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11. 发明授权

US06365970B1 Bond pad structure and its method of fabricating 有权
标题翻译：焊盘结构及其制造方法
公开(公告)号：US06365970B1
公开(公告)日：2002-04-02
申请号：US09458778
申请日：1999-12-10
申请人： Chen-Wen Tsai , Chung-Ju Wu , Wei-Feng Lin
发明人： Chen-Wen Tsai , Chung-Ju Wu , Wei-Feng Lin
IPC分类号： H01L2348
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05001 , H01L2224/05083 , H01L2224/05093 , H01L2224/05095 , H01L2224/05096 , H01L2224/05554 , H01L2224/05555 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48724 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs. Due to special disposition of via plugs and well adhesion between metal layer and diffusion barrier layers, the bond pad structure, according to the invention, can prevent form damage possibly induced during subsequent probe test procedure and wire bonding process.
摘要翻译：本发明公开了一种焊盘结构及其制造方法。接合焊盘结构形成在限定在半导体衬底上的预定区域上。接合焊盘结构包括在预定区域上形成的至少两个金属层和至少一个子结构组合层，每个子结构组合层形成在预定区域上并形成在两个对应的第一金属层之间。每个子结构组合层包括形成在预定区域上的电介质层，形成在电介质层上的特殊布置的通孔通孔，形成在电介质层上的第一扩散阻挡层和通孔开口的侧壁和底部，填充到通孔中以形成通孔的金属材料，以及形成在第一扩散阻挡层和经由插塞上的第二扩散阻挡层。由于通孔的特殊布置以及金属层与扩散阻挡层之间的良好的粘合性，根据本发明的接合焊盘结构可以防止在随后的探针测试程序和引线接合过程中可能引起的形式损坏。

12. 发明授权

US6116427A Tray for ball grid array devices 有权
标题翻译：球栅阵列装置托盘
公开(公告)号：US6116427A
公开(公告)日：2000-09-12
申请号：US494891
申请日：2000-01-31
申请人： Chung-Ju Wu , Wei-Feng Lin , Chen-Wen Tsai
发明人： Chung-Ju Wu , Wei-Feng Lin , Chen-Wen Tsai
IPC分类号： H01L21/673 , H05K13/00 , B65D73/02
CPC分类号： H01L21/67333 , H05K13/0084
摘要： A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein. The openings are grouped into a set of first openings remote from the peripheral portion and a set of second openings surrounding the first openings and adjacent to the peripheral portion. Guard strips are formed on the bottom side of the device-receiving portion and are disposed solely and respectively in the second openings.
摘要翻译：托盘适于在其中容纳多个球栅阵列器件，并且包括具有器件接收部分和围绕器件接收部分的周边部分的基板。装置接收部分具有形成有装置容纳凹部的顶侧。装置接收部分的顶侧还在装置容纳凹槽中形成有分隔单元，用于将装置容纳凹槽分成适于分别容纳球栅阵列装置的多个空腔。装置接收部还具有形成有多个开口的底侧。每个开口与相应的一个空腔对准，并且适于接收形成在球栅阵列器件的底侧上的球形触点阵列，其布置在其中的相应的一个空腔中。开口被分组成远离周边部分的一组第一开口和围绕第一开口并且邻近周边部分的一组第二开口。保护条形成在装置接收部分的底侧上，并且分别单独设置在第二开口中。

13. 发明申请

US20050111195A1 Heat dissipation mechanism for electronic apparatus 有权
标题翻译：电子设备散热机构
公开(公告)号：US20050111195A1
公开(公告)日：2005-05-26
申请号：US11056533
申请日：2005-02-11
申请人： Chung-Ju Wu
发明人： Chung-Ju Wu
IPC分类号： H01L23/433 , H05K5/00 , H05K7/20
CPC分类号： H05K7/20445 , H01L23/433 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.
摘要翻译：本公开提供了一种散热机构，其通过紧固在热装置和电子装置之间的金属片将热装置的发热传导到电子装置的壳体，然后通过在装置上打开的多个孔将热量散发到空气中贝壳。此外，所提出的机构也适用于微型尺寸的便携式电子设备来解决其散热技术。

14. 发明授权

US06882037B2 Die paddle for receiving an integrated circuit die in a plastic substrate 失效
标题翻译：用于在塑料基板中接收集成电路管芯的模板
公开(公告)号：US06882037B2
公开(公告)日：2005-04-19
申请号：US10213077
申请日：2002-08-07
申请人： Wei-Feng Lin , Wei-Chi Liu , Chung-Ju Wu
发明人： Wei-Feng Lin , Wei-Chi Liu , Chung-Ju Wu
IPC分类号： H01L21/58 , H01L23/498 , H01L23/48
CPC分类号： H01L24/83 , H01L23/49838 , H01L24/29 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.
摘要翻译：一种用于在塑料基板中接收集成电路管芯的裸片。模板由塑料基板上的铜膜限定，并且包括穿过塑料基板的多个通孔，穿过铜膜的多个开口以及形成在铜膜周边部分上的含金环。最外面的开口（和/或最外通孔）和含金环分开约1至约20密耳的距离。

