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91. 发明申请

US20040047118A1 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device 失效
标题翻译：组件由面板式构造的模块和连接单元，生产方法和装置组成
公开(公告)号：US20040047118A1
公开(公告)日：2004-03-11
申请号：US10415267
申请日：2003-04-28
发明人： Eduard Bergmann , Herwie Rilling , Peter Westermayr , Clemens Hofbauer , Boris Klebensberger , Karsten Wambach
IPC分类号： H05K005/00
CPC分类号： H05K3/202 , H01L31/02013 , H01R13/24 , H01R13/665 , H01R43/24 , H02S40/34 , H02S40/345 , H05K1/187 , H05K2201/0397 , H05K2201/09118 , H05K2201/10651 , Y02E10/50 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49169 , Y10T29/49174 , Y10T29/49179 , Y10T29/53174 , Y10T29/53209 , Y10T29/53265
摘要： An arrangement comprising a panel-like electrical/electronic module 7 having a flat surface with openly contactable connecting sections AS as part of an essentially flat printed conductor structure for the electrical connection of the module 7, and comprising a connection unit 1 having electrical/electronic elements D located on a printed conductor structure 2 situated in a plane parallel to the printed conductor structure of the module 7 and provided with means for contacting connecting sections of the module, so that the module is electrically connectable via the connection unit, characterized in that the means for contacting the connecting sections AS of the module 7 are bent out from the plane of the printed conductor structure 2, and a portion of the connecting sections AA representing the printed conductor structure and the connecting sections AS of the module 7 are rigid electrical conductor sections AS which can be bent out of the plane of the printed conductor structure of the module 7, the connecting sections AA of the connection unit 1 being situated corresponding to the arrangement of the connecting sections AS of the module 7, so that for the connection unit 1 connected to the module 7, each connecting section AS of the module 7 is electrically connected to a connecting section of the connection unit 1 and these adjoin one another in one section, and in this adjoining region are situated in a different spatial position than that of the planes of the printed conductor structures 2. The invention further relates to a connection unit for such an arrangement, and to a method of producing such an arrangement. The invention further relates to a method of joining a connection unit to a panel-like module for producing such an arrangement, and to a device for joining a connection unit to a panel-like module for manufacturing such an arrangement.
摘要翻译：一种包括具有平坦表面的面板式电气/电子模块7的装置，其具有可开放接触的连接部分AS，作为用于模块7的电连接的基本平坦的印刷导体结构的一部分，并且包括具有电气/电子的连接单元1 元件D位于印刷导体结构2上，位于与模块7的印刷导体结构平行的平面中，并且设置有用于接触模块的连接部分的装置，使得模块经由连接单元可电连接，其特征在于：用于接触模块7的连接部分AS的装置从印刷导体结构2的平面弯曲出来，代表印刷导体结构的连接部分AA的一部分和模块7的连接部分AS是刚性电气导体部分AS可以弯曲出印刷导体结构的平面模块7，连接单元1的连接部分AA对应于模块7的连接部分AS的布置，使得对于连接到模块7的连接单元1，模块7的每个连接部分AS是电连接到连接单元1的连接部分，并且它们在一个部分中彼此相邻，并且在该邻接区域处于与印刷的导体结构2的平面的空间位置不同的空间位置。本发明还涉及用于这种布置的连接单元，以及制造这种布置的方法。本发明还涉及将连接单元连接到用于制造这种布置的面板状模块的方法，以及用于将连接单元连接到用于制造这种布置的面板状模块的装置。

