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111. 发明授权

US08184438B2 Control device 有权
标题翻译：控制装置
公开(公告)号：US08184438B2
公开(公告)日：2012-05-22
申请号：US12389220
申请日：2009-02-19
申请人： Yujiro Kaneko , Masahiko Asano , Hideto Yoshinari
发明人： Yujiro Kaneko , Masahiko Asano , Hideto Yoshinari
IPC分类号： H05K7/00 , H05K7/20 , H05K1/00 , F28F7/00 , A47B81/00
CPC分类号： H05K7/026 , H05K7/20854
摘要： A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.
摘要翻译：模块化控制装置包括控制板，子模块和壳体盖，微控制器安装在控制板上。子模块具有设置有安装在子模块壳体的壁中的布线层的子模块壳体。电子部件安装在子模块外壳中，通过布线层电连接到控制板。壳体盖可容纳控制板和子模块。外壳底座与外壳盖连接。容纳部具有与电子部件的形状对应的形状配置在壳体盖内。子模块通过在收纳部分和每个电子部件之间的散热粘合剂安装到壳体盖。

112. 发明申请

US20110205711A1 HEAT DISSIPATION FROM A CONTROL UNIT 有权
标题翻译：从控制单元散热
公开(公告)号：US20110205711A1
公开(公告)日：2011-08-25
申请号：US13003749
申请日：2009-06-17
申请人： Andre Lischeck , Thomas Wiesa
发明人： Andre Lischeck , Thomas Wiesa
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20454 , H05K7/20854 , Y10T29/49002
摘要： A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.
摘要翻译：控制单元，特别是用于机动车辆的控制单元，该控制单元具有壳体，该壳体具有至少一个散热区域，至少一个具有至少一个散热元件的电气和/或电子模块位于该散热区域中，所述散热元件通过导热介质导热地连接到散热区域，所述导热介质至少在被引入时通过至少一个壳体开口被引入到所述壳体的内部并且具有糊状稠度。还描述了用于制造控制单元的相应方法。

113. 发明申请

US20110194248A1 POWER CONVERSION APPARATUS 有权
标题翻译：功率转换装置
公开(公告)号：US20110194248A1
公开(公告)日：2011-08-11
申请号：US13021931
申请日：2011-02-07
申请人： Akira Nakasaka , Masaru Miyazaki , Kenichi Oohama
发明人： Akira Nakasaka , Masaru Miyazaki , Kenichi Oohama
IPC分类号： H05K7/20
CPC分类号： H05K7/20854 , H01L23/473 , H01L25/112 , H01L25/162 , H01L2924/0002 , H01L2924/00
摘要： The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.
摘要翻译：电力转换装置包括构成电力转换电路的电子部件，用于冷却至少一部分电子部件的冷却器，以及容纳电子部件和冷却器的壳体。电子部件和冷却器中的至少一些固定在框架内并作为内部单元集成。其中包括半导体模块的内部单元还包括控制电路板，该控制电路板安装成在框架中形成的固定部分，以便在与框架的平面垂直的高度方向上从框架突出。每个板固定部分在比半导体模块的控制端子的尖端更靠近框架的位置处具有板抵接表面，所述端部形成为在高度方向上突出。

114. 发明申请

US20110194247A1 POWER CONVERSION APPARATUS 有权
标题翻译：功率转换装置
公开(公告)号：US20110194247A1
公开(公告)日：2011-08-11
申请号：US13021926
申请日：2011-02-07
申请人： Akira NAKASAKA , Kenichi Oohama
发明人： Akira NAKASAKA , Kenichi Oohama
IPC分类号： H05K7/20
CPC分类号： H05K7/20854 , H01L23/40 , H01L23/4012 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H02M7/003 , H05K7/20927 , H01L2924/00
摘要： In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.
摘要翻译：在电力转换装置中，电子部件和冷却器作为内部单元集成在框架中。内部单元通过框架固定在外壳内。框架具有电子部件被框架包围的形状，并且包括第一壁部分和从第一壁部分的两侧延伸的第二和第三壁部分。冷却器包括冷却剂引入管和冷却剂排出管。冷却剂引入管和冷却剂排出管从框架向外突出。第一至第三壁部包括支撑冷却剂导入管和冷却剂排出管中的至少一个的支撑壁部，以及不支撑冷却剂导入管和冷却剂排出管的框架壁部。支撑壁部分的厚度大于框架壁部分的厚度。

