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11. 发明申请

US20070038865A1 TAMPER-PROOF CAPS FOR LARGE ASSEMBLY 失效
标题翻译：用于大型组装的防篡改剂
公开(公告)号：US20070038865A1
公开(公告)日：2007-02-15
申请号：US11460329
申请日：2006-07-27
申请人： Stefano Oggioni , Vincenzo Condorelli , Nihad Hadzic
发明人： Stefano Oggioni , Vincenzo Condorelli , Nihad Hadzic
IPC分类号： H04L9/00
CPC分类号： G06F21/87 , H01L23/576 , H01L2224/16225 , H01L2924/15156 , H01L2924/3025 , H05K1/0275 , H05K1/141 , H05K2201/0715 , H05K2201/10151 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49172 , Y10T29/49174
摘要： A tamper-proof cap adapted to be mounted on a large assembly for shielding a selected area of the large assembly is disclosed. The tamper-proof cap comprises a laminate stack-up structure wherein at least one open chamber is formed. The stack-up structure comprises at least two layers wherein tamper-proof layers are formed on top of the open chamber. A plurality of vias are disposed around the open chamber, forming with said tamper proof layers a tamper-proof structure around said open chamber. The vias are adapted for connecting the tamper-proof layers to the large assembly when the tamper-proof cap is mounted. In a preferred embodiment, the tamper-proof cap further comprises a shielding layer on top of the tamper-proof layer that are preferably done using conductive ink.
摘要翻译：公开了一种适于安装在大型组件上用于屏蔽大组件的选定区域的防篡改盖。防破坏盖包括层压叠层结构，其中形成至少一个开放室。堆叠结构包括至少两层，其中在敞开室的顶部上形成防篡改层。多个通孔设置在开放室周围，与所述防篡改层一起形成围绕所述开放室的防篡改结构。当安装防盗盖时，通孔适于将防篡改层连接到大组件。在优选实施例中，防篡改帽还包括防篡改层顶部的屏蔽层，其优选地使用导电油墨进行。

12. 发明申请

US20060288574A1 COAXIAL VIA STRUCTURE FOR OPTIMIZING SIGNAL TRANSMISSION IN MULTIPLE LAYER ELECTRONIC DEVICE CARRIERS 失效
标题翻译：同轴通过多层电子设备载波优化信号传输的结构
公开(公告)号：US20060288574A1
公开(公告)日：2006-12-28
申请号：US11458727
申请日：2006-07-20
申请人： Stefano Oggioni , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
发明人： Stefano Oggioni , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
IPC分类号： H01K3/10
CPC分类号： H01L23/66 , H01L2924/0002 , H01L2924/3011 , H01P1/047 , H01P3/06 , H05K1/0222 , H05K1/0251 , H05K1/115 , H05K3/429 , H05K3/4602 , H05K2201/09618 , H05K2201/09627 , H05K2201/09809 , Y10T29/49117 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.
摘要翻译：同轴通孔结构适于通过电子设备载体的导电层传输高速信号或高强度电流。同轴通孔结构包括中心导电轨道和由电介质材料隔开的外部导电轨道，并且位于电子设备载体的芯部或电子设备的整个厚度中。同轴通孔结构可以与堆叠的通孔结构组合，以便当制造过程限制整个电子设备载体上完整的同轴通孔结构的创建时，允许跨越电子设备载体的高速信号的有效传输。

13. 发明申请

US20060011712A1 IMPROVED DECAL SOLDER TRANSFER METHOD 审中-公开
标题翻译：改进的分解焊接转移方法
公开(公告)号：US20060011712A1
公开(公告)日：2006-01-19
申请号：US11160887
申请日：2005-07-14
申请人： Stefano Oggioni
发明人： Stefano Oggioni
IPC分类号： B23K31/02 , B23K35/12
CPC分类号： H01L21/6835 , B23K3/0623 , B23K2101/40 , B81C1/0038 , B81C2201/0197 , B81C2203/035 , H01L24/11 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method is provided for forming alloy deposits at selected areas on a receiving substrate, including providing a decal alloy carrier, having alloy loadable areas in selected positions thereof, the alloy loadable areas being adapted to being loaded with an alloy mass, mating the decal alloy carrier with the receiving substrate, so that the alloy loadable areas substantially correspond to the selected areas on the receiving substrate, and reflowing the solder alloy masses so as to cause transfer of the alloy from the alloy loadable areas to selected areas on the receiving substrate, such as solder-affine pads, while ensuring that the decal alloy carrier and the receiving substrate are kept in close contact one to another at least during the reflowing. The alloy loadable areas are preferrably recesses in the decal alloy carrier having flat bottoms, which results in relaxed alignment tolerances.
摘要翻译：提供了一种用于在接收基板上的选定区域形成合金沉积物的方法，包括提供具有在其选定位置的合金可加载区域的贴花合金载体，合金可装载区域适于装载合金块，将该贴花合金载体与接收基板接合，使得合金可加载区域基本上对应于接收基板上的选定区域，并且回流焊料合金块，以使合金从合金可加载区域转移到接收基板上的选定区域，例如焊锡焊盘，同时确保贴合合金载体和接收基板至少在回流期间彼此保持紧密接触。合金可加载区域在具有平坦底部的贴花合金载体中优选为凹陷，这导致松弛的对准公差。