15. 发明授权

US06765301B2 Integrated circuit bonding device and manufacturing method thereof 有权
标题翻译：集成电路接合装置及其制造方法
公开(公告)号：US06765301B2
公开(公告)日：2004-07-20
申请号：US10212106
申请日：2002-08-06
申请人： Chung-Ju Wu , Kuei-Chen Liang , Wei-Feng Lin
发明人： Chung-Ju Wu , Kuei-Chen Liang , Wei-Feng Lin
IPC分类号： H01L2348
CPC分类号： H01L23/49838 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/45147 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/05599
摘要： An integrated circuit device. The substrate includes a signal connection point and two shielding connection points set at the two sides of the signal connection point. The chip is set on the substrate. There are a signal pad and two shielding pads set at the two sides of the signal pad on the edge of the chip. The signal wire bonding is coupled to the signal connection point and the signal pad. Two shielding wire bondings are coupled to the shielding connection points and the shielding pads and extend along both sides of the signal wire bonding. The signal trace line is set on the substrate and coupled to the signal connection point. The power ring circuit is set on the substrate and coupled to the shielding connection points. The power circuit includes two shielding lines extending along both sides of the signal trace line.
摘要翻译：集成电路器件。基板包括设置在信号连接点两侧的信号连接点和两个屏蔽连接点。芯片设置在基板上。信号焊盘和两个屏蔽焊盘设置在芯片边缘的信号焊盘两侧。信号线接合耦合到信号连接点和信号焊盘。两个屏蔽线接合耦合到屏蔽连接点和屏蔽焊盘，并沿着信号线接合的两侧延伸。信号跟踪线设置在基板上并耦合到信号连接点。电源环电路设置在基板上并耦合到屏蔽连接点。电源电路包括沿着信号迹线的两侧延伸的两条屏蔽线。

16. 发明授权

US06524942B2 Bond pad structure and its method of fabricating 失效
公开(公告)号：US06524942B2
公开(公告)日：2003-02-25
申请号：US10056004
申请日：2002-01-28
申请人： Chen-Wen Tsai , Chung-Ju Wu , Wei-Feng Lin
发明人： Chen-Wen Tsai , Chung-Ju Wu , Wei-Feng Lin
IPC分类号： H01L2144
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05001 , H01L2224/05083 , H01L2224/05093 , H01L2224/05095 , H01L2224/05096 , H01L2224/05554 , H01L2224/05555 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48724 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs. Due to special disposition of via plugs and well adhesion between metal layer and diffusion barrier layers, the bond pad structure, according to the invention, can prevent form damage possibly induced during subsequent probe test procedure and wire bonding process.

17. 发明申请

US20130095885A1 HANDHELD ELECTRONIC APPARATUS 有权
标题翻译：手持电子设备
公开(公告)号：US20130095885A1
公开(公告)日：2013-04-18
申请号：US13585840
申请日：2012-08-15
申请人： Cheng-Hsi Liu , Pi-Lin Lo , Jih-Jonq Shiue , Chung-Ju Wu
发明人： Cheng-Hsi Liu , Pi-Lin Lo , Jih-Jonq Shiue , Chung-Ju Wu
IPC分类号： H04W88/02
CPC分类号： H04M1/72519 , G06F1/1626 , G06F1/1637 , G06F1/169 , G06F3/04886 , G06F2203/0339 , H04M1/22 , H04M2250/22
摘要： A handheld electronic apparatus including a casing, a cover, a motherboard, an in-cell touch display module, a light guide member, and a touch module is provided. The cover covers a casing opening, and constitutes an accommodation space with the casing. The cover has a first area and a second area having a light transmissive icon. The motherboard is electrically connected with the in-cell touch display module and the touch module. The in-cell touch display module has a display area disposed beneath the first area. The light guide member is disposed within the accommodation space, and capable of guiding a light generated from a light emitting element to the light transmissive icon. The light guide member has a sheet-shaped portion disposed beneath the second area by corresponding to the light transmissive icon. The touch module is disposed within the accommodation space and beneath the second area.
摘要翻译：提供了一种手持电子设备，包括壳体，盖子，主板，单元内触摸显示模块，导光构件和触摸模块。盖罩盖壳体开口，并与壳体构成容纳空间。盖具有第一区域和具有透光图标的第二区域。主板与单元内触摸显示模块和触摸模块电连接。单元内触摸显示模块具有设置在第一区域下方的显示区域。导光构件设置在容纳空间内，并且能够将从发光元件产生的光引导到透光图标。导光构件具有通过对应于透光图标而设置在第二区域下方的片状部分。触摸模块设置在容纳空间内并在第二区域下方。

