temperature. The reference element is arranged with respect to the substrate so that the reference element is (i) electrically insulated from the substrate, and (ii) thermally coupled to the substrate. The reference element is arranged on the underside of the dielectric membrane. The reference element and side walls of the substrate define a circumferential cavern therebetween, which is also bounded by the dielectric membrane, arranged between them. The dielectric membrane is connected to the substrate. A surface area of the reference element which is covered by the dielectric membrane is greater than or equal to 10% and less than or equal to 100% of the possible coverable surface area. A surface of the cavern which is covered by the dielectric membrane is greater than or equal to 50% and less than or equal to 100% of the possible coverable surface. An edge of the reference element which faces the dielectric membrane has greater than or equal to 50% and less than or equal to 100% of its extent contacted by the dielectric membrane. Sections of the side walls of the cavern which face the dielectric membrane have greater than or equal to 50% and less than or equal to 100% of the possible size contacted by the dielectric membrane.
摘要翻译：一种用于具有基底和电介质膜的传感器中的微结构参考元件。参考元件具有基于温度改变其值的电性质。参考元件相对于衬底布置，使得参考元件（i）与衬底电绝缘，和（ii）热耦合到衬底。参考元件布置在电介质膜的下侧。衬底的参考元件和侧壁在它们之间限定周向的洞穴，它们也被布置在它们之间的电介质膜界定。电介质膜与基板连接。由电介质膜覆盖的参考元件的表面积大于或等于可能可覆盖表面积的10％且小于或等于100％。由电介质膜覆盖的洞穴的表面大于或等于可能可覆盖表面的50％且小于或等于100％。面向电介质膜的参考元件的边缘具有大于或等于其与电介质膜接触的程度的50％且小于或等于100％。面向电介质膜的洞穴的侧壁的截面具有大于或等于电介质膜接触的可能尺寸的50％且小于或等于100％。

20. 发明申请

US20130098154A1 Piezoresistive Micromechanical Sensor Component and Corresponding Measuring Method 有权
标题翻译：压电微机械传感器部件及相应的测量方法
公开(公告)号：US20130098154A1
公开(公告)日：2013-04-25
申请号：US13635581
申请日：2011-01-19
申请人： Reinhard Neul , Christian Rettig , Achim Trautmann , Daniel Christoph Meisel , Alexander Buhmann , Manuel Engesser , Ando Feyh
发明人： Reinhard Neul , Christian Rettig , Achim Trautmann , Daniel Christoph Meisel , Alexander Buhmann , Manuel Engesser , Ando Feyh
IPC分类号： G01P15/09
CPC分类号： G01P15/09 , G01P15/0802 , G01P15/12 , G01P15/123
摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.
摘要翻译：压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。地震质量从基板悬挂使其能够偏转。所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

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