14. 发明申请

US20050167811A1 MODULE POWER DISTRIBUTION NETWORK 失效
标题翻译：模块电力分配网络
公开(公告)号：US20050167811A1
公开(公告)日：2005-08-04
申请号：US10906152
申请日：2005-02-04
申请人： Roland Frech , Bernd Garben , Erich Klink , Stefano Oggioni
发明人： Roland Frech , Bernd Garben , Erich Klink , Stefano Oggioni
IPC分类号： H01L23/12 , H01L23/498 , H05K1/00 , H05K1/02 , H01L23/495
CPC分类号： H05K1/0216 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/09701 , H01L2924/15192 , H01L2924/19105 , H01L2924/3011 , H05K1/0231 , H05K1/0298 , H05K2201/09327 , H05K2201/10522 , H05K2201/10734
摘要： A multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, a plurality of electrically insulative layers, and a plurality of electrically conductive layers disposed between the insulative layers. The electrically conductive layers form staggered placements of at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between, and signal distribution layers comprising signal conductors. Vias form conductive paths through the insulative layers and conductive layers; the corresponding signal, voltage and ground distribution layers are electrically connected with each other and with the uppermost layer.
摘要翻译：用于封装电子部件的多层模块包括用于安装部件的最上层的导电层，多个电绝缘层以及设置在绝缘层之间的多个导电层。导电层在靠近模块表面的至少三个电压和/或接地分布层之间形成交错布置，而其间不包括信号布线层，以及包括信号导体的信号分布层。通孔形成穿过绝缘层和导电层的导电路径; 相应的信号，电压和地面分布层彼此电连接并与最上层电连接。

15. 发明申请

US20080036598A1 TAMPER-PROOF STRUCTURES FOR PROTECTIG ELECTRONIC MODULES 失效
标题翻译：用于防护电子模块的防篡改结构
公开(公告)号：US20080036598A1
公开(公告)日：2008-02-14
申请号：US11680120
申请日：2007-02-28
申请人： Stefano Oggioni
发明人： Stefano Oggioni
IPC分类号： G08B13/14
CPC分类号： G06F21/87 , H05K1/0275 , H05K2201/10151 , Y10T29/49155 , Y10T29/4916
摘要： A tamper-proof structure for protecting an electronic module, comprising a pattern of signal lines having a highly unpredictable layout, which is an approximation of a space-filling curve obtained by the replication of at least one elementary space element having an inscribed base curve inscribed therein. The base curve is adapted, by replication of the elementary space element, to generate an approximation of an at least two-dimensional space-filling curve, the replication being such that an end of the base curve in one elementary space element is connected to the end of the base curve in another, adjacent elementary space element of the replication.
摘要翻译：一种用于保护电子模块的防篡改结构，包括具有高度不可预测的布局的信号线图案，其是通过复制具有内切基础曲线的内插的至少一个基本空间元件而获得的空间填充曲线的近似值其中。基本曲线通过基本空间元素的复制来适应以产生至少二维空间填充曲线的近似，该复制使得一个基本空间元素中的基本曲线的一端连接到基本曲线的末端在复制的另一个相邻的基本空间元素中。

16. 发明申请

US20080032520A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20080032520A1
公开(公告)日：2008-02-07
申请号：US11865305
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/16
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

17. 发明申请

US20080023845A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20080023845A1
公开(公告)日：2008-01-31
申请号：US11865395
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01L23/48
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

18. 发明申请

US20080020603A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 失效
公开(公告)号：US20080020603A1
公开(公告)日：2008-01-24
申请号：US11865321
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/22
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

19. 发明申请

US20080020596A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
标题翻译：土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何
公开(公告)号：US20080020596A1
公开(公告)日：2008-01-24
申请号：US11865231
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

20. 发明授权

US07319197B2 Structure of stacked vias in multiple layer electrode device carriers 有权
标题翻译：多层电极器件载体中堆叠通孔的结构
公开(公告)号：US07319197B2
公开(公告)日：2008-01-15
申请号：US10515511
申请日：2003-04-18
申请人： Stefano Oggioni , Michele Castriotta , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
发明人： Stefano Oggioni , Michele Castriotta , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/0251 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/15173 , H01L2924/3011 , H05K1/112 , H05K1/115 , H05K1/116 , H05K3/4602 , H05K2201/09236 , H05K2201/09381 , H05K2201/09536 , H05K2201/096 , H05K2201/0979 , H01L2924/00
摘要： A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.
摘要翻译：公开了一种适于通过电子设备载体的导电层传输高频信号或高强度电流的堆叠通孔结构（200）。叠置的通孔结构包括属于由电介质层（120）分开的根据z轴对准的三个相邻导电层（110a，110b，110c）的至少三个导电轨道（205a，205b，205c）。这些导电轨道之间的连接通过在每个导电层之间的至少两个通孔（210,215）进行。连接到导电轨道的一侧的通孔布置成使得它们不与根据z轴连接到另一侧的那些对准。

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