115. 发明申请

US20110182034A1 COMPOSITE COVER WITH INTEGRAL HEAT SINK 有权
标题翻译：具有整体散热的复合罩
公开(公告)号：US20110182034A1
公开(公告)日：2011-07-28
申请号：US12871567
申请日：2010-08-30
申请人： Pete R. Garcia , Tejinder Singh , James D. Hendrickson
发明人： Pete R. Garcia , Tejinder Singh , James D. Hendrickson
IPC分类号： H05K7/20 , F16H57/02
CPC分类号： H05K7/20854 , Y10T74/2186
摘要： A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.
摘要翻译：用于机动车辆变速器的一部分的复合罩具有与电子控制器连接的整体的内部散热器。可以由任何温度合适的塑料或复合材料制成的盖封闭并保护具有电气和电子部件（例如阀，螺线管，电动机和传感器）的机动车辆变速器的那部分。从其两侧的盖子的内表面间隔开传动液的流动是板或散热器。电子控制器设置在盖的外侧，并通过诸如螺栓或螺栓的热传递机械紧固件附接到盖内的板上。优选地，控制器的壳体还包括散热器。

116. 发明申请

US20110019349A1 Junction Box for Solar Modules and Method for the Mounting thereof on said Modules 审中-公开
标题翻译：太阳能电池组件接线盒及其在所述模块上的安装方法
公开(公告)号：US20110019349A1
公开(公告)日：2011-01-27
申请号：US12922081
申请日：2009-03-11
申请人： Roland Pfeffer
发明人： Roland Pfeffer
IPC分类号： H05K5/00
CPC分类号： H05K7/20854 , H02S40/34 , H02S40/345 , H05K7/20409 , H05K7/20445 , H05K7/2049
摘要： A junction box for mounting on solar modules is disclosed. The junction box enables fully automatic mounting on the solar module, and also automated assembly of the components in the box. The box has a housing with cover. The housing encloses electrical components, such as bypass diodes, and includes connectors that connect to ribbon conductors from the solar module. Within the housing is a positioning block with slots for receiving the ribbon conductors. A hold-down device is also provided in the housing and, when the junction box is mounted on the solar module, the hold-down device presses the ribbon conductors into the slots.
摘要翻译：公开了一种用于安装在太阳能模块上的接线盒。接线盒可以实现全自动安装在太阳能模块上，还可以自动组装箱体中的部件。盒子有一个带盖的外壳。壳体包围诸如旁路二极管的电气部件，并且包括连接到太阳能模块的带状导体的连接器。在壳体内是具有用于接收带状导体的槽的定位块。压缩装置还设置在壳体中，并且当接线盒安装在太阳能模块上时，压紧装置将带状导体压入槽中。