92. 发明申请

US20030223205A1 Method of producing an electronic device and electronic device 有权
标题翻译：电子设备和电子设备的制造方法
公开(公告)号：US20030223205A1
公开(公告)日：2003-12-04
申请号：US10400194
申请日：2003-03-26
发明人： Ralf Jaklin , Werner Wallrafen
IPC分类号： H05K007/02 , H05K007/06 , H05K007/08 , H05K007/10
CPC分类号： H05K3/202 , B29C45/14639 , B29C45/14836 , G01P1/026 , H05K1/187 , H05K5/064 , H05K2201/0382 , H05K2201/062 , H05K2201/09118 , H05K2201/0999 , H05K2201/2009
摘要： The subject-matter of the invention is a method of producing an electronic device, with a stamped sheet-metal part loaded with electronic components being encapsulated in a thermoplastic, insulating material to provide protection against environmental influences, and also an electronic device comprising electronic components arranged on a stamped sheet-metal part and electrically connected to one another by said part, the stamped sheet-metal part and the electronic components being encapsulated in a thermoplastic, insulating material by the injection-molding process. To provide a device with which protection of the electronic components during encapsulation is ensured, the stamped sheet-metal part (2) has at least one region (3) similar to a protective shield, under which the electronic components are arranged, and the electronic components (4) are arranged downstream of the stamped sheet-metal part (2) in the direction of injection pressure (9) of the heated, thermoplastic, insulating material (5).
摘要翻译：本发明的主题是制造电子装置的方法，其中装有电子部件的冲压的金属板部件被封装在热塑性绝缘材料中以提供防止环境影响的保护，以及包括电子部件的电子装置布置在冲压的金属板上并通过所述部分彼此电连接，冲压的金属板部件和电子部件通过注射成型工艺封装在热塑性绝缘材料中。为了提供确保在封装期间对电子部件进行保护的装置，冲压的金属板部件（2）具有至少一个类似于保护屏蔽的区域（3），电子部件布置在该保护屏蔽下，电子部件部件（4）沿被加热的热塑性绝缘材料（5）的注射压力（9）的方向布置在冲压的金属板部分（2）的下游。

93. 发明授权

US6038133A Circuit component built-in module and method for producing the same 有权
公开(公告)号：US6038133A
公开(公告)日：2000-03-14
申请号：US196792
申请日：1998-11-20
申请人： Seiichi Nakatani , Kouichi Hirano
发明人： Seiichi Nakatani , Kouichi Hirano
IPC分类号： G06F17/30 , H01L21/56 , H01L23/14 , H01L23/31 , H01L25/065 , H01L25/10 , H04L29/08 , H05K1/18 , H05K3/20 , H05K3/40 , H05K3/46 , H05K1/03
CPC分类号： H05K1/187 , G06F17/3089 , H01L21/56 , H01L23/145 , H01L23/3121 , H01L25/0652 , H01L25/105 , H01L25/16 , H04L69/329 , H05K1/188 , H05K3/4617 , H01L2224/16 , H01L2224/45144 , H01L2225/1035 , H01L2225/1058 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/3025 , H05K2201/0209 , H05K2201/10378 , H05K3/20 , H05K3/4069 , H05K3/4652 , H05K3/4658 , Y10S428/901 , Y10T156/109 , Y10T428/24893 , Y10T428/24917
摘要： A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.

94. 发明授权

US2399753A Multiple connections for electrical apparatus 失效
标题翻译：电器多重连接
公开(公告)号：US2399753A
公开(公告)日：1946-05-07
申请号：US52628644
申请日：1944-03-13
申请人： INT STANDARD ELECTRIC CORP
发明人： MCLARN ERNEST S
IPC分类号： H01R9/28 , H05K1/18 , H05K3/20 , H05K3/32
CPC分类号： H01R9/28 , H05K1/187 , H05K3/202 , H05K3/328 , H05K2201/10318 , H05K2203/1115 , H05K2203/175 , Y10T29/49156

95. 发明申请

US20170071061A1 Circuit board structure and method for manufacturing a circuit board structure 审中-公开
标题翻译：用于制造电路板结构的电路板结构和方法
公开(公告)号：US20170071061A1
公开(公告)日：2017-03-09
申请号：US15355096
申请日：2016-11-18
申请人： GE Embedded Electronics Oy
发明人： Risto Tuominen , Antti Iihola , Petteri Palm
IPC分类号： H05K1/18 , H01L23/538 , H01L23/00 , H01L21/56 , H05K3/30 , H05K3/28 , H01L21/48 , H01L23/544 , H05K3/06 , H05K3/32
CPC分类号： H05K3/064 , H01L21/4846 , H01L21/56 , H01L21/568 , H01L23/13 , H01L23/5389 , H01L23/544 , H01L24/16 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/16 , H01L2224/18 , H01L2224/24227 , H01L2224/2929 , H01L2224/293 , H01L2224/81121 , H01L2224/81132 , H01L2224/81192 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83851 , H01L2224/9211 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H05K1/183 , H05K1/187 , H05K1/188 , H05K3/205 , H05K3/284 , H05K3/303 , H05K3/305 , H05K3/32 , H05K3/321 , H05K3/4069 , H05K2201/0355 , H05K2201/09563 , H05K2201/0969 , H05K2201/10674 , H05K2201/10977 , H05K2203/0353 , H05K2203/063 , H05K2203/0723 , Y02P70/613 , Y10T29/4913 , H01L2224/29075 , H01L2924/00 , H01L2224/0401
摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.
摘要翻译：本公开公开了一种制造电路板结构的方法。在该方法中，制造导体层，其在导体箔的表面上包括导体箔和导体图案。将一个部件连接到导体层，并且导体层被薄化，使得导体层的导体材料从导体图案的外面去除。

