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1. 发明申请

US20060192280A1 Method of forming electronic devices 审中-公开
标题翻译：电子器件形成方法
公开(公告)号：US20060192280A1
公开(公告)日：2006-08-31
申请号：US11068376
申请日：2005-02-28
申请人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
发明人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/00
摘要： A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
摘要翻译：描述了形成聚合物增强焊料凸起的装置或基底的方法。该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构，所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。

2. 发明申请

US20050049350A1 Thin bond-line silicone adhesive composition and method for preparing the same 审中-公开
标题翻译：薄粘合线硅胶组合物及其制备方法
公开(公告)号：US20050049350A1
公开(公告)日：2005-03-03
申请号：US10647680
申请日：2003-08-25
申请人： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
发明人： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
IPC分类号： C08L83/04 , C09J183/04 , H01L23/373 , H01L23/42 , C08K3/00
CPC分类号： C09J183/04 , C08G77/045 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K2201/005 , C08L83/04 , H01L23/3737 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/12044 , H01L2924/3011 , C08L83/00 , H01L2924/00
摘要： Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
摘要翻译：热界面组合物含有直径与聚合物基质共混的直径小于25微米的最大粒径的填料颗粒。这种组合物使得可获得的可获得的粘合线厚度降低，这降低了存在于热界面材料和相应配合表面之间的原位热阻。

3. 发明申请

US20060275952A1 Method for making electronic devices 审中-公开
标题翻译：制造电子设备的方法
公开(公告)号：US20060275952A1
公开(公告)日：2006-12-07
申请号：US11146838
申请日：2005-06-07
申请人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
发明人： Arun Gowda , Sandeep Tonapi , Ryan Mills , David Esler , Stephen Latham , John Campbell
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/4871 , H01L23/3737 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12044 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
摘要翻译：公开了用于形成电子装置的方法，该电子装置包括同时用作底部填充材料的材料以及热界面材料。此处还给出了包括散热元件，半导体芯片，基板和导热材料的电子组件，其中导热材料同时用作底部填充材料以及热界面材料。

4. 发明申请

US20050148721A1 Thin bond-line silicone adhesive composition and method for preparing the same 审中-公开
公开(公告)号：US20050148721A1
公开(公告)日：2005-07-07
申请号：US11062040
申请日：2005-02-18
申请人： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
发明人： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
IPC分类号： C08L83/04 , C09J183/04 , H01L23/373 , H01L23/42 , C08K3/34
CPC分类号： C09J183/04 , C08G77/045 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K2201/005 , C08L83/04 , H01L23/3737 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/12044 , H01L2924/3011 , C08L83/00 , H01L2924/00
摘要： Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

5. 发明申请

US20060065387A1 Electronic assemblies and methods of making the same 审中-公开
标题翻译：电子组件及其制作方法
公开(公告)号：US20060065387A1
公开(公告)日：2006-03-30
申请号：US10950554
申请日：2004-09-28
申请人： Sandeep Tonapi , Arun Gowda , Kevin Durocher , David Esler , Hong Zhong , Ananth Prabhakumar
发明人： Sandeep Tonapi , Arun Gowda , Kevin Durocher , David Esler , Hong Zhong , Ananth Prabhakumar
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L21/4878 , H01L21/563 , H01L23/367 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00 , H01L2224/0401
摘要： An electronic assembly having at least a heat dissipating unit and a heat generating unit is provided. At least one of the heat dissipating unit and the heat generating unit has at least one deliberately modified surface.
摘要翻译：提供具有至少散热单元和发热单元的电子组件。散热单元和发热单元中的至少一个具有至少一个故意改变的表面。

6. 发明申请

US20070241303A1 Thermally conductive composition and method for preparing the same 审中-公开
标题翻译：导热组合物及其制备方法
公开(公告)号：US20070241303A1
公开(公告)日：2007-10-18
申请号：US11207865
申请日：2005-08-19
申请人： Hong Zhong , Sara Paisner , Arun Gowda , David Esler , Sandeep Tonapi , Jennifer David , Paulo Meneghetti , Laurence Maniccia , Paul Hans , Robert Fortuna , Gregory Strosaker , Gregory Shaffer , Hollister Victor , Ajit Sane
发明人： Hong Zhong , Sara Paisner , Arun Gowda , David Esler , Sandeep Tonapi , Jennifer David , Paulo Meneghetti , Laurence Maniccia , Paul Hans , Robert Fortuna , Gregory Strosaker , Gregory Shaffer , Hollister Victor , Ajit Sane
IPC分类号： H01L29/12
CPC分类号： C08K3/38 , C08K9/04 , C08K2003/385 , C08K2201/001 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： Thermally conductive compositions containing spherical boron nitride filler particles having an average aspect ration of less than 2.0 in a polymer matrix.
摘要翻译：在聚合物基质中含有平均长宽比小于2.0的球形氮化硼填料颗粒的导热组合物。

