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121. 发明授权

US06585471B2 Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements 失效
标题翻译：用于分离半导体元件的方法和装置以及半导体元件的安装方法
公开(公告)号：US06585471B2
公开(公告)日：2003-07-01
申请号：US09877008
申请日：2001-06-11
申请人： Hitoshi Odajima , Kazuyuki Futagi , Makoto Matsuoka
发明人： Hitoshi Odajima , Kazuyuki Futagi , Makoto Matsuoka
IPC分类号： H05K1302
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , H01L2224/16 , H01L2924/01079 , H01L2924/07811 , Y10S156/93 , Y10T156/11 , H01L2924/00
摘要： A method and an apparatus wherein the thin semiconductor wafer is cut into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet. A group of the semiconductor elements are removed from the adhesive sheet at high speed without incurring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit.
摘要翻译：一种方法和装置，其中在粘附在粘合片上的条件下将薄半导体晶片切割成薄的半导体元件的单元。一组半导体元件以高速度从粘合片上去除，而不会导致其断开其每个半导体元件，并且半导体元件从去除的半导体元件组中被预定的单元拾取。

122. 发明授权

US06544819B2 Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements 失效
公开(公告)号：US06544819B2
公开(公告)日：2003-04-08
申请号：US09877007
申请日：2001-06-11
申请人： Hitoshi Odajima , Kazuyuki Futagi , Makoto Matsuoka
发明人： Hitoshi Odajima , Kazuyuki Futagi , Makoto Matsuoka
IPC分类号： H01L2144
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , H01L2224/16 , H01L2924/01079 , H01L2924/07811 , Y10S156/93 , Y10T156/11 , H01L2924/00
摘要： A method and an apparatus wherein the thin semiconductor wafer is cut into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet. A group of the semiconductor elements are removed from the adhesive sheet at high speed without incurring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit.

123. 发明申请

US20030057588A1 Method and apparatus for stabilizing material physical properties of recyclable bumpers 失效
标题翻译：用于稳定可回收保险杠材料物理性能的方法和装置
公开(公告)号：US20030057588A1
公开(公告)日：2003-03-27
申请号：US10232323
申请日：2002-09-03
申请人： Honda Giken Kogyo Kabushiki Kaisha
发明人： Akihisa Saitou , Tsuneo Koike , Hideaki Suzuki , Kazuo Ando
IPC分类号： B29B017/00
CPC分类号： B29B17/04 , B29B9/16 , B29B17/0036 , B29B17/0042 , B29K2105/26 , B29L2031/3044 , Y02W30/62 , Y02W30/625 , Y10S156/919 , Y10S156/935 , Y10S264/911 , Y10T156/11 , Y10T156/19
摘要： A method for stabilizing material physical properties of recyclable bumpers comprising the steps of: separating coating from raw material obtained by cleaning, fracturing and drying recyclable bumpers, to thereby make a recycled matrix; mixing an additive with the recycled matrix; melting and extruding the mixed matrix with an extrusion machine; cutting the molten and extruded matrix to produce pellets; introducing the pellets into a tank of a predetermined capacity; and mixing the pellets in the tank for a predetermined period of time while delivering the pellets in the tank to an introduction opening of the tank again for reintroduction into the tank in parallel with the pellets that are newly introduced.
摘要翻译：一种用于稳定可回收保险杠的材料物理性能的方法，包括以下步骤：通过清洗，压裂和干燥可回收的缓冲器得到的原料分离涂层，从而制成再循环基体; 将添加剂与再循环基质混合; 用挤出机熔融挤出混合基质; 切割熔融和挤出的基质以产生颗粒; 将丸粒引入预定容量的罐中; 并将颗粒在罐中混合预定的时间，同时将罐中的颗粒再次输送到罐的引入开口，以与新引入的颗粒平行重新引入罐中。

124. 发明授权

US06521078B2 Sample separating apparatus and method, and substrate manufacturing method 失效
标题翻译：样品分离装置和方法，以及基板制造方法
公开(公告)号：US06521078B2
公开(公告)日：2003-02-18
申请号：US10151527
申请日：2002-05-20
申请人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
发明人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
IPC分类号： B32B3500
CPC分类号： H01L21/6835 , B26F3/004 , H01L21/67092 , H01L2221/68363 , H01L2924/30105 , Y10S156/941 , Y10T29/49821 , Y10T83/364 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/19 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939
摘要： This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (10b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
摘要翻译：本发明提供一种用于在多孔层处分离具有多孔层的基板的装置。具有多孔层（10b）的键合衬底叠层（101）在旋转的同时由衬底保持部分（120,150）支撑。从喷嘴（102）喷出高速，高压的水（射流），将射流喷射到键合衬底叠层（101）中。衬底保持部分（120,150）保持键合衬底叠层（101），使得键合衬底叠层（101）可以由于注入的水的压力而在其中心部分膨胀。这有效地施加从键合衬底叠层（101）的内部向外作用的力（分离力）。

