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101. 发明申请

US20110192637A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110192637A1
公开(公告)日：2011-08-11
申请号：US13089378
申请日：2011-04-19
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/03
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.
摘要翻译：多层印刷电路板包括：包括树脂层的芯结构和被树脂层夹持的导体电路，所述芯结构具有第一和第二表面，在芯结构的第一表面上包括导体电路的第一导体层，以及第二导体层，包括在芯结构的第二表面上的导体电路。芯结构包括第一和通孔，并且第一和第二通孔分别包括在树脂层中分别填充到各个开口顶部的金属，将一个或多个导体电路夹在芯结构中并垂直定位以形成电连接第一和第二导体层的各个导体电路的通孔以及第一和第二通孔在垂直方向上彼此偏离。

102. 发明申请

US20110036626A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110036626A1
公开(公告)日：2011-02-17
申请号：US12913258
申请日：2010-10-27
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer.
摘要翻译：一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有导体电路的第一导体层，在第一绝缘层的相对表面上具有导体电路的第二导体层，第二绝缘层在第二导体和第一绝缘层上的第二绝缘层和在第二导体层的相对侧的第二绝缘层上具有导体电路的第三导体层。第一绝缘层和第二绝缘层具有第一和第二通孔，其形成在第一和第二绝缘层的开口中，并由填充到开口顶部的导电材料制成，使得第一和第三导体层中的导体电路连接到第二导体层中的一个或多个导体电路，以及第一和第二通孔朝向第二导体层逐渐变细。

103. 发明授权

US07832098B2 Method of manufacturing a multilayered printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07832098B2
公开(公告)日：2010-11-16
申请号：US12098582
申请日：2008-04-07
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H01K3/10
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译：通过激光束在树脂20中形成开口，从而形成通孔。此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。因此，可以提高通孔连接的可靠性。

104. 发明授权

US07800917B2 Printed wiring board 失效
标题翻译：印刷电路板
公开(公告)号：US07800917B2
公开(公告)日：2010-09-21
申请号：US11491604
申请日：2006-07-24
申请人： Hiroshi Shimada , Shigeru Michiwaki , Kazuo Shishime
发明人： Hiroshi Shimada , Shigeru Michiwaki , Kazuo Shishime
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/4661 , H05K3/387 , H05K2201/0209 , H05K2201/0212 , H05K2201/09518 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K2203/1152
摘要： A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer. The first and second wiring layers are electrically connected to each other via at least one through hole. The first wiring layer is united with the first insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface. The second wiring layer is united with the second insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface.
摘要翻译：印刷布线板具有形成在绝缘基板的至少一个表面上的第一布线层，形成为覆盖第一布线层的绝缘层和形成在绝缘层上的第二布线层。绝缘层由包含树脂的高刚性片状增强材料制成的固化绝缘片形成。第一和第二布线层通过具有底部的至少一个孔彼此电连接。第二布线层与绝缘层在其界面处与注入到设置在界面上的凹部中的第二布线层的导电材料相结合。另一种印刷电路板具有分别具有第一表面和第二表面的绝缘基板，分别形成在第一表面和第二表面上的第一绝缘层和第二绝缘层，以及形成在第一绝缘层上的第一布线层和形成在第二绝缘层上的第二布线层。第一和第二布线层经由至少一个通孔彼此电连接。第一布线层与第一绝缘层在其界面处与注入到设置在界面上的凹部中的第一布线层的导电材料结合。第二布线层与第二绝缘层的界面处与第一布线层的导电材料的界面结合，注入到设置在界面上的凹部中。

105. 发明申请

US20080277148A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20080277148A1
公开(公告)日：2008-11-13
申请号：US12171794
申请日：2008-07-11
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/02
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.
摘要翻译：金属层18夹在绝缘层14和20之间，从而保持所需的强度。因此，可以减小芯基板30的厚度，因此可以减小多层印刷电路板的厚度。仅仅需要在绝缘层14和20中到达金属层18的非穿透开口22的形成。因此，通过施加激光束可以容易地形成小的非穿透开口22。因此，可以形成各自具有小直径的通孔36。