7. 发明申请

US20080019097A1 THERMAL TRANSPORT STRUCTURE 审中-公开
标题翻译：热运输结构
公开(公告)号：US20080019097A1
公开(公告)日：2008-01-24
申请号：US11782049
申请日：2007-07-24
申请人： Jian Zhang , Sandeep Tonapi , Arun Gowda , Ryan Mills
发明人： Jian Zhang , Sandeep Tonapi , Arun Gowda , Ryan Mills
IPC分类号： H05K7/20
CPC分类号： F28F13/00 , F28F2013/005 , H01L23/3677 , H01L23/3733 , H01L23/42 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.
摘要翻译：提供热管理系统。该系统可以包括位于散热单元和发热单元之间的发热单元，散热单元和热传输结构。热传输结构具有与发热单元热连通的第一表面和与散热单元热连通的第二表面。热传输结构包括长度与宽度比大于1的导热材料，并且长度方向定向地促进沿热交换结构第一表面或第二表面中的至少一个的大致垂直方向的热传导。热传递层包括在相对非导热的基质内限定不连续阵列的多个独立的导热条或通道。

8. 发明申请

US20070240310A1 Thermal management system and associated method 有权
标题翻译：热管理系统及相关方法
公开(公告)号：US20070240310A1
公开(公告)日：2007-10-18
申请号：US11247113
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
发明人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
IPC分类号： B21D53/02
CPC分类号： B32B27/06 , B32B5/14 , B32B7/02 , B32B27/08 , B32B27/20 , B32B2264/102 , B32B2264/105 , B32B2307/30 , B32B2307/302 , B32B2307/706 , H05K7/20481 , Y10T29/4935 , Y10T29/49366 , Y10T29/49885 , Y10T428/269
摘要： A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
摘要翻译：提供一种制造热界面结构的方法。该方法可以包括在树脂层上设置热传输层以形成层叠结构，并且将层叠结构切片以形成在切片的第一表面上具有热传输层的第一暴露部分的横截面切片，以及所述热传输层在所述切片的第二表面上的第二暴露部分。

9. 发明申请

US20070231560A1 THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD 有权
标题翻译：热运输结构及相关方法
公开(公告)号：US20070231560A1
公开(公告)日：2007-10-04
申请号：US11247114
申请日：2005-10-11
申请人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
发明人： Jian Zhang , Sandeep Tonapi , Ryan Mills , Arun Gowda
IPC分类号： B32B5/16
CPC分类号： F28F13/00 , F28F2013/005 , H01L23/3733 , H01L23/42 , H01L2924/0002 , Y10T428/25 , Y10T428/26 , Y10T428/269 , Y10T428/30 , Y10T428/31504 , H01L2924/00
摘要： A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.
摘要翻译：提供具有热传输层和树脂层的热传输结构。热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。

10. 发明申请

US20060274470A1 Contact material, device including contact material, and method of making 审中-公开
标题翻译：接触材料，包括接触材料的装置和制造方法
公开(公告)号：US20060274470A1
公开(公告)日：2006-12-07
申请号：US11480812
申请日：2006-07-05
申请人： Duraiswamy Srinivasan , Reed Corderman , Christopher Keimel , Somasundaram Gunasekaran , Sudhakar Reddy , Arun Gowda , Kanakasabapathi Subramanian
发明人： Duraiswamy Srinivasan , Reed Corderman , Christopher Keimel , Somasundaram Gunasekaran , Sudhakar Reddy , Arun Gowda , Kanakasabapathi Subramanian
IPC分类号： H02H5/04
CPC分类号： A61B5/1112 , A61B5/0006 , A61B5/22 , A61B5/6807 , A61B5/6823 , A61B5/6824
摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K.
摘要翻译：提供了一种用于控制电流流动的装置。该装置包括第一导体; 第二导体，其可切换地耦合到所述第一导体，以在与所述第一导体的电连接状态与与所述第一导体的电断开状态之间交替。至少一个导体还包括电接触，所述电接触包括包含多个孔的固体基质; 以及设置在所述多个孔的至少一部分中的填充材料。填充材料的熔点小于约575K。提供了形成电接触的方法。该方法包括以下步骤：提供衬底; 在衬底上提供多个孔; 以及在所述多个孔的至少一部分内设置填充材料。填充材料的熔点小于约575K。

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