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91. 发明授权

US08570482B2 Self assembly of elements for displays 有权
公开(公告)号：US08570482B2
公开(公告)日：2013-10-29
申请号：US12590779
申请日：2009-11-13
申请人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
发明人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
IPC分类号： G02F1/13
CPC分类号： H01L25/046 , H01L24/95 , H01L2224/95136 , H01L2224/95144 , H01L2224/95145 , H01L2224/95147 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , Y10T156/10 , H01L2924/00
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light emitting elements are disclosed. Display elements having different light emitting and self-organizing characteristics may be used during display assembly.

92. 发明授权

US08318595B2 Self-assembled electrical contacts 有权
标题翻译：自组装电气触点
公开(公告)号：US08318595B2
公开(公告)日：2012-11-27
申请号：US12625189
申请日：2009-11-24
申请人： Christopher J. Morris , Mandan Dubey
发明人： Christopher J. Morris , Mandan Dubey
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L24/14 , H01L24/95 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13111 , H01L2224/1412 , H01L2224/29111 , H01L2224/81192 , H01L2224/81234 , H01L2224/81815 , H01L2224/83192 , H01L2224/83815 , H01L2224/95085 , H01L2224/95101 , H01L2224/95145 , H01L2224/95146 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H05K3/3463 , H05K3/3494 , H05K2203/047 , H05K2203/0475 , H05K2203/048 , H05K2203/0776 , Y02P70/613 , H01L2924/0105 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site.
摘要翻译：自组装微电子电气和机械连接包括部分结合位点和部分电连接位点; 和包含模板电导体层的模板结合位点; 模板电导体层上的金属化层; 包括位于金属化层上的焊料合金的凸块结构，其中焊料合金被液化以允许凸块结构使用毛细力力自组装和与部件电连接部位对齐，并且其中焊料合金仅在温度高于执行自组装和对准的位置; 以及在所述模板电导体层上的流体，其中所述流体包括低于所述焊料合金的熔点，其中所述流体与所述部分结合位点结合。

93. 发明授权

US08312619B2 Micro-assembler 有权
公开(公告)号：US08312619B2
公开(公告)日：2012-11-20
申请号：US12754254
申请日：2010-04-05
申请人： Eugene M. Chow , Jeng Ping Lu , Meng H. Lean , David K. Biegelsen
发明人： Eugene M. Chow , Jeng Ping Lu , Meng H. Lean , David K. Biegelsen
IPC分类号： B23P19/00
CPC分类号： B81C99/002 , H01L24/95 , H01L2224/95085 , H01L2224/95145 , H01L2924/14 , H01L2924/1461 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

94. 发明申请

US20120269971A1 METHOD FOR DISPOSING A COMPONENT 有权
标题翻译：处理组件的方法
公开(公告)号：US20120269971A1
公开(公告)日：2012-10-25
申请号：US13540237
申请日：2012-07-02
申请人： Hidekazu ARASE
发明人： Hidekazu ARASE
IPC分类号： B05D5/00
CPC分类号： H01L24/95 , B81C3/005 , B81C2203/055 , H01L2224/95085 , H01L2224/95143 , H01L2224/95145 , H01L2924/15788 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49131 , Y10T29/49133 , H01L2924/00
摘要： Provided is a method for disposing a component on a substrate (100), the method comprising steps of: a step (a) of preparing the substrate (100), a first liquid, and a component-dispersing liquid; a step (b) of applying the first liquid to the substrate (100) along the +X direction continuously to dispose the first liquid on hydrophilic lines (112) and hydrophilic body regions (111) along the +X direction alternately; a step (c) of bringing the component-dispersing liquid in contact with the first liquid disposed on the hydrophilic region (111); and a step (d) of removing the first liquid and the second liquid from the substrate (100) to dispose the component on the hydrophilic region (111).
摘要翻译：提供了一种在基板（100）上设置部件的方法，所述方法包括以下步骤：制备基板（100），第一液体和分散分散液体的步骤（a）沿着+ X方向连续地将第一液体施加到衬底（100）上以将第一液体沿着+ X方向交替地设置在亲水线（112）和亲水体区域（111）上的步骤（b）使成分分散液与配置在亲水区域（111）上的第一液体接触的工序（c）。以及从基板（100）去除第一液体和第二液体以将组分置于亲水区域（111）上的步骤（d）。