106. 发明申请

US20070131243A1 METHOD FOR CLEANING SURFACE OF RESIN LAYER 有权
标题翻译：清洁树脂层表面的方法
公开(公告)号：US20070131243A1
公开(公告)日：2007-06-14
申请号：US11567540
申请日：2006-12-06
申请人： Yoji Asahi , Yuji Yukiiri
发明人： Yoji Asahi , Yuji Yukiiri
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0285 , H05K2203/0773 , H05K2203/0786
摘要： A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided. The method is characterized in that, when a surface of a resin layer on which a metal film is formed by plating is roughened by a desmear treatment and, then, the thus-roughened surface of the resin layer is cleaned, the surface of the resin layer formed with a resin compounded with a filler in an amount of 20 wt % or more such that a difference of a coefficient of thermal expansion between the resin layer and the metal film is allowed to be reduced is roughened by subjecting it to the desmear treatment and, secondly, the filler which is deposited on the thus-roughened surface of the resin layer is removed by ultrasonic cleaning in which ultrasonic vibration of a frequency of from 35 to 50 kHz is applied.
摘要翻译：提供一种清洗树脂层的表面的方法，该树脂层的表面能够通过在含有添加有大量填料的树脂的树脂层上进行去污处理而将通过电镀形成的金属膜的剥离强度充分提高到粗糙化的表面上。该方法的特征在于，当通过电镀将其上形成金属膜的树脂层的表面通过去污处理进行粗糙化，然后清洁树脂层的这样粗糙化的表面时，树脂的表面由树脂层和金属膜之间的热膨胀系数的差减少20重量％以上的与填料混合的树脂形成的层进行粗糙化处理其次，通过施加频率为35〜50kHz的超声波振动的超声波清洗除去沉积在树脂层的粗糙化表面上的填料。

107. 发明申请

US20050178501A1 Process for producing a multi-layer printer wiring board 审中-公开
公开(公告)号：US20050178501A1
公开(公告)日：2005-08-18
申请号：US11058700
申请日：2005-02-16
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08L63/00 , H05K1/00 , H05K3/46 , B32B31/26
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.

108. 发明申请

US20040101626A1 Process for producing porous polyimide resin and porous polymide resin 有权
标题翻译：多孔聚酰亚胺树脂和多孔聚酰胺树脂的制造方法
公开(公告)号：US20040101626A1
公开(公告)日：2004-05-27
申请号：US10380178
申请日：2003-03-13
发明人： Mitsuhiro Kanada , Takahiro Fukuoka , Naotaka Kinjou
IPC分类号： B05D003/02
CPC分类号： C08J9/26 , C08J2201/0502 , C08J2379/08 , H05K1/024 , H05K1/0346 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0156 , H05K2203/0759 , H05K2203/0773
摘要： A method of producing porous polyimide resin that enables pores to be formed in a precursor of polyimide resin, with its form of microphase-separated structure wherein a dispersive compound is dispersed in the precursor of polyimide resin being kept unchanged, so as to provide significantly reduced dielectric constant and also provide improvement in mechanical strength and heat resistance, and the porous polyimide resin produced in the same producing method. A coating comprising porous polyimide resin is formed by applying resin solution comprising a precursor of polyimide resin and a dispersive compound and then drying a solvent, to form a coating in which the dispersive compound is dispersed in the precursor of polyimide resin; extracting the dispersive compound from the coating for removal to make the precursor of the polyimide resin porous; and imidizing the coating after preheated in a temperature range of 190-250null C.
摘要翻译：在聚酰亚胺树脂的前体中形成多孔聚酰亚胺树脂的方法，其形成微相分离结构，其中分散化合物分散在聚酰亚胺树脂的前体中保持不变，从而显着降低介电常数并且还提供机械强度和耐热性的改善，以及以相同的制造方法制造的多孔聚酰亚胺树脂。包含多孔聚酰亚胺树脂的涂层是通过涂布包括聚酰亚胺树脂前体和分散化合物的树脂溶液形成的，然后干燥溶剂，形成其中分散化合物分散在聚酰亚胺树脂的前体中的涂层; 从涂层中提取分散化合物以除去以使聚酰亚胺树脂的前体多孔; 并在190-250℃的温度范围内预热后对涂层进行酰亚胺化

