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    • 13. 发明授权
    • Method of manufacturing a thin dielectric layer using a heat treatment and a semiconductor device formed using the method
    • 使用热处理制造薄介电层的方法和使用该方法形成的半导体器件
    • US07041557B2
    • 2006-05-09
    • US10832952
    • 2004-04-27
    • Sung-Taeg KangJeong-Uk HanSung-Woo ParkSeung-Beom YoonJi-Hoon ParkBo-Young Seo
    • Sung-Taeg KangJeong-Uk HanSung-Woo ParkSeung-Beom YoonJi-Hoon ParkBo-Young Seo
    • H01L21/366
    • H01L21/0214H01L21/02249H01L21/02252H01L21/28273H01L21/3144
    • In a method for forming a semiconductor device and a semiconductor device formed in accordance with the method, a thin dielectric layer is provided between a lower conductive layer and an upper conductive layer. In one embodiment, the thin dielectric layer comprises an inter-gate dielectric layer, the lower conductive layer comprises a floating gate and the upper dielectric layer comprises a control gate of a transistor, for example, a non-volatile memory cell transistor. The thin dielectric layer is formed using a heat treating process that results in reduction of surface roughness of the underlying floating gate, and results in a thin silicon oxy-nitride layer being formed on the floating gate. In this manner, the thin dielectric layer provides for increased capacitive coupling between the lower floating gate and the upper control gate. This also leads to a lowered programming voltage, erasing voltage and read voltage for the transistor, while maintaining the threshold voltage in a desired range. In addition, the size of the transistor and resulting storage cell can be minimized and the need for a high-voltage region in the circuit is mitigated, since, assuming a lowered programming voltage, pumping circuitry is not required.
    • 在根据该方法形成的半导体器件和半导体器件的形成方法中,在下导电层和上导电层之间设置有薄的电介质层。 在一个实施例中,薄介电层包括栅极间电介质层,下导电层包括浮动栅极,上介电层包括晶体管的控制栅极,例如非易失性存储单元晶体管。 使用导致下面的浮置栅极的表面粗糙度降低的热处理工艺形成薄介电层,并且导致在浮动栅极上形成薄的氧氮化硅层。 以这种方式,薄介电层提供在下浮动栅极和上控制栅极之间增加的电容耦合。 这也导致降低的编程电压,擦除晶体管的电压和读取电压,同时将阈值电压保持在期望的范围内。 此外,晶体管和所得到的存储单元的尺寸可以被最小化,并且减轻了对电路中的高电压区域的需要,因为假设降低的编程电压,不需要泵浦电路。
    • 18. 发明授权
    • Nonvolatile memory devices and methods of fabricating the same
    • 非易失性存储器件及其制造方法
    • US07553725B2
    • 2009-06-30
    • US11488911
    • 2006-07-18
    • Hee-Seog JeonJeong-Uk HanChang-Hun LeeSung-Taeg KangBo-Young SeoHyok-Ki Kwon
    • Hee-Seog JeonJeong-Uk HanChang-Hun LeeSung-Taeg KangBo-Young SeoHyok-Ki Kwon
    • H01L21/336
    • H01L27/11524G11C16/0433H01L21/28273H01L27/115H01L27/11521H01L29/66825
    • A nonvolatile memory cell includes a source region and a drain region which are disposed in a semiconductor substrate and spaced apart from each other, a source selection line and a drain selection line disposed over the semiconductor substrate between the source region and the drain region. The source selection line and the drain selection line are disposed adjacent to the source region and the drain region, respectively. The nonvolatile memory cell further includes a cell gate pattern disposed over the semiconductor substrate between the source selection line and the drain selection line, a first floating impurity region provided in the semiconductor substrate under a gap region between the source selection line and the cell gate pattern and a second floating impurity region provided in the semiconductor substrate under a gap region between the drain selection line and the cell gate pattern. Distances between the cell gate pattern and the selection lines are less than widths of the selection lines.
    • 非易失性存储单元包括设置在半导体衬底中并彼此间隔开的源极区和漏极区,设置在源极区和漏极区之间的半导体衬底上的源极选择线和漏极选择线。 源极选择线和漏极选择线分别设置在源极区域和漏极区域附近。 非易失性存储单元还包括设置在源极选择线和漏极选择线之间的半导体衬底之上的单元栅极图案,设置在源极选择线和单元栅极图案之间的间隙区域的半导体衬底中的第一浮动杂质区域 以及在所述漏极选择线和所述单元栅极图案之间的间隙区域处设置在所述半导体衬底中的第二浮置杂质区域。 单元栅极图案和选择线之间的距离小于选择线的宽度。