125. 发明授权

US06491083B2 Wafer demount receptacle for separation of thinned wafer from mounting carrier 有权
标题翻译：用于将薄片晶片与安装托架分离的晶片卸载插座
公开(公告)号：US06491083B2
公开(公告)日：2002-12-10
申请号：US09776758
申请日：2001-02-06
申请人： Bhola De , Daniel Stofman
发明人： Bhola De , Daniel Stofman
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , Y10S134/902 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/1126 , Y10T156/1137 , Y10T156/1179 , Y10T156/19
摘要： A wafer demounting receptacle comprises a substantially circular plate member and an upstanding rim structure provided around a periphery of the plate member. The rim structure is stepped and includes a first step defining a first diameter, and a second step defining a second diameter grater than the first diameter. The riser of the first step has a very low height so that a gap between the plate member and a fragile semiconductor wafer bonded to a carrier having a peripheral abutment surface resting on the run of the first step, limits the bending of an edge portion of the wafer in a direction towards the plate member while the wafer is partially demounted from a wafer carrier. The plate member is further provided with a pattern of holes that generates eddy currents in a solvent that flows over the wafer, carrier, and receptacle so as to soften and dissolve the mounting adhesive between the wafer and carrier such that the wafer is separated from the carrier. The wafer demount receptacle can be used in conjunction with a wafer demount tool comprising a chamber defined between a backing plate and a contact plate. The chamber is provided with a gas inlet for introducing a pressurized gas, while the contact plate is provided with a plurality of through-holes. The wafer demount tool is mated to the wafer demount receptacle such that the contact plate is juxtaposed against the back side of a wafer carrier resting in the wafer demount receptacle. Pressurized gas flowing through the wafer demount tool displaces solvent from the wafer-carrier interface to further promote separation of the wafer from the carrier.
摘要翻译：晶片拆卸容器包括基本上圆形的板构件和围绕板构件的周边设置的直立边缘结构。轮辋结构是阶梯式的并且包括限定第一直径的第一步骤和限定比第一直径的第二直径磨浆机的第二步骤。第一步骤的立管具有非常低的高度，使得板构件和结合到具有搁置在第一台阶的行程上的外围邻接表面的载体的脆弱的半导体晶片之间的间隙限制了第一台阶的边缘部分的弯曲所述晶片朝向所述板构件的方向，同时所述晶片从晶片载体部分地拆卸。板构件还设置有孔，其形式在流过晶片，载体和插座的溶剂中产生涡流，以便将安装粘合剂软化并溶解在晶片和载体之间，使得晶片与载体晶片卸载插座可以与包括限定在背板和接触板之间的室的晶片拆卸工具结合使用。该室设置有用于引入加压气体的气体入口，而接触板设置有多个通孔。晶片拆卸工具与晶片卸载插座相配合，使得接触板与搁置在晶片卸载插座中的晶片载体的背面并置。流经晶片拆卸工具的加压气体从晶片 - 载体界面排出溶剂，以进一步促进晶片与载体的分离。

126. 发明申请

US20020139474A1 Raw bar stripping off and cleaning jig and raw bar stripping off and cleaning method 失效
标题翻译：生料条剥离和清洁夹具和生料条剥离和清洗方法
公开(公告)号：US20020139474A1
公开(公告)日：2002-10-03
申请号：US10153526
申请日：2002-05-23
申请人： FUJITSU LIMITED
发明人： Michinao Nomura , Tsutomu Honma
IPC分类号： B32B001/00
CPC分类号： B08B3/12 , B08B3/04 , B08B5/04 , G11B5/1272 , G11B5/3173 , Y10T156/11 , Y10T156/1111 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1978
摘要： A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw bars stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars, which are stripped off from the transfer tools and are placed on the base, from the top.
摘要翻译：原料棒剥离和清洁夹具具有剥离构件，转移工具放置在该剥离构件上，用于支撑从转移工具剥离的生条的基座，用于吸引生条以将其分离的剥离抽吸构件转移工具，以及用于支撑从转移工具剥离并从顶部放置在基座上的原料棒的盖构件。

127. 发明授权

US06458672B1 Controlled cleavage process and resulting device using beta annealing 有权
标题翻译：控制裂解工艺和使用β退火的所得器件
公开(公告)号：US06458672B1
公开(公告)日：2002-10-01
申请号：US09705347
申请日：2000-11-02
申请人： Francois J. Henley , Nathan W. Cheung
发明人： Francois J. Henley , Nathan W. Cheung
IPC分类号： H01L2120
CPC分类号： H01L21/187 , B81C1/0038 , B81C2201/0191 , B81C2201/0192 , H01L21/2007 , H01L21/2236 , H01L21/26506 , H01L21/304 , H01L21/7624 , H01L21/76254 , H01L21/7813 , Y10S117/915 , Y10S156/93 , Y10S438/974 , Y10S438/977 , Y10T156/11 , Y10T156/1158 , Y10T156/19 , Y10T428/21 , Y10T428/24893 , Y10T428/249956
摘要： A method for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate. A step of increasing a built-in energy state of the substrate is also included.
摘要翻译：一种从供体衬底（10）形成材料（12）的膜的方法。该技术具有将能量粒子（22）通过供体衬底（10）的表面引入到表面下方的选定深度（20）的步骤，其中颗粒具有相对较高的浓度以限定施主衬底材料（12）高于所选深度。能量源被引导到供体衬底的选定区域，以在所选择的深度（20）处引发衬底（10）的受控切割作用，因此，所述切割动作提供了扩张切割前沿，以使剩余的所述供体材料释放部分供体基质。还包括增加衬底的内置能量状态的步骤。