109. 发明授权

US06607825B1 Metal film bonded body, bonding agent layer and bonding agent 失效
标题翻译：金属膜涂层体，粘合剂层和粘合剂
公开(公告)号：US06607825B1
公开(公告)日：2003-08-19
申请号：US08894376
申请日：1997-08-22
申请人： Dong Dong Wang , Motoo Asai
发明人： Dong Dong Wang , Motoo Asai
IPC分类号： B32B712
CPC分类号： B32B15/08 , B32B7/12 , H05K3/0023 , H05K3/181 , H05K3/4661 , H05K2201/0129 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , Y10T428/25 , Y10T428/256 , Y10T428/28 , Y10T428/2804 , Y10T428/287 , Y10T428/2878 , Y10T442/64
摘要： As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.
摘要翻译：作为能够稳定地提供具有优异剥离强度的印刷电路板的各种金属膜粘合体的技术，即使在具有更高密度和更高图案精度的布线等工业部件中，也提供了粘合剂，粘合剂层和金属膜粘合体作为构成粘合剂的耐热树脂基质，使用由热塑性树脂和包含在其官能团的一部分被感光性基团取代的树脂和/或未固化的感光性树脂组成的未固化的热固性树脂的混合树脂使用形成准均相相容结构，共连续相结构或球形结构的固化均匀树脂复合材料作为粘合层的耐热树脂基体。

110. 发明授权

US06518331B2 Composition of epoxy resins and curing agent capable of being coarsened 失效
标题翻译：环氧树脂和能够粗化的固化剂的组成
公开(公告)号：US06518331B2
公开(公告)日：2003-02-11
申请号：US09729211
申请日：2000-12-05
申请人： Akio Sekimoto , Shinichi Yamada
发明人： Akio Sekimoto , Shinichi Yamada
IPC分类号： B32B3126
CPC分类号： H05K3/4661 , C08G59/226 , C08G59/38 , C08L9/00 , C08L17/00 , C08L63/00 , H05K2201/0133 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796 , Y10S428/901 , Y10T156/1056 , C08L2666/08
摘要： A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer. The curable resin composition comprises (A) epoxy resins and (B) an epoxy resin curing agent as essential components thereof and optionally contains a rubber component and a filler capable of being decomposed or dissolved by a coarsening agent. This composition contains in combination a bisphenol A type epoxy resin having an epoxy equivalent of not less than 400 and an epoxy resin having an epoxy equivalent of less then 400.
摘要翻译：公开了一种多层印刷电路板，其具有树脂绝缘层和导体层，交替地重叠在电路板上，具有足够的粘合强度，其制备方法和用于形成树脂绝缘层的固化树脂组合物。多层印刷电路板的制造通过将可固化树脂组合物施加到电路板的导体层的表面上，热固化所施加的层，从而形成树脂绝缘层，然后在电路板中钻孔，处理具有粗化剂的树脂绝缘层由此赋予波浪粗化表面，随后通过化学镀将导体层涂覆树脂绝缘层的表面和通孔的内表面，然后在其中形成规定的电路图案导体层。可固化树脂组合物包含（A）环氧树脂和（B）环氧树脂固化剂作为其主要组分，并且任选地包含能够被粗化剂分解或溶解的橡胶组分和填料。该组合物组合含有环氧当量不小于400的双酚A型环氧树脂和环氧当量小于400的环氧树脂。

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