95. 发明授权

US08187667B2 Method for disposing a component 有权
标题翻译：配置组件的方法
公开(公告)号：US08187667B2
公开(公告)日：2012-05-29
申请号：US13149252
申请日：2011-05-31
申请人： Hidekazu Arase
发明人： Hidekazu Arase
IPC分类号： B05D5/12 , H05K3/20 , H05K3/30
CPC分类号： H01L24/95 , H01L2224/02135 , H01L2224/04026 , H01L2224/83143 , H01L2224/83192 , H01L2224/95085 , H01L2224/95145 , H01L2224/95146 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01093 , H01L2924/09701 , H01L2924/15788 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , H01L2924/00
摘要： A method for disposing a component comprises: a step of preparing a substrate and a first liquid; a step of preparing a component-containing liquid containing the components and a second liquid; a step of disposing the first liquid in a hydrophilic region; a step of bringing the component-containing liquid into contact with the first liquid disposed on the hydrophilic region; a step of removing the first liquid and the second liquid to dispose the component on the hydrophilic region. The hydrophilic region is composed of a component-disposing region and a liquid-capturing region formed on the periphery of the component-disposing region. The liquid-capturing region comprises a surface represented by X—(CH2)nS-(substrate) or Y—(CH2)n—S-(substrate), where X represents N+R3Q− (Q represents Cl, Br, or I), OR, or halogen atom, R represents lower alkyl group, n represents a natural number of not less than 1 and not more than 3, Y represents COOH or OH, and m represents a natural number of not less than 1 and not more than 22.
摘要翻译：一种配置组件的方法包括：准备基板和第一液体的步骤; 制备含有成分的成分液体和第二液体的工序; 将第一液体设置在亲水区域中的步骤; 使含有成分的液体与设置在亲水区域上的第一液体接触的工序; 去除第一液体和第二液体以将组分置于亲水区域上的步骤。亲水区域由形成在部件配置区域的周边的部件配置区域和液体捕获区域构成。液体捕获区包括由X-（CH 2）n -S-（底物）或Y-（CH 2）n -S-（底物）表示的表面，其中X表示N + R 3 Q-（Q表示Cl，Br或I ），OR或卤素原子，R表示低级烷基，n表示1以上3以下的自然数，Y表示COOH或OH，m表示1以上的自然数，比22。

96. 发明申请

US20110300643A1 Method of assembling displays on substrates 有权
公开(公告)号：US20110300643A1
公开(公告)日：2011-12-08
申请号：US13134269
申请日：2011-06-02
申请人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, JR. , Victoria Y.H. Wood
发明人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, JR. , Victoria Y.H. Wood
IPC分类号： H01L21/66
CPC分类号： G09F9/30 , G09F21/02 , H01L24/95 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light-modulating elements are disclosed. Display elements having different light-modulating and self-assembling characteristics may be used during display assembly and operation.

