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    • 124. 发明授权
    • Low temperature epitaxial growth of quaternary wide bandgap semiconductors
    • 四元宽带隙半导体的低温外延生长
    • US06911084B2
    • 2005-06-28
    • US09981024
    • 2001-10-16
    • John KouvetakisIgnatius S. T. TsongRadek RouckaJohn Tolle
    • John KouvetakisIgnatius S. T. TsongRadek RouckaJohn Tolle
    • C30B25/02H01L21/205H01L33/26H01S5/30H01S5/32C30B25/08
    • H01L33/26C30B25/02C30B29/52H01L21/02378H01L21/02381H01L21/02447H01L21/02458H01L21/02529H01L21/0254H01L21/0262H01L21/02631H01S5/30H01S5/3027H01S5/32H01S2304/02
    • A method of growing quaternary epitaxial films having the formula YCZN wherein Y is a Group IV element and Z is a Group III element at temperatures in the range 550-750° C. is provided. In the method, a gaseous flux of precursor H3YCN and a vapor flux of Z atoms are introduced into a gas-source molecular beam epitaxial (GSMBE) chamber where they combine to form thin film of YCZN on the substrate. Preferred substrates are silicon, silicon carbide and AlN/silicon structures. Epitaxial thin film SiCAlN and GeCAlN are provided. Bandgap engineering may be achieved by the method by adjusting reaction parameters of the GSMBE process and the relative concentrations of the constituents of the quaternary alloy films. Semiconductor devices produced by the present method have bandgaps from about 2 eV to about 6 eV and exhibit a spectral range from visible to ultraviolet which makes them useful for a variety of optoelectronic and microelectronic applications. Large-area substrates for growth of conventional Group III nitrides and compounds are produced by SiCAlN deposited on large-diameter silicon wafers. The quaternary compounds, especially the boron containing compounds, exhibit extreme hardness. These quaternary compounds are radiation resistant and may be used in space exploration.
    • 提供了在550-750℃的温度下生长具有式YCZN的四元外延膜的方法,其中Y是IV族元素,Z是III族元素。 在该方法中,将前体H 3 YCN的气体流量和Z原子的蒸气通量引入气体分子束外延(GSMBE)室中,在其中它们结合形成YCZN的薄膜, 底物。 优选的衬底是硅,碳化硅和AlN /硅结构。 提供外延薄膜SiCA1N和GeCA1N。 通过调整GSMBE工艺的反应参数和四元合金薄膜成分的相对浓度,可以通过该方法实现带隙工程。 通过本方法制造的半导体器件具有约2eV至约6eV的带隙,并且具有从可见到紫外线的光谱范围,使得它们可用于各种光电子和微电子应用。 用于生长常规III族氮化物和化合物的大面积衬底由沉积在大直径硅晶片上的SiCAlN产生。 四元化合物,特别是含硼化合物,具有极高的硬度。 这些四元化合物具有耐辐射性,可用于太空探索。