96. 发明授权

US09305809B1 Integrated circuit packaging system with coreless substrate and method of manufacture thereof 有权
标题翻译：具有无芯基板的集成电路封装系统及其制造方法
公开(公告)号：US09305809B1
公开(公告)日：2016-04-05
申请号：US14316461
申请日：2014-06-26
申请人： Emmanuel Espiritu , Allan Pumatong Ilagan , Jeffrey David Punzalan
发明人： Emmanuel Espiritu , Allan Pumatong Ilagan , Jeffrey David Punzalan
IPC分类号： H01L23/34 , H01L21/44 , H01L21/48 , H01L23/12 , H01L23/00 , H01L21/56 , H01L23/538 , H01L23/28
CPC分类号： H01L21/486 , H01L23/12 , H01L23/3128 , H01L23/3677 , H01L23/49816 , H01L23/50 , H01L23/5384 , H01L25/065 , H01L2224/04042 , H01L2224/131 , H01L2224/16227 , H01L2224/16238 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/15311 , H05K1/187 , H05K3/4046 , H05K3/4647 , H05K3/4682 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00012 , H01L2924/014
摘要： An integrated circuit packaging system and method of manufacture thereof includes: discrete components coupled to a top trace; vias attached to the top trace separated from the discrete components; a dielectric layer on the top trace, the discrete components, and the vias, includes a component surface formed above the discrete components, with the top trace coplanar with the dielectric layer; and system interconnects coupled to the vias for electrically connecting the top trace, the discrete components, or a combination thereof to the system interconnects.
摘要翻译：集成电路封装系统及其制造方法包括：耦合到顶部迹线的分立元件; 连接到从离散部件分离的顶部迹线的通孔; 顶部迹线上的电介质层，分立元件和通孔包括形成在分立元件上方的元件表面，顶部迹线与电介质层共面; 以及耦合到通孔的系统互连，用于将顶部迹线，分立组件或其组合电连接到系统互连件。

97. 发明申请

US20150382469A1 PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：包装设备及其制造方法
公开(公告)号：US20150382469A1
公开(公告)日：2015-12-31
申请号：US14492716
申请日：2014-09-22
申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.
发明人： Chu-Chin HU , Shih-Ping HSU , E-Tung CHOU
IPC分类号： H05K1/18 , H05K3/40 , H05K3/28 , H05K1/14 , H05K3/34
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49816 , H01L23/49838 , H01L23/5389 , H01L24/00 , H01L2224/16227 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H05K1/115 , H05K1/187 , H05K1/188 , H05K3/0014 , H05K3/0017 , H05K3/007 , H05K3/16 , H05K3/181 , H05K3/284 , H05K3/421 , H05K2201/0162 , H05K2201/0209 , H05K2201/09118 , H05K2201/09536 , H05K2201/09563 , H05K2201/09636 , H05K2201/09854 , H05K2203/025 , H05K2203/0369 , H05K2203/0723 , H05K2203/0733 , H05K2203/1316 , H05K2203/1461 , H05K2203/1469 , H01L2924/00012 , H01L2224/81
摘要： A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface that are arranged opposite to each other. The first conductive pillar layer is disposed on the second surface of the first wiring layer, whereas the first conductive pillar layer is a non-circular conductive pillar layer. The first molding compound layer is disposed within a specific portion of the first wiring layer and the first conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the first conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer.
摘要翻译：包装装置包括第一布线层，第一导电柱层，第一模塑料层，第二布线层和保护层。第一布线层具有彼此相对布置的第一表面和第二表面。第一导电柱层设置在第一布线层的第二表面上，而第一导电柱层是非圆形导电柱层。第一模塑料层设置在第一布线层和第一导电柱层的特定部分内。第二布线层设置在第一模塑料层和第一导电柱层的一端。保护层设置在第一模塑料层和第二布线层上。