97. 发明申请

US20110197429A1 Method of Magnetically Driven Simultaneous Assembly 审中-公开
标题翻译：磁驱动同时装配方法
公开(公告)号：US20110197429A1
公开(公告)日：2011-08-18
申请号：US12705985
申请日：2010-02-16
申请人： Nuggehalli Ravindra
发明人： Nuggehalli Ravindra
IPC分类号： H01S4/00
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/83 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2224/75102 , H01L2224/7598 , H01L2224/83001 , H01L2224/83143 , H01L2224/83192 , H01L2224/95053 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/1461 , Y10T29/49002 , H01L2924/00
摘要： Magnetically Driven Simultaneous Assembly is a method for the integration of devices onto substrates. It is a non-statistical, fully controllable and deterministic, simultaneous method of assembly with error checking and handling that is capable of scalable, versatile, and high-yield integration. The method employs a combination of magnetic and gravitational forces (as well as a bonding agent) to assemble devices onto substrates. Devices, coated with a layer of a soft magnetic material, are moved from an initial to a final location by the action of an array of electromagnets above a template. Various devices of arbitrary geometries, with different physical properties and functionalities, are positioned simultaneously above specific desired locations and dropped onto a template under the action of gravity by locally weakening the applied magnetic field. Desired locations on the template correspond to sites on a substrate that contain recesses matching the specifics of the devices. When all desired devices are placed on top of the template, a substrate is brought into contact with that template and devices are transferred from the template to the substrate (for example, by pressing or by rolling). Devices are physically secured onto a substrate by a bonding agent (such as a layer of an adhesive or a hard magnetic material) applied inside of the recesses. Sensors monitor the accuracy of the placement of devices on a template and provide continuous, real-time feedback to an external control unit that automates the process of assembly. If devices are not situated properly on a template, then a specified technique is employed to correct such errors before the final process transfers the devices onto a substrate, thus assuring an accurate, 100% yield.
摘要翻译：磁驱动同时装配是将装置集成到基板上的一种方法。它是一种非统计的，完全可控的和确定性的，同时的组装方法，具有可扩展，多功能和高产出集成的错误检查和处理能力。该方法采用磁力和重力的组合（以及粘合剂）将装置组装到基底上。涂覆有软磁性材料层的装置通过模板上方的电磁体阵列的作用从初始位置移动到最终位置。具有不同物理性质和功能的任意几何形状的各种装置同时位于特定的所需位置之上并通过局部削弱所施加的磁场而在重力作用下落到模板上。模板上的所需位置对应于基板上包含与设备细节匹配的凹槽的位置。当将所有所需的装置放置在模板的顶部时，使衬底与该模板接触，并且将装置从模板转移到衬底（例如通过压制或通过轧制）。设备通过施加在凹部内部的粘合剂（例如粘合剂层或硬磁性材料层）物理地固定在基底上。传感器监控模板上设备放置的准确性，并为外部控制单元提供连续的实时反馈，从而使组装过程自动化。如果设备没有正确地放置在模板上，那么在最终的工艺将器件转移到衬底上之前，采用指定的技术来纠正这些错误，从而确保了100％的准确率。

98. 发明申请

US20100266769A1 COMPONENT MOUNTING METHOD 有权
标题翻译：组件安装方法
公开(公告)号：US20100266769A1
公开(公告)日：2010-10-21
申请号：US12827255
申请日：2010-06-30
申请人： Hidekazu ARASE , Tohru Nakagawa , Hiroyuki Masuda
发明人： Hidekazu ARASE , Tohru Nakagawa , Hiroyuki Masuda
IPC分类号： B05D1/28
CPC分类号： H05K3/303 , G02F1/1368 , H01L24/95 , H01L25/0655 , H01L2224/83192 , H01L2224/95085 , H01L2224/95102 , H01L2224/95145 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01093 , H01L2924/09701 , H01L2924/15788 , H05K2201/10166 , H05K2203/0139 , H05K2203/0776 , H05K2203/1173 , H05K2203/1476 , Y02P70/613 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , H01L2924/00
摘要： The present invention is a method of mounting a plurality of components on a substrate. This component mounting method comprises the steps of (a) to (f): (a) preparing the substrate; (b) preparing a first liquid; (c) preparing a component-containing liquid containing the components and a second liquid, wherein the first liquid is insoluble in the second liquid and has a higher wettability than the second liquid with respect to the surfaces of the components, first regions, and a line having a shorter width than a minimum length of each of the components; (d) disposing the first liquid in the first regions and the line; (e) moving a squeegee for supplying a component-containing liquid to the substrate, relative to the substrate over the line from one edge to the other edge of the substrate to bring the component-containing liquid into contact with the first liquid disposed in the first regions; and (f) removing the first liquid and the second liquid from the substrate to dispose the components in the first regions.
摘要翻译：本发明是将多个部件安装在基板上的方法。该组件安装方法包括步骤（a）至（f）：（a）制备基板; （b）制备第一液体; （c）制备含有组分和第二液体的含有成分的液体，其中第一液体不溶于第二液体，并且相对于组分的表面，第一区域和第二液体具有比第二液体更高的润湿性具有比每个部件的最小长度更短的宽度的线; （d）将第一液体设置在第一区域和第一区域中; （e）移动用于将衬底上的含有成分的液体相对于衬底从衬底的一个边缘到另一个边缘的衬底移动，以使含有组分的液体与设置在该衬底中的第一液体接触第一区; 以及（f）从所述基板去除所述第一液体和所述第二液体以将所述组分置于所述第一区域中。

