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121. 发明申请

US20050243529A1 Microelectronic connection components having bondable wires 有权
标题翻译：具有可焊接线的微电子连接部件
公开(公告)号：US20050243529A1
公开(公告)日：2005-11-03
申请号：US11111145
申请日：2005-04-21
申请人： Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
发明人： Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
IPC分类号： H01L21/60 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01R9/00 , H01R12/04 , H05K1/11
CPC分类号： H01L23/13 , H01L23/3114 , H01L23/4951 , H01L23/4952 , H01L23/49811 , H01L23/49816 , H01L24/48 , H01L24/85 , H01L2224/05647 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48463 , H01L2224/48471 , H01L2224/85447 , H01L2924/00014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19107 , H01L2224/45099 , H01L2924/00
摘要： A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.
摘要翻译：用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的引线延伸。引线的端部通过结合到触点或嵌入基板中而粘附到基板上。在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。

122. 发明申请

US20050181655A1 Micro pin grid array with wiping action 有权
标题翻译：微针格栅阵列与擦拭动作
公开(公告)号：US20050181655A1
公开(公告)日：2005-08-18
申请号：US10985126
申请日：2004-11-10
申请人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae Park
发明人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae Park
IPC分类号： H01L21/48 , H01L23/13 , H01R13/24 , H01R13/62
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

123. 发明申请

US20050116358A1 Stacked microelectronic assemblies with central contacts 有权
标题翻译：堆叠的微电子组件与中心触点
公开(公告)号：US20050116358A1
公开(公告)日：2005-06-02
申请号：US10988160
申请日：2004-11-12
申请人： Belgacem Haba
发明人： Belgacem Haba
IPC分类号： H01L25/065 , H01L23/29
CPC分类号： H01L23/48 , H01L25/0652 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2225/06562 , H01L2924/01087 , H01L2924/01322 , H01L2924/15311
摘要： A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second microelectronic element have front surfaces on which exposed on a central region of the front surface are contacts. A spacer layer may be provided under a portion of the second microelectronic element opposite a portion of the second microelectronic element overlying the first microelectronic element. Additionally, a third microelectronic element may be substituted in for the spacer layer so that the first microelectronic element and the third microelectronic element are underlying opposing sides of the second microelectronic element.
摘要翻译：堆叠的微电子组件包括介电元件和第一和第二微电子元件，第一和第二微电子元件堆叠在另一个之上，第一微电子元件位于第二微电子元件的至少一部分下方。第一微电子元件和第二微电子元件具有暴露在前表面的中心区域上的前表面是接触的。间隔层可以设置在第二微电子元件的与第二微电子元件的覆盖第一微电子元件的部分相对的部分下方。另外，第三微电子元件可以被替代用于间隔层，使得第一微电子元件和第三微电子元件位于第二微电子元件的相对侧。

124. 发明授权

US06898085B2 Multiple channel modules and bus systems using same 失效
公开(公告)号：US06898085B2
公开(公告)日：2005-05-24
申请号：US10695854
申请日：2003-10-30
申请人： Belgacem Haba , Richard E. Perego , David Nguyen , Billy W. Garrett, Jr. , Ely Tsern , Craig E. Hampel , Wai-Yeung Yip
发明人： Belgacem Haba , Richard E. Perego , David Nguyen , Billy W. Garrett, Jr. , Ely Tsern , Craig E. Hampel , Wai-Yeung Yip
IPC分类号： G06F13/40 , G11C5/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K7/06 , H05K7/14 , H05K7/02 , H05K7/10
CPC分类号： G11C5/04 , G06F13/409 , G11C5/00 , H05K1/023 , H05K1/117 , H05K1/141 , H05K1/147 , H05K1/148 , H05K7/1459 , H05K2201/10189
摘要： Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

125. 发明申请

US20050082653A1 Structure and method of making sealed capped chips 有权
标题翻译：密封盖片的结构和方法
公开(公告)号：US20050082653A1
公开(公告)日：2005-04-21
申请号：US10948976
申请日：2004-09-24
申请人： Bruce McWilliams , Giles Humpston , Belgacem Haba , David Tuckerman
发明人： Bruce McWilliams , Giles Humpston , Belgacem Haba , David Tuckerman
IPC分类号： H01L21/60 , H01L23/04 , H01L23/10 , H01L23/485 , H01L27/146 , H03H3/007 , H03H3/08 , H03H9/10 , H01L23/02
CPC分类号： H01L23/3114 , B81B2207/095 , B81C1/00293 , B81C1/00301 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , H01L21/76898 , H01L23/04 , H01L24/11 , H01L24/13 , H01L24/48 , H01L27/14618 , H01L27/14627 , H01L27/14636 , H01L33/62 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1401 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48247 , H01L2224/484 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H03H3/007 , H03H9/0547 , H03H9/0585 , H03H9/059 , H03H9/1057 , H03H9/1064 , H03H9/1071 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.
摘要翻译：提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

