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    • 7. 发明授权
    • Circuit board heat dissipation layering arrangement
    • 电路板散热分层布置
    • US5375039A
    • 1994-12-20
    • US127150
    • 1993-09-27
    • Thomas Wiesa
    • Thomas Wiesa
    • H05K1/02H05K3/42H05K7/20H05H7/20
    • H05K1/0206H05K7/205H05K1/0272H05K2201/0338H05K2201/09054H05K2201/09745H05K3/0061H05K3/42
    • A circuit board layering arrangement is capable of dissipating, into a heat sink, the heat produced by power components mounted on the circuit board, without permitting the short circuiting of electricity between the power components and other components or the heat sink. The arrangement comprises a circuit board, at least one power component and a heat sink. A plurality of through contacts are introduced into the circuit board, and a plurality of conductive tracks are disposed on first and second surfaces of the circuit board. The plurality of conductive tracks include two large-surface conductive tracks, one on each surface of the circuit board. One or more power components are surface-mounted on a first surface of the circuit board on a first large-surface conductive track. The second large-surface conductive track is thermally coupled to the first large-surface conductive track and to the heat sink. A layer of metal, preferably copper, may be disposed between the second large-surface conductive track and the heat sink, and a layer of glass cloth may be disposed between the second large-surface conductive track and the layer of metal.
    • 电路板层叠装置能够将安装在电路板上的功率部件产生的热量散发到散热器中,而不会使功率部件和其它部件或散热器之间的电短路。 该装置包括电路板,至少一个功率部件和散热器。 多个贯通接点被引入到电路板中,并且多个导电轨道设置在电路板的第一和第二表面上。 多个导电轨道包括两个大表面导电轨道,一个在电路板的每个表面上。 一个或多个功率部件被表面安装在第一大表面导电轨道上的电路板的第一表面上。 第二大表面导电轨道热耦合到第一大表面导电轨道和散热器。 可以在第二大表面导电轨道和散热器之间设置金属层,优选铜层,并且可以在第二大表面导电轨道和金属层之间设置一层玻璃布。