128. 发明申请

US20020134504A1 Sample separating apparatus and method, and substrate manufacturing method 失效
标题翻译：样品分离装置和方法，以及基板制造方法
公开(公告)号：US20020134504A1
公开(公告)日：2002-09-26
申请号：US10151527
申请日：2002-05-20
发明人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
IPC分类号： B32B001/00
CPC分类号： H01L21/6835 , B26F3/004 , H01L21/67092 , H01L2221/68363 , H01L2924/30105 , Y10S156/941 , Y10T29/49821 , Y10T83/364 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/19 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939
摘要： This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
摘要翻译：本发明提供一种用于在多孔层处分离具有多孔层的基板的装置。具有多孔层（101b）的键合衬底叠层（101）在旋转的同时由衬底保持部（120,150）支撑。从喷嘴（102）喷出高速，高压的水（射流），将射流喷射到键合衬底叠层（101）中。衬底保持部分（120,150）保持键合衬底叠层（101），使得键合衬底叠层（101）可以由于注入的水的压力而在其中心部分膨胀。这有效地施加从键合衬底叠层（101）的内部向外作用的力（分离力）。

129. 发明申请

US20020106870A1 CONTROLLED CLEAVING PROCESS 有权
标题翻译：控制清洗过程
公开(公告)号：US20020106870A1
公开(公告)日：2002-08-08
申请号：US09483393
申请日：2000-01-13
发明人： Francois J. Henley , Nathan W. Cheung
IPC分类号： H01L021/00 , H01L021/44 , H01L021/48 , H01L021/50 , H01L021/8238
CPC分类号： H01L21/187 , B81C1/0038 , B81C2201/0191 , B81C2201/0192 , H01L21/2007 , H01L21/2236 , H01L21/26506 , H01L21/304 , H01L21/7624 , H01L21/76254 , H01L21/7813 , Y10S117/915 , Y10S156/93 , Y10S438/974 , Y10S438/977 , Y10T156/11 , Y10T156/1158 , Y10T156/19 , Y10T428/21 , Y10T428/24893 , Y10T428/249956
摘要： A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
摘要翻译：一种用于从供体衬底（10）形成材料（12）的膜的技术。该技术具有将能量粒子（22）通过供体衬底（10）的表面引入到表面下方的选定深度（20）的步骤，其中颗粒具有相对较高的浓度以限定施主衬底材料（12）高于所选深度。能量源被引导到供体基底的选定区域，以在所选择的深度（20）处引发基底（10）的受控切割作用，因此，所述切割动作提供了扩张切割前沿，从而将供体材料从剩余的部分供体基质。

130. 发明申请

US20020104622A1 Wafer demount gas distribution tool 有权
公开(公告)号：US20020104622A1
公开(公告)日：2002-08-08
申请号：US09776922
申请日：2001-02-06
发明人： Bhola De
IPC分类号： B32B001/00
CPC分类号： H01L21/67126 , H01L21/6875 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/1928
摘要： A wafer demounting receptacle comprises a substantially circular plate member and an upstanding rim structure provided around a periphery of the plate member. The rim structure is stepped and includes a first step defining a first diameter, and a second step defining a second diameter grater than the first diameter. The riser of the first step has a very low height so that a gap between the plate member and a fragile semiconductor wafer bonded to a carrier having a peripheral abutment surface resting on the run of the first step, limits the bending of an edge portion of the wafer in a direction towards the plate member while the wafer is partially demounted from a wafer carrier. The plate member is further provided with a pattern of holes that generates eddy currents in a solvent that flows over the wafer, carrier, and receptacle so as to soften and dissolve the mounting adhesive between the wafer and carrier such that the wafer is separated from the carrier. The wafer demount receptacle can be used in conjunction with a wafer demount tool comprising a chamber defined between a backing plate and a contact plate. The chamber is provided with a gas inlet for introducing a pressurized gas, while the contact plate is provided with a plurality of through-holes. The wafer demount tool is mated to the wafer demount receptacle such that the contact plate is juxtaposed against the back side of a wafer carrier resting in the wafer demount receptacle. Pressurized gas flowing through the wafer demount tool displaces solvent from the wafer-carrier interface to further promote separation of the wafer from the carrier.

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