126. 发明授权

US06721189B1 Memory module 失效
标题翻译：内存模块
公开(公告)号：US06721189B1
公开(公告)日：2004-04-13
申请号：US10098520
申请日：2002-03-13
申请人： Belgacem Haba
发明人： Belgacem Haba
IPC分类号： H05K114
CPC分类号： H05K1/147 , H01L2224/49175 , H01L2924/01079 , H01L2924/14 , H01R12/52 , H01R12/714 , H05K1/141 , H05K1/148 , H05K1/189 , H05K3/325 , H05K3/4691 , H05K2201/10159 , H05K2201/10378 , H05K2201/10719 , H05K2203/167
摘要： The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector electrically couples the first circuit board to the second circuit board, such that the memory chip is electrically connected to the array of electrical contact points. Alternatively, the memory module that rigid/flex circuit board. The rigid/flex circuit board includes a substantially rigid first section having at least one memory chip disposed thereon, and a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof. The rigid/flex circuit board also includes a flexible third section in-between the first section to the second section.
摘要翻译：存储器模块包括具有设置在其上的至少一个存储器芯片的基本刚性的第一电路板。存储器模块还包括具有布置在其平坦表面上的电接触点阵列的基本上刚性的第二电路板。柔性连接器将第一电路板电耦合到第二电路板，使得存储芯片电连接到电接触点阵列。或者，刚性/柔性电路板的内存模块。刚性/柔性电路板包括具有设置在其上的至少一个存储芯片的基本刚性的第一部分，以及设置在其平坦表面上的具有电接触点阵列的基本上刚性的第二部分。刚性/柔性电路板还包括在第一部分与第二部分之间的柔性第三部分。

127. 发明授权

US06674161B1 Semiconductor stacked die devices 有权
标题翻译：半导体堆叠管芯器件
公开(公告)号：US06674161B1
公开(公告)日：2004-01-06
申请号：US09679143
申请日：2000-10-03
申请人： Belgacem Haba
发明人： Belgacem Haba
IPC分类号： H01L2304
CPC分类号： H01L25/50 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate. In a preferred embodiment, the conductive structures comprise multi-layered, conductive pad structures.
摘要翻译：描述了半导体器件和半导体器件形成方法。在一个实施例中，在多个半导体衬底内形成至少一个导电结构。一个导电结构的至少一部分具有相对面对的暴露的外表面。单个衬底在管芯堆叠中堆叠在一起，使得每个衬底上的各个导电结构与下一个相邻衬底上的导电结构电接触。在优选实施例中，导电结构包括多层导电垫结构。

128. 发明授权

US06545875B1 Multiple channel modules and bus systems using same 失效
公开(公告)号：US06545875B1
公开(公告)日：2003-04-08
申请号：US09568424
申请日：2000-05-10
申请人： Donald V. Perino , Belgacem Haba , Sayeh Khalili
发明人： Donald V. Perino , Belgacem Haba , Sayeh Khalili
IPC分类号： H05K702
CPC分类号： G11C5/04 , G06F13/409 , G11C5/00 , H05K1/023 , H05K1/117 , H05K1/141 , H05K1/147 , H05K1/148 , H05K7/1459 , H05K2201/10189
摘要： Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

129. 发明授权

US06518091B1 Method of making anisotropic conductive elements for use in microelectronic packaging 有权
标题翻译：制造用于微电子封装的各向异性导电元件的方法
公开(公告)号：US06518091B1
公开(公告)日：2003-02-11
申请号：US09655300
申请日：2000-09-05
申请人： Belgacem Haba
发明人： Belgacem Haba
IPC分类号： H01L2144
CPC分类号： H01L21/568 , B29C70/62 , B29C70/882 , G02F1/1339 , H01L21/6835 , H01L23/49827 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27438 , H01L2224/29101 , H01L2224/2919 , H01L2224/29499 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12044 , H01L2924/14 , H05K3/323 , H05K3/368 , H05K3/4623 , H05K2201/0133 , H05K2201/0248 , H05K2201/083 , H05K2201/09536 , H05K2203/104 , H05K2203/105 , H01L2924/00
摘要： A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of material having a pair of oppositely-directed major faces, the layer incorporating a curable dielectric material in a fluid condition and electrically conductive particles in the curable dielectric material and applying a magnetic field to the layer of a material so as to alter the configuration of the particles and so as to form areas of high particle concentration defining a plurality of conductive paths extending between the major faces of the layer of a material. After applying the magnetic field, the dielectric material is cured. The layer may be compressed for moving the conductive particles together to provide lower resistance electrical paths through the layer. In certain embodiments, at last some of the conductive particles are elongated so that when the magnetic field is applied to the layer of a material, the magnetic field turns the axes of elongation of at least some of the elongated particles towards the vertical direction. In other embodiments, the magnetic field moves at least some of the conductive particles in horizontal directions.
摘要翻译：制造用于微电子封装的各向异性导电元件的方法包括提供具有一对相反方向的主面的材料层，该层包含处于流体状态的可固化电介质材料和可固化电介质材料中的导电颗粒，以及对材料层施加磁场，以便改变颗粒的构型并形成高的颗粒浓度的区域，从而限定在材料层的主要表面之间延伸的多个导电路径。施加磁场后，介电材料固化。该层可以被压缩以将导电颗粒移动到一起以提供穿过层的较低电阻的电路径。在某些实施例中，最后一些导电颗粒是细长的，使得当磁场被施加到材料层时，磁场使至少一些细长颗粒的伸长轴线向垂直方向转动。在其他实施例中，磁场沿水平方向移动至少一些导电颗粒。

130. 发明授权

US06496255B2 Measurement of crystal face orientation 失效
公开(公告)号：US06496255B2
公开(公告)日：2002-12-17
申请号：US09923143
申请日：2001-08-06
申请人： Kazumi Sugai , Belgacem Haba , Yukio Morishige
发明人： Kazumi Sugai , Belgacem Haba , Yukio Morishige
IPC分类号： G01N2100
CPC分类号： G01N21/55
摘要： A sample is rotated about an axis perpendicular to a surface of the sample in predetermined angular steps. The surface of the sample is irradiated with linearly polarized light, and a reflected intensity of light reflected from the surface of the sample is detected in each angular step. Based on a rotational angle dependency of the reflected intensity, the crystal face orientation of the sample is determined. To improve signal-to-noise ratio, the crystal lattice of the sample is excited. Further, the surface of the sample is irradiated with a plurality of linearly polarized light beams to obtain a plurality of reflected intensities.

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