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131. 发明授权

US07462941B2 Power grid layout techniques on integrated circuits 有权
标题翻译：集成电路电网布局技术
公开(公告)号：US07462941B2
公开(公告)日：2008-12-09
申请号：US11237304
申请日：2005-09-27
申请人： John Campbell , Kim R. Stevens , Luigi DiGregorio
发明人： John Campbell , Kim R. Stevens , Luigi DiGregorio
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： Techniques are provided for reducing the power supply voltage drop introduced by routing conductive traces on an integrated circuit. Techniques for reducing variations in the power supply voltages received in different regions of an integrated circuit are also provided. Power supply voltages are routed within an integrated circuit across conductive traces. The conductive traces are coupled to solder bumps that receive power supply voltages from an external source. Alternate ones of the traces receive a high power supply voltage VDD and a low power supply voltage VSS. The conductive traces reduce the voltage drop in the power supply voltages by providing shorter paths to route the power supply voltages to circuit elements on the integrated circuit.
摘要翻译：提供了用于减少通过在集成电路上布线导电迹线引入的电源电压降的技术。还提供了用于减少在集成电路的不同区域中接收的电源电压的变化的技术。电源电压在集成电路内跨导线。导电迹线耦合到从外部源接收电源电压的焊料凸块。迹线中的另一个接收高电源电压VDD和低电源电压VSS。导电迹线通过提供较短的路径将电源电压路由到集成电路上的电路元件来减小电源电压中的电压降。

132. 发明申请

US20070175163A1 Landscape timber connector 审中-公开
标题翻译：风景木材连接器
公开(公告)号：US20070175163A1
公开(公告)日：2007-08-02
申请号：US11715036
申请日：2007-03-07
申请人： Lynn Williams , John Campbell , Franklin Campbell
发明人： Lynn Williams , John Campbell , Franklin Campbell
IPC分类号： E04C2/38
CPC分类号： E04H4/00 , A01G9/28 , E04B2/702 , E04B2001/266
摘要： A landscape timber connector includes first and second halves adapted for arrangement in an open timber-receiving position and a closed timber-surrounding position. In the closed position, the first and second halves cooperate to form a housing having a top, bottom, sides, and first and second ends. Mating elements cooperate to lock the halves in the closed position.
摘要翻译：风景木材连接器包括适于布置在开放木材接收位置和闭合的木材周围位置的第一和第二半部。在关闭位置，第一和第二半部配合形成具有顶部，底部，侧面以及第一和第二端部的壳体。配合元件配合以将半部锁定在关闭位置。

133. 发明授权

US07216691B2 Mold-removal casting method and apparatus 有权
标题翻译：脱模铸造方法和装置
公开(公告)号：US07216691B2
公开(公告)日：2007-05-15
申请号：US10614601
申请日：2003-07-07
申请人： John R. Grassi , John Campbell , George W. Kuhlman
发明人： John R. Grassi , John Campbell , George W. Kuhlman
IPC分类号： B22D29/00 , B22C9/02
CPC分类号： B22D30/00 , B22D29/00
摘要： A process for the casting of metals includes the steps of providing a mold, delivering a molten metal into the mold, solidifying the molten metal, and removing at least a portion of the mold. The step of removing at least a portion of the mold begins before the step of solidifying the molten metal has been finished. An apparatus to deliver a solvent to a mold is also provided.
摘要翻译：用于铸造金属的方法包括以下步骤：提供模具，将熔融金属输送到模具中，固化熔融金属，以及去除模具的至少一部分。在熔融金属的凝固步骤已经完成之前，除去模具的至少一部分的步骤开始。还提供了将溶剂输送到模具的装置。

134. 发明申请

US20070061699A1 Named object view of electronic data report 审中-公开
标题翻译：电子数据报告的命名对象视图
公开(公告)号：US20070061699A1
公开(公告)日：2007-03-15
申请号：US11223541
申请日：2005-09-09
申请人： Daniel Battagin , Yariv Ben-Tovim , John Campbell , Boaz Chen , Eran Megiddo
发明人： Daniel Battagin , Yariv Ben-Tovim , John Campbell , Boaz Chen , Eran Megiddo
IPC分类号： G06F17/24
CPC分类号： G06F17/248
摘要： A named object view of a report is generated from an electronic data file. Objects in the file to be published are identified in the file. A named object view of the report associated with the file is generated by publishing the identified objects. A viewer at a client is presented with the named object view of the report such that the viewer's attention is focused on the published objects.
摘要翻译：从电子数据文件生成报告的命名对象视图。要发布的文件中的对象将在文件中标识。通过发布已识别的对象来生成与该文件关联的报告的命名对象视图。向客户端的查看器呈现报告的命名对象视图，使得观众的注意力集中在已发布的对象上。

135. 发明申请

US20070054358A1 Insertion sequence-free bacteria 有权
标题翻译：插入无序细菌
公开(公告)号：US20070054358A1
公开(公告)日：2007-03-08
申请号：US11400711
申请日：2006-04-07
申请人： Frederick Blattner , John Campbell , David Frisch , Guy Plunkett , Gyorgy Posfai
发明人： Frederick Blattner , John Campbell , David Frisch , Guy Plunkett , Gyorgy Posfai
IPC分类号： C12P21/06 , C07K14/195 , C12N1/21 , C12P19/34 , C07H21/04 , C12N15/74
CPC分类号： C12N1/20 , C07K14/245 , C12N1/08 , C12N15/70 , C12P19/34 , C12P21/02 , C12R1/19
摘要： A bacteria lacking genomic and non-genomic IS elements is provided. The bacteria may be more stable and useful for the production of amino acids, polypeptides, nucleic acids and other products.
摘要翻译：提供了缺乏基因组和非基因组IS元件的细菌。细菌可能更稳定并且可用于生产氨基酸，多肽，核酸和其它产物。