117. 发明申请

US20100132915A1 Cooling System for Aerospace Vehicle Components 有权
标题翻译：航空航天部件冷却系统
公开(公告)号：US20100132915A1
公开(公告)日：2010-06-03
申请号：US11747467
申请日：2007-05-11
申请人： David E. Blanding
发明人： David E. Blanding
IPC分类号： B60H1/00 , B64G1/52 , B64G1/58
CPC分类号： B64D47/00 , B64D13/006 , B64D2013/0614 , H05K7/20854 , Y02T50/44
摘要： A cooling system for removing heat generated by electrical components onboard aerospace vehicles flows coolant between an evaporator that removes heat from the component, and a condenser within the skin of the vehicle. The skin is formed from facesheets comprising multiple layers of polymer resin reinforced with meshes of single and double wall nanotubes. The nanotubes conduct the heat directionally so as to both distribute the heat over the skin and direct the heat to the outer surface of the skin where the heat can be carried away by air flowing over the skin. The skin may also include conductive carbon foam surrounding the condenser to reduce thermal resistance between the condenser and the facesheets.
摘要翻译：用于去除航空航天车辆上的电气部件产生的热量的冷却系统在从部件移除热量的蒸发器与车辆皮肤内的冷凝器之间流动冷却剂。皮肤由包含多层聚合物树脂的面板形成，所述聚合物树脂用单壁和双壁纳米管的网格增强。纳米管定向地引导热量，以便将热量分布在皮肤上并将热量引导到皮肤的外表面，在该外表面可以通过流过皮肤的空气带走热量。皮肤还可以包括围绕冷凝器的导电碳泡沫，以减少冷凝器和面板之间的热阻。

118. 发明授权

US07616448B2 Wrap-around overmold for electronic assembly 有权
标题翻译：用于电子组装的包装包装
公开(公告)号：US07616448B2
公开(公告)日：2009-11-10
申请号：US11901042
申请日：2007-09-14
申请人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
发明人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
IPC分类号： H05K5/06
CPC分类号： H05K3/284 , H05K3/0061 , H05K3/0064 , H05K5/0034 , H05K5/065 , H05K7/20854 , H05K2201/10189 , H05K2203/1316
摘要： An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.
摘要翻译：改进的包覆成型电子组件包括设置有凹入边缘的背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路装置，电连接器和包覆成型体，其具有围绕背板的侧部并且围绕边缘凹部的周边边缘。所产生的过度包覆功能消除了在电子组件的热循环期间会发生的分层问题，提高了连接器到背板接口处的耐腐蚀性，并且增强了印刷电路板组件和电连接器到组件的固定。

119. 发明申请

US20090147482A1 Electric control device and manufacturing method thereof 失效
标题翻译：电控装置及其制造方法
公开(公告)号：US20090147482A1
公开(公告)日：2009-06-11
申请号：US12292057
申请日：2008-11-12
申请人： Hajime Katsuro
发明人： Hajime Katsuro
IPC分类号： H05K7/20 , H01S4/00
CPC分类号： H05K7/20854 , H05K5/0039 , H05K7/20454 , Y10T29/49002
摘要： An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.
摘要翻译：电气部件安装在电路板上，并且将预发泡的散热构件施加在电气部件上。将电路板插入具有盒形形状的底盘中，其一侧的开口朝向开口的相对侧。预发泡散热构件的厚度小于电气部件的前表面和底座的内表面之间的距离。因此，当电路板插入底架时，预发泡的散热构件不会被刮擦而被去除。然后，将预发泡散热构件加热膨胀直到散热构件到达底盘，并且提供电气部件和底盘之间的散热路径。因此，能够提高电气部件的散热性。

120. 发明申请

US20090086437A1 ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE 失效
标题翻译：使用LC模块结构的电子控制装置
公开(公告)号：US20090086437A1
公开(公告)日：2009-04-02
申请号：US12190624
申请日：2008-08-13
申请人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
发明人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
IPC分类号： H05K5/04 , H05K7/20 , H05K13/00
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
摘要： In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.
摘要翻译：在包括至少包括线圈和电容器的两种或更多种引线插入型部件的电子控制装置中，将部件安装在具有布线，端子结构和机械固定部分的支撑件上; 上述部件的引线分别插入形成在支撑体的布线部分中的孔并与其电连接; 部件和支撑件用粘合材料固定在一起，用于固定; 部件的上表面附着在介于其间的具有低弹性模量的导热材料的金属凹槽; 支撑体的机械固定部分固定在金属凹槽上; 并且支撑件的端子结构电连接到安装至少一个控制元件的电路板。

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