99. 发明授权

US07814648B2 Method of disposing an electronic device on an electrode formed on substrate 有权
标题翻译：在形成于基板上的电极上设置电子器件的方法
公开(公告)号：US07814648B2
公开(公告)日：2010-10-19
申请号：US12761911
申请日：2010-04-16
申请人： Tohru Nakagawa
发明人： Tohru Nakagawa
IPC分类号： H05K3/30
CPC分类号： H01L24/95 , H01L24/17 , H01L24/81 , H01L2224/13099 , H01L2224/83192 , H01L2224/95085 , H01L2224/95145 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , H01L2924/00 , H01L2224/05599
摘要： The present invention includes: a pre-step of preparing a substrate having on its surface a hydrophilic region that is surrounded by a water-repellent region and provided with a hydrophilic electrode; a first step of applying an electroless plating solution in which a metal compound is dispersed in water to the substrate to dispose an electroless plating solution in the hydrophilic region; a second step of applying an electronic device-dispersed liquid in which an electronic device having a device electrode is dispersed in a first liquid to the substrate to move the electronic device from the first liquid to the electroless plating solution so as to bring the device electrode into contact with the hydrophilic electrode; a third step of coating a surface of the substrate with a second liquid before the water contained in the electroless plating solution volatilizes completely to cause a plating reaction between the hydrophilic electrode and the device electrode and to connect electrically the hydrophilic electrode and the device electrode; and a fourth step of removing the second liquid from the substrate.
摘要翻译：本发明包括：制备在其表面上具有被防水区域包围并设置有亲水电极的亲水区域的基板的前置步骤; 将其中将金属化合物分散在水中的化学镀溶液施加到基材上以在亲水区域中配置化学镀溶液的第一步骤; 将具有装置电极的电子装置分散在第一液体中的电子装置分散液体施加到基板的第二步骤，以将电子装置从第一液体移动到化学镀溶液，以使装置电极与亲水电极接触; 在化学镀液中包含的水完全挥发之前，用第二液体涂布基板表面的第三步骤，在亲水电极和器件电极之间引起电镀反应，并且将亲水电极和器件电极电连接; 以及从基板除去第二液体的第四步骤。

100. 发明授权

US07812336B2 Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire 有权
标题翻译：悬浮底物由非挥发性装置充电并由带电电容器或接合线供电
公开(公告)号：US07812336B2
公开(公告)日：2010-10-12
申请号：US11953008
申请日：2007-12-07
申请人： Thaddeus John Gabara
发明人： Thaddeus John Gabara
IPC分类号： H01L29/06
CPC分类号： H01L21/6833 , H01L23/645 , H01L24/12 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/95 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L27/0207 , H01L27/11526 , H01L2223/6677 , H01L2224/13021 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/8083 , H01L2224/81143 , H01L2224/81801 , H01L2224/8183 , H01L2224/8383 , H01L2224/8384 , H01L2224/95145 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/19104 , H01L2924/203 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01S5/02252 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/0002
摘要： At least one non-volatile device is coupled to a first Coulomb island. The floating gates of these non-volatile devices are connected to the island and can charge the Coulomb islands. One device can charge the island positively while a second device can be used to charge the island negatively. The Coulomb island can have a small probe opening where a charge can be introduced by using mechanical means such as an external probe or a MEMS switch. A fully charged capacitor formed in a first substrate can provide additional energy to a levitated substrate if the first substrate is connected to the levitated substrate. Bonding wires can be attached to a substrate that is attached to a mother substrate. Then, Coulomb forces can levitate the substrate from the mother substrate and the bonding wires can provide a source of power to the levitated substrate.
摘要翻译：至少一个非易失性装置耦合到第一库仑岛。这些非易失性装置的浮动栅极连接到岛上并且可以对库仑岛进行充电。一个设备可以正确地对岛进行充电，而第二个设备可以用来对岛负价。库仑岛可以具有小的探针开口，通过使用诸如外部探针或MEMS开关的机械装置可以引入电荷。形成在第一衬底中的完全充电的电容器可以向悬浮衬底提供额外的能量，如果第一衬底连接到悬浮衬底。接合线可以附接到附着到母基板的基板上。然后，库仑力可以从母基板悬浮基板，接合线可以向悬浮基板提供动力源。

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