136. 发明授权

US07165600B2 Chemically bonded aggregate mold 有权
标题翻译：化学结合骨料模具
公开(公告)号：US07165600B2
公开(公告)日：2007-01-23
申请号：US10658919
申请日：2003-09-10
申请人： John R. Grassi , John Campbell , George W. Kuhlman
发明人： John R. Grassi , John Campbell , George W. Kuhlman
IPC分类号： B22C9/00
CPC分类号： B22C1/167 , B22C1/18 , B22D29/002
摘要： A mold for the casting of metals including an aggregate comprising a refractory particulate material and a soluble binder which provides for minimal heat transfer between the mold and the molten metal during filling. The aggregate preferably includes at least a proportion of particulate material having a heat diffusivity at least as low as silica sand to reduce the chilling effect of the mold. The mold is removed from the casting the action of a solvent, which simultaneously cools and solidifies the casting at a maximum rate. Processes for forming the mold and the casting of metals using the mold are also disclosed.
摘要翻译：一种用于铸造金属的模具，包括包含耐火颗粒材料和可溶性粘合剂的聚集体，其在填充期间提供模具和熔融金属之间的最小热传递。聚集体优选包括至少一定比例的具有至少与硅砂相同的热扩散率的颗粒材料，以降低模具的冷却效果。将模具从铸件中除去溶剂的作用，溶剂同时以最大速率冷却和固化铸件。还公开了用于形成模具和使用模具铸造金属的工艺。

137. 发明申请

US20070007000A1 Method of drilling an enlarged sidetracked well bore 有权
标题翻译：钻扩大侧钻孔的方法
公开(公告)号：US20070007000A1
公开(公告)日：2007-01-11
申请号：US11175565
申请日：2005-07-06
申请人： Charles Dewey , Praful Desai , John Campbell
发明人： Charles Dewey , Praful Desai , John Campbell
IPC分类号： E21B29/10
CPC分类号： E21B10/62 , E21B7/061
摘要： A method of milling a window through a casing in a primary well bore and drilling an enlarged sidetracked well bore comprises running into the primary well bore a drilling assembly comprising at least one cutting apparatus adapted to drill an enlarged borehole, milling a window through the casing, and drilling the enlarged sidetracked well bore, wherein the milling and drilling steps are performed in one trip into the primary well bore. A drilling assembly comprises at least one cutting apparatus operable to drill an enlarged borehole, wherein the drilling assembly is operable to mill a window through a casing in a primary well bore and drill an enlarged sidetracked well bore through the window in one trip into the primary well bore.
摘要翻译：通过在主井眼中的壳体铣削窗口并钻出扩大的侧向钻井孔的方法包括进入主井孔中的钻井组件，该钻井组件包括适于钻扩大钻孔的至少一个切割装置，通过壳体铣削窗口，并钻出扩大的侧钻孔，其中铣削和钻削步骤在一次进入主井眼中进行。钻井组件包括至少一个可操作以钻取扩大钻孔的切割装置，其中所述钻井组件可操作以通过主井眼中的壳体研磨窗口，并且将一个扩大的侧向钻井孔穿过所述窗口，一次进入所述主井眼井眼。

138. 发明申请

US20060275952A1 Method for making electronic devices 审中-公开
标题翻译：制造电子设备的方法
公开(公告)号：US20060275952A1
公开(公告)日：2006-12-07
申请号：US11146838
申请日：2005-06-07
申请人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
发明人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/4871 , H01L23/3737 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12044 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
摘要翻译：公开了用于形成电子装置的方法，该电子装置包括同时用作底部填充材料的材料以及热界面材料。此处还给出了包括散热元件，半导体芯片，基板和导热材料的电子组件，其中导热材料同时用作底部填充材料以及热界面材料。

139. 发明申请

US20060275608A1 B-stageable film, electronic device, and associated process 审中-公开
标题翻译： B级电影，电子设备和相关过程
公开(公告)号：US20060275608A1
公开(公告)日：2006-12-07
申请号：US11147061
申请日：2005-06-07
申请人： Sandeep Tonapi , John Campbell , Ryan Mills , Jian Zhang , Stephen Latham
发明人： Sandeep Tonapi , John Campbell , Ryan Mills , Jian Zhang , Stephen Latham
IPC分类号： B32B27/38 , C08L63/00 , H01L21/00
CPC分类号： H01L23/3737 , C09J7/10 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , Y10T428/31511 , H01L2924/00
摘要： A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.
摘要翻译：提供了包括热界面材料的可B阶段的膜。该膜可以将发热装置固定到散热部件，可以进一步交联，并且可以将热能从发热装置传导到散热部件。提供了制造和使用该膜的方法，以及包含该膜的装置。

140. 发明申请

US20060192280A1 Method of forming electronic devices 审中-公开
标题翻译：电子器件形成方法
公开(公告)号：US20060192280A1
公开(公告)日：2006-08-31
申请号：US11068376
申请日：2005-02-28
申请人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
发明人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/00
摘要： A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
摘要翻译：描述了形成聚合物增强焊料凸起的装置或基底的方法。该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构，所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。

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