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1. 发明授权

US08034188B2 Method for cleaning surface of resin layer 有权
标题翻译：清洗树脂层表面的方法
公开(公告)号：US08034188B2
公开(公告)日：2011-10-11
申请号：US11567540
申请日：2006-12-06
申请人： Yoji Asahi , Yuji Yukiiri
发明人： Yoji Asahi , Yuji Yukiiri
IPC分类号： B08B3/08 , B08B3/12
CPC分类号： B08B3/12 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0285 , H05K2203/0773 , H05K2203/0786
摘要： A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided.
摘要翻译：提供一种清洗树脂层的表面的方法，该树脂层的表面能够通过在含有添加有大量填料的树脂的树脂层上进行去污处理而将通过电镀形成的金属膜的剥离强度充分提高到粗糙化的表面上。

2. 发明申请

US20070131243A1 METHOD FOR CLEANING SURFACE OF RESIN LAYER 有权
标题翻译：清洁树脂层表面的方法
公开(公告)号：US20070131243A1
公开(公告)日：2007-06-14
申请号：US11567540
申请日：2006-12-06
申请人： Yoji Asahi , Yuji Yukiiri
发明人： Yoji Asahi , Yuji Yukiiri
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0285 , H05K2203/0773 , H05K2203/0786
摘要： A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided. The method is characterized in that, when a surface of a resin layer on which a metal film is formed by plating is roughened by a desmear treatment and, then, the thus-roughened surface of the resin layer is cleaned, the surface of the resin layer formed with a resin compounded with a filler in an amount of 20 wt % or more such that a difference of a coefficient of thermal expansion between the resin layer and the metal film is allowed to be reduced is roughened by subjecting it to the desmear treatment and, secondly, the filler which is deposited on the thus-roughened surface of the resin layer is removed by ultrasonic cleaning in which ultrasonic vibration of a frequency of from 35 to 50 kHz is applied.
摘要翻译：提供一种清洗树脂层的表面的方法，该树脂层的表面能够通过在含有添加有大量填料的树脂的树脂层上进行去污处理而将通过电镀形成的金属膜的剥离强度充分提高到粗糙化的表面上。该方法的特征在于，当通过电镀将其上形成金属膜的树脂层的表面通过去污处理进行粗糙化，然后清洁树脂层的这样粗糙化的表面时，树脂的表面由树脂层和金属膜之间的热膨胀系数的差减少20重量％以上的与填料混合的树脂形成的层进行粗糙化处理其次，通过施加频率为35〜50kHz的超声波振动的超声波清洗除去沉积在树脂层的粗糙化表面上的填料。

3. 发明申请

US20060273074A1 LASER MACHINING METHOD AND LASER MACHINING MACHINE 审中-公开
标题翻译：激光加工方法和激光加工机
公开(公告)号：US20060273074A1
公开(公告)日：2006-12-07
申请号：US11421596
申请日：2006-06-01
申请人： Yoji Asahi
发明人： Yoji Asahi
IPC分类号： B23K26/38
CPC分类号： B23K26/382 , B23K26/08 , B23K2103/50 , H05K3/0008 , H05K3/0026 , H05K2203/1476
摘要： The position data column to move the laser beam is formed by assigning each position coordinate to the holes H11 and H12 in a T1 code one by one, assigning each position coordinate the holes H21 and H22 in a T2 code two by two, and assigning the position coordinate to the hole H31 in a T3 code three by three. The laser beam is moved on the substrate sequentially from the end as indicated by arrows of movement 1 to movement 5. Then, H11 is irradiated with 1 shot of the laser beam that is converged into a minimum diameter among plural types of hole diameters, H21 is irradiated with 2 shots, H31 is irradiated with 3 shots, H12 is irradiated with 1 shot of the laser beam, and H22 is irradiated with 2 shots. When the laser beam is irradiated one shot by one shot by the number of position data in response to a size of the hole diameter, the holes having different hole diameters can be formed.
摘要翻译：移动激光束的位置数据列通过以T1代码逐个分配每个位置坐标到孔H 11和H 12而形成，每个位置坐标将孔H21和H22分配成T2代码2 并且以T3×3为单位将位置坐标分配给孔H 31。激光束从运动1的箭头所示的端部顺序地移动到基板5上。然后，用1次激光束照射H 11，其中会聚到多种孔径中的最小直径中，用2次照射照射H 21，用3次照射照射H 31，用1次照射H 12 的激光束，H 2 2照射2次。当激光束根据孔径的大小一次一次地照射位置数据的数量时，可以形成具有不同孔直径的孔。

4. 发明申请

US20070151960A1 Counterboring method with carbon dioxide gas laser 审中-公开
标题翻译：二氧化碳气体激光打孔方法
公开(公告)号：US20070151960A1
公开(公告)日：2007-07-05
申请号：US11637813
申请日：2006-12-13
申请人： Yoji Asahi
发明人： Yoji Asahi
IPC分类号： B23K26/38
CPC分类号： H05K3/0035 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/12 , B23K2103/16 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0373 , H05K2201/0209 , H05K2203/0207
摘要： When a counterboring method where a laser beam of a carbon dioxide gas laser is irradiated on a resin layer 34 that covers a pad formed on a surface of a first resin layer 30 and electrically connected to a conductor pattern 32 to partially remove the resin layer 34 to expose a pad surface is applied, in order to heighten the durability to the laser beam of the carbon dioxide gas laser of the resin layer 30 more than that of the resin layer 34, a compounding ratio of the filler in the resin layer 30 is increased more than that in the resin layer 34 and energy of the laser beam of the carbon dioxide gas laser irradiated on the resin layer 34 is controlled so as not to apply the laser processing to the resin layer 30.
摘要翻译：当将二氧化碳气体激光器的激光束照射在覆盖形成在第一树脂层30的表面上并与导体图案32电连接以部分地去除树脂层34的焊盘的树脂层34上的对置方法为了露出衬垫表面，为了提高树脂层30的二氧化碳气体激光器的激光束比树脂层34的耐久性，树脂层30中的填料的配合比为比在树脂层34中增加更多，并且控制照射在树脂层34上的二氧化碳气体激光的激光束的能量，以便不对树脂层30施加激光加工。

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