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1. 发明申请

US20110197429A1 Method of Magnetically Driven Simultaneous Assembly 审中-公开
标题翻译：磁驱动同时装配方法
公开(公告)号：US20110197429A1
公开(公告)日：2011-08-18
申请号：US12705985
申请日：2010-02-16
申请人： Nuggehalli Ravindra
发明人： Nuggehalli Ravindra
IPC分类号： H01S4/00
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/83 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2224/75102 , H01L2224/7598 , H01L2224/83001 , H01L2224/83143 , H01L2224/83192 , H01L2224/95053 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/1461 , Y10T29/49002 , H01L2924/00
摘要： Magnetically Driven Simultaneous Assembly is a method for the integration of devices onto substrates. It is a non-statistical, fully controllable and deterministic, simultaneous method of assembly with error checking and handling that is capable of scalable, versatile, and high-yield integration. The method employs a combination of magnetic and gravitational forces (as well as a bonding agent) to assemble devices onto substrates. Devices, coated with a layer of a soft magnetic material, are moved from an initial to a final location by the action of an array of electromagnets above a template. Various devices of arbitrary geometries, with different physical properties and functionalities, are positioned simultaneously above specific desired locations and dropped onto a template under the action of gravity by locally weakening the applied magnetic field. Desired locations on the template correspond to sites on a substrate that contain recesses matching the specifics of the devices. When all desired devices are placed on top of the template, a substrate is brought into contact with that template and devices are transferred from the template to the substrate (for example, by pressing or by rolling). Devices are physically secured onto a substrate by a bonding agent (such as a layer of an adhesive or a hard magnetic material) applied inside of the recesses. Sensors monitor the accuracy of the placement of devices on a template and provide continuous, real-time feedback to an external control unit that automates the process of assembly. If devices are not situated properly on a template, then a specified technique is employed to correct such errors before the final process transfers the devices onto a substrate, thus assuring an accurate, 100% yield.
摘要翻译：磁驱动同时装配是将装置集成到基板上的一种方法。它是一种非统计的，完全可控的和确定性的，同时的组装方法，具有可扩展，多功能和高产出集成的错误检查和处理能力。该方法采用磁力和重力的组合（以及粘合剂）将装置组装到基底上。涂覆有软磁性材料层的装置通过模板上方的电磁体阵列的作用从初始位置移动到最终位置。具有不同物理性质和功能的任意几何形状的各种装置同时位于特定的所需位置之上并通过局部削弱所施加的磁场而在重力作用下落到模板上。模板上的所需位置对应于基板上包含与设备细节匹配的凹槽的位置。当将所有所需的装置放置在模板的顶部时，使衬底与该模板接触，并且将装置从模板转移到衬底（例如通过压制或通过轧制）。设备通过施加在凹部内部的粘合剂（例如粘合剂层或硬磁性材料层）物理地固定在基底上。传感器监控模板上设备放置的准确性，并为外部控制单元提供连续的实时反馈，从而使组装过程自动化。如果设备没有正确地放置在模板上，那么在最终的工艺将器件转移到衬底上之前，采用指定的技术来纠正这些错误，从而确保了100％的准确率。

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