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    • 12. 发明授权
    • Nonvolatile memory cell and operating method
    • 非易失性存储单元和操作方法
    • US07057938B2
    • 2006-06-06
    • US10756777
    • 2004-01-14
    • Chih Chieh YehHung Yueh ChenYi Ying LiaoWen Jer TsaiTao Cheng Lu
    • Chih Chieh YehHung Yueh ChenYi Ying LiaoWen Jer TsaiTao Cheng Lu
    • G11C16/00
    • G11C16/10G11C16/0475H01L21/28282H01L29/66833H01L29/792H01L29/7923
    • One embodiment of the present invention provides a system having a nonvolatile memory comprising a p type semiconductor substrate, an oxide layer over the p type semiconductor substrate, a nitride layer over the oxide layer, an additional oxide layer over the nitride layer, a gate over the additional oxide layer, two N+ junctions in the p type semiconductor layer, a source and drain respectively formed in the two N+ junctions, a first bit and a second bit in the nonvolatile memory, and accordingly at least two states of operation (i.e., erase and program) therefor. That is, one bit in the nonvolatile memory can either be in an erase state or program state. For erasing a bit, electrons are injected at the gate of the nonvolatile memory. For programming a bit, electric holes are injected or electrons are reduced for that bit. The present invention also provides a method for sensing and reading at least one bit in a nonvolatile memory comprising applying a bias voltage to the memory, detecting a threshold voltage or read current, comparing the threshold voltage with a reference voltage or comparing the read current with a reference current, and identifying the at least one bit as erased or programmed.
    • 本发明的一个实施例提供一种具有非易失性存储器的系统,其包括ap型半导体衬底,p型半导体衬底上的氧化物层,氧化物层上方的氮化物层,氮化物层上的附加氧化物层, 分别形成在两个N +结中的源极和漏极,非易失性存储器中的第一位和第二位,以及相应地至少两个操作状态(即擦除)的附加氧化物层,p型半导体层中的两个N +结, 和程序)。 也就是说,非易失性存储器中的一位可以处于擦除状态或程序状态。 为了擦除一点,电子注入非易失性存储器的栅极。 为了编程一点,注入电孔或减少电子的位。 本发明还提供了一种用于感测和读取非易失性存储器中的至少一个位的方法,包括向存储器施加偏置电压,检测阈值电压或读取电流,将阈值电压与参考电压进行比较,或将读取的电流与 参考电流,并将所述至少一个位识别为擦除或编程。
    • 14. 发明申请
    • Recessed shallow trench isolation
    • 凹槽浅沟隔离
    • US20070087523A1
    • 2007-04-19
    • US11249228
    • 2005-10-13
    • Chih Chieh YehWen Jer Tsai
    • Chih Chieh YehWen Jer Tsai
    • H01L21/76
    • H01L21/76229G11C16/10H01L27/105H01L27/115H01L27/11568H01L27/11573
    • In some embodiments, a memory integrated circuit has different shallow trench isolation structures in the memory circuitry of the memory integrated circuit and the control circuitry of the memory integrated circuit. The isolation dielectric fills the trenches of the shallow trench isolation structures to different degrees. In some embodiments, a memory integrated circuit has memory circuitry with shallow trench isolation structures and intermediate regions. The memory circuitry supports a channel between neighboring nonvolatile memory devices supporting multiple current components with different orientations. In some embodiments, recessed shallow trench isolation structures are formed.
    • 在一些实施例中,存储器集成电路在存储器集成电路的存储器电路和存储器集成电路的控制电路中具有不同的浅沟槽隔离结构。 隔离电介质以不同的程度填充浅沟槽隔离结构的沟槽。 在一些实施例中,存储器集成电路具有具有浅沟槽隔离结构和中间区域的存储器电路。 存储器电路支持在支持具有不同取向的多个电流分量的相邻非易失性存储器件之间的通道。 在一些实施例中,形成凹陷的浅沟槽隔离结构。
    • 18. 发明授权
    • Recessed shallow trench isolation
    • 凹槽浅沟隔离
    • US07514742B2
    • 2009-04-07
    • US11249228
    • 2005-10-13
    • Chih Chieh YehWen Jer Tsai
    • Chih Chieh YehWen Jer Tsai
    • H01L27/108
    • H01L21/76229G11C16/10H01L27/105H01L27/115H01L27/11568H01L27/11573
    • In some embodiments, a memory integrated circuit has different shallow trench isolation structures in the memory circuitry of the memory integrated circuit and the control circuitry of the memory integrated circuit. The isolation dielectric fills the trenches of the shallow trench isolation structures to different degrees.In some embodiments, a memory integrated circuit has memory circuitry with shallow trench isolation structures and intermediate regions. The memory circuitry supports a channel between neighboring nonvolatile memory devices supporting multiple current components with different orientations.In some embodiments, recessed shallow trench isolation structures are formed.