98. 发明授权

US09198296B1 Double sided board with buried element and method for manufacturing the same 有权
标题翻译：具有埋设元件的双面板及其制造方法
公开(公告)号：US09198296B1
公开(公告)日：2015-11-24
申请号：US14590235
申请日：2015-01-06
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Ting-Hao Lin , Yu-Te Lu , Fu-Song Chen
IPC分类号： H05K1/18 , H05K1/03 , H05K1/11 , H05K1/02
CPC分类号： H05K1/187 , H05K1/0213 , H05K1/0298 , H05K1/115 , H05K1/183 , H05K1/185 , H05K2201/0376
摘要： A double sided board with buried element and a method for manufacturing the same are disclosed. At least one buried element is fixed on a dielectric layer and embedded in an insulation layer. First and second electrical circuits are formed on upper and lower surfaces of the insulation layer, respectively. At least one through-hole is formed in the insulation layer and filled with a conductive layer to electrically connect the first and the second electrical circuits. The dielectric layer beneath the buried element and the insulation layer above the buried element are provided with at least one opening, respectively, which is filled with the conductive layer, thereby connecting the conductive layer and external circuits or electrical elements. Additionally, the first and second electrical circuits are covered with first and second solder masks, respectively, so as to avoid environmental effect and improve preciseness of the circuits.
摘要翻译：公开了一种具有埋设元件的双面板及其制造方法。至少一个埋入元件固定在电介质层上并嵌入绝缘层中。第一和第二电路分别形成在绝缘层的上表面和下表面上。在绝缘层中形成至少一个通孔，并填充有导电层以电连接第一和第二电路。掩埋元件下面的绝缘层和掩埋元件上方的绝缘层分别设置有至少一个开口，其中填充有导电层，由此连接导电层和外部电路或电气元件。此外，第一和第二电路分别被第一和第二焊接掩模覆盖，以避免环境影响并提高电路的精度。

99. 发明授权

US09153541B2 Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same 有权
标题翻译：具有安装在绝缘膜上并与布线层耦合的半导体芯片的半导体器件及其制造方法
公开(公告)号：US09153541B2
公开(公告)日：2015-10-06
申请号：US12032444
申请日：2008-02-15
申请人： Junji Tanaka
发明人： Junji Tanaka
IPC分类号： H01L23/02 , H01L23/495 , H01L23/48 , H01L23/52 , H01L23/12 , H01L23/053 , H01L29/40 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/18 , H01L25/03 , H05K1/11 , H05K3/20 , H01L23/00
CPC分类号： H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H05K1/113 , H05K1/187 , H05K3/20 , H05K2201/09509 , H05K2201/09527 , H05K2203/049 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a first insulator film having a first opening, a first wiring layer extending from the first opening onto the first insulator film, a first semiconductor chip mounted on the first insulator film so as to be electrically coupled with the first wiring layer, and a resin portion applied on the first insulation film to cover the first semiconductor chip.
摘要翻译：半导体器件包括具有第一开口的第一绝缘膜，从第一开口延伸到第一绝缘膜上的第一布线层，安装在第一绝缘膜上以与第一布线层电耦合的第一半导体芯片，以及施加在第一绝缘膜上以覆盖第一半导体芯片的树脂部分。

100. 发明申请

US20150060920A1 Wiring Substrate and Light Emitting Device 有权
标题翻译：接线基板和发光装置
公开(公告)号：US20150060920A1
公开(公告)日：2015-03-05
申请号：US14459621
申请日：2014-08-14
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Yasuyoshi HORIKAWA
IPC分类号： H01L33/60 , H05K1/02 , H05K1/18 , H01L33/62
CPC分类号： H01L33/60 , H01L24/45 , H01L25/167 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H05K1/0274 , H05K1/056 , H05K1/187 , H05K1/188 , H05K2201/0376 , H05K2201/10106 , H05K2201/10174 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2924/00
摘要： A wiring substrate includes an insulation layer, separated wires formed on a first surface of the insulation layer, a first plating layer formed on a first surface of each of the wires, a reflection layer including a first opening that exposes at least a portion of the first plating layer as a connection pad, and an electronic component mounted on a second surface of each of the wires, which is located on an opposite side of the first surface of each of the wires. The electronic component is embedded in the insulation layer.
摘要翻译：布线基板包括绝缘层，形成在绝缘层的第一表面上的分离线，形成在每条导线的第一表面上的第一镀层，包括第一开口的反射层，该第一开口暴露至少一部分第一电镀层作为连接焊盘，以及电子部件，其安装在每个电线的第二表面上，该电子部件位于每个电线的第一表面的相对侧上。电子部件嵌入绝缘层。

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