18. 发明申请

US20070277997A1 SUBSTRATE AND LAYOUT METHOD 审中-公开
标题翻译：基板和布局方法
公开(公告)号：US20070277997A1
公开(公告)日：2007-12-06
申请号：US11421481
申请日：2006-06-01
申请人： Wei-An Liang , Chung-Ju Wu , Yin-Chieh Hsueh
发明人： Wei-An Liang , Chung-Ju Wu , Yin-Chieh Hsueh
IPC分类号： H05K1/03
CPC分类号： H05K1/0216 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/3011 , H05K1/0298 , H05K3/242 , H05K3/429 , H05K2201/0792 , H05K2201/09236 , H05K2201/093 , H05K2201/0969 , Y10T29/49155 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Layout methods for a substrate are disclosed. In one embodiment, the method includes: defining a first plating line on a non-conducting layer coupled to a first pad; and defining a second plating line on the first conducting layer coupled to a second pad. Along a direction away from the first pad and the second pad, a distance between the first plating line and the second plating line becomes longer. In another embodiment, the method includes: defining a plating line on a non-conducting layer, the plating line being coupled to a pad; and replacing a portion of at least a conducting layer with a non-conducting material, wherein the portion is directly under the plating line.
摘要翻译：公开了一种用于衬底的布局方法。在一个实施例中，该方法包括：在耦合到第一焊盘的非导电层上限定第一电镀线; 以及在耦合到第二焊盘的所述第一导电层上限定第二电镀线。沿着远离第一焊盘和第二焊盘的方向，第一电镀线和第二镀覆线之间的距离变长。在另一个实施例中，该方法包括：在非导电层上限定电镀线，电镀线耦合到焊盘; 以及用非导电材料代替至少导电层的一部分，其中该部分直接在电镀线下方。

19. 发明授权

US07209354B2 Ball grid array package with heat sink device 有权
标题翻译：具有散热装置的球栅阵列封装
公开(公告)号：US07209354B2
公开(公告)日：2007-04-24
申请号：US10724891
申请日：2003-12-02
申请人： Chung-Ju Wu , Wei-Feng Lin
发明人： Chung-Ju Wu , Wei-Feng Lin
IPC分类号： H05K7/20 , H01L23/36 , H05K1/18
CPC分类号： H01L23/4093 , H01L2924/15311 , H01L2924/16152
摘要： The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating structure, a second heat dissipating structure positioned above first the heat dissipating structure, at least two thermal supports on the backside of the first heat sink assembly and a thermal block on the backside of the first heat sink assembly. The second heat sink assembly has a protruding structure and at least the openings. The first heat sink assembly is fixed with the second heat sink assembly to form a heat sink device by the combination of the thermal supports and the openings. The first heat sink assembly and the second heat sink assembly are attached to the integrated circuit device separately by the thermal block and the protruding structure. This heat sink device provides several heat dissipating pathes by the second heat dissipating structure, the thermal supports, the thermal block, and protruding structure. Therefore, the heat dissipation efficiency of the heat sink device is improved.
摘要翻译：本发明提供了一种用于封装装置的散热装置，以提高散热效率。散热器装置包括第一散热器组件和第二散热器组件。第一散热器组件具有第一散热结构，位于第一散热结构之上的第二散热结构，在第一散热器组件的背面上的至少两个热支撑件和位于第一散热构件的背面的热块水槽组件。第二散热器组件具有突出结构并且至少具有开口。第一散热器组件与第二散热器组件固定以通过热支撑件和开口的组合形成散热装置。第一散热器组件和第二散热器组件通过热块和突出结构分别附接到集成电路设备。该散热装置通过第二散热结构，热支撑件，热块和突出结构提供多个散热孔。因此，散热器件的散热效率提高。

20. 发明申请

US20050093135A1 Thermal dissipating element of a chip 审中-公开
标题翻译：芯片的散热元件
公开(公告)号：US20050093135A1
公开(公告)日：2005-05-05
申请号：US10697099
申请日：2003-10-31
申请人： Wei-Chi Liu , Wei-Feng Lin , Chung-Ju Wu
发明人： Wei-Chi Liu , Wei-Feng Lin , Chung-Ju Wu
IPC分类号： H01L23/433 , H01L23/10 , H01L23/34
CPC分类号： H01L23/4334 , H01L2224/32245 , H01L2924/16152 , H01L2924/1815
摘要： The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a top plate and a side plate, wherein the top plate curves and extends to be the side plate. The top plate includes a sink contacting with the chip.
摘要翻译：本发明涉及一种芯片的散热元件，用于散发通过操作芯片产生的热量。散热元件包括顶板和侧板，其中顶板弯曲并延伸成侧板。顶板包括与芯片接触的接收器。

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