    • 在一些实施例中,存储器集成电路在存储器集成电路的存储器电路和存储器集成电路的控制电路中具有不同的浅沟槽隔离结构。 隔离电介质以不同的程度填充浅沟槽隔离结构的沟槽。 在一些实施例中,存储器集成电路具有具有浅沟槽隔离结构和中间区域的存储器电路。 存储器电路支持在支持具有不同取向的多个电流分量的相邻非易失性存储器件之间的通道。 在一些实施例中,形成凹陷的浅沟槽隔离结构。
    • 19. 发明申请
    • Gated Diode Nonvolatile Memory Cell Array
    • 门极二极管非易失性存储单元阵列
    • US20090080254A1
    • 2009-03-26
    • US12326706
    • 2008-12-02
    • Yi Ying LiaoWen Jer TsaiChih Chieh Yeh
    • Yi Ying LiaoWen Jer TsaiChih Chieh Yeh
    • G11C16/02G11C11/36
    • G11C11/36B82Y10/00G11C16/02G11C2216/06H01L27/1021H01L29/8616
    • A memory integrated circuit has memory arrays that are vertically layered. These memory arrays include word lines and bit lines. Intersections between the word lines and the bit lines include a diode and a memory state storage element. The diode and the memory storage element are connected in between a word line and a bit line. The diode at the intersections includes a first diode node and a second diode node. Various aspects of the memory integrated circuit are electrically interconnected in various ways, such as corresponding word lines, corresponding first diode nodes, or corresponding second diode nodes of different memory arrays being electrically interconnected. Various aspects of the memory integrated circuit are isolated in various ways, such as word lines, first diode nodes, or second diode nodes of different memory arrays being isolated.
    • 存储器集成电路具有垂直分层的存储器阵列。 这些存储器阵列包括字线和位线。 字线和位线之间的交点包括二极管和存储器状态存储元件。 二极管和存储器存储元件连接在字线和位线之间。 交叉处的二极管包括第一二极管节点和第二二极管节点。 存储器集成电路的各个方面以各种方式电互连,例如相应的字线,对应的第一二极管节点或不同存储器阵列的相应的第二二极管节点电互连。 存储器集成电路的各个方面以各种方式隔离,例如隔离不同存储器阵列的字线,第一二极管节点或第二二极管节点。
    • 20. 发明授权
    • Operation methods for a non-volatile memory cell in an array
    • 阵列中非易失性存储单元的操作方法
    • US07272043B2
    • 2007-09-18
    • US11020269
    • 2004-12-27
    • Yi Ying LiaoChih Chieh YehWen Jer Tsai
    • Yi Ying LiaoChih Chieh YehWen Jer Tsai
    • G11C11/34G11C16/06
    • G11C11/5671G11C16/0475G11C16/0483
    • A method of reducing gate disturb in a charge-trapping layer memory cell by applying different Vpass voltages to different sides of a selected wordline. A higher Vpass voltage is used to pass higher source/drain voltage and a lower Vpass voltage is used to pass a lower source/drain voltage. By controlling the Vpass voltages on different sides of a selected wordline, it is possible to reduce a vertical field that is established in a gate region when the Vpass voltages are applied. A reduced vertical field results in suppressed gate disturb. The method also includes a novel bit-line biasing scheme that may further reduce the vertical field and thereby may further suppress gate disturb, particularly in an array of memory cells.
    • 一种通过在选定字线的不同侧面施加不同的Vpass电压来减少电荷俘获层存储单元中的门扰动的方法。 较高的Vpass电压用于传递较高的源极/漏极电压,较低的Vpass电压用于通过较低的源极/漏极电压。 通过控制所选字线的不同侧的Vpass电压,可以减小施加Vpass电压时在栅极区域中建立的垂直场。 减小的垂直场导致抑制的门扰动。 该方法还包括新颖的位线偏置方案,其可以进一步减小垂直场,从而可进一步抑制门扰动,特别是在存储器单元阵列中。