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    • 94. 发明授权
    • Extreme ultraviolet light source apparatus
    • 极紫外光源设备
    • US07999241B2
    • 2011-08-16
    • US12605113
    • 2009-10-23
    • Shinji NagaiTakanobu IshiharaKouji KakizakiTamotsu Abe
    • Shinji NagaiTakanobu IshiharaKouji KakizakiTamotsu Abe
    • G21K5/02H01J17/26
    • H05G2/003G03F7/70033G03F7/70175G03F7/70916H05G2/006H05G2/008
    • An extreme ultraviolet light source apparatus has a magnetic field generator which generates a magnetic field region around a direction of the magnetic field passing through a plasma region in which a plasma is to be generated and converges charged particles including ion emitted from the plasma region toward the direction of the magnetic field, a first charged particle collector (receiver) mounted at both sides of an axis of the magnetic field in the magnetic field region in order to collect (receive) the charged particles converged by the magnetic field, a target supply unit supplying a target from a nozzle located outside a converging region in which the charged particles are to be converged inside the magnetic field region in an extreme ultraviolet light generating chamber, and a target collector located at a position opposite to the nozzle, the target retrieval portion retrieving a residual target which does not contribute to generation of the plasma.
    • 极紫外光源装置具有磁场发生器,该磁场发生器在通过等离子体产生等离子体区域的磁场方向周围产生磁场区域,并将包含从等离子体区域射出的离子的带电粒子向着 磁场方向,安装在磁场区域的磁场轴的两侧的第一带电粒子收集器(接收器),以收集(接收)由磁场收敛的带电粒子;目标供给单元 从位于极紫外光发生室内的磁场区域内的会聚区域的会聚区域的喷嘴和位于与喷嘴相对的位置的目标集合体供给目标,目标取出部 检索对等离子体的产生无贡献的残留目标。
    • 95. 发明授权
    • Immersion exposure apparatus and device manufacturing method with liquid detection apparatus
    • 浸液曝光装置及液体检测装置的装置制造方法
    • US07990516B2
    • 2011-08-02
    • US10587268
    • 2005-01-28
    • Hiroaki TakaiwaTakashi Horiuchi
    • Hiroaki TakaiwaTakashi Horiuchi
    • G03B27/52
    • G03F7/70341G03B27/42G03F7/7085G03F7/70916
    • An exposure apparatus for exposing a substrate by emitting exposure light thereto through a projection optical system and liquid, has a detection apparatus that detects whether the liquid is present on an object disposed lower than a front end of the projection optical system. Another detection apparatus has an emitting portion that emits detection light to an immersion area between the projection optical system and an object disposed on an image plane side thereof, and a light-receiving portion disposed at a predetermined position for the detection light; therein, at least one of size and shape of the immersion area is obtained based on light receiving results. The detection apparatus is used to detect the presence of liquid on such lower-disposed object, the state of the immersion area, or shape or contact angle of the liquid. Optimal measures are taken, based on detection results, for maintaining high exposure and measurement accuracies.
    • 一种用于通过投影光学系统和液体向其发射曝光的曝光基板的曝光装置,具有检测装置,其检测液体是否存在于投影光学系统的前端下方的物体上。 另一种检测装置具有发射部分,其向投影光学系统和设置在其图像平面侧的物体之间的浸没区域发射检测光;以及光接收部分,设置在用于检测光的预定位置; 其中,基于光接收结果获得浸渍区域的尺寸和形状中的至少一个。 该检测装置用于检测这种下位物体上的液体的存在,浸渍区域的状态,或液体的形状或接触角。 基于检测结果,采取最佳措施,保持高曝光和测量精度。
    • 100. 发明授权
    • Method for examining a wafer with regard to a contamination limit and EUV projection exposure system
    • 关于污染极限和EUV投影曝光系统检查晶片的方法
    • US07955767B2
    • 2011-06-07
    • US12690571
    • 2010-01-20
    • Andreas DorselStefan Schmidt
    • Andreas DorselStefan Schmidt
    • G03F9/00G03C5/00
    • G03F7/70916G03F7/70425G03F7/70608G03F7/7075G03F7/70808G03F7/70866G03F7/70925G03F7/70983
    • A method for examining at least one wafer (13) with regard to a contamination limit, in which the contamination potential of the resist (13a) of the wafer (13), which resist (13a) outgasses contaminating substances, is examined with regard to a contamination limit before the wafer (13) is exposed in an EUV projection exposure system (1). The method preferably includes: arranging the wafer (13) and/or a test disc coated with the same resist (13a) as the resist (13a) of the wafer (13) in a vacuum chamber (19), evacuating the vacuum chamber (19), and measuring the contamination potential of the contaminating substances outgassed from the wafer (13) in the evacuated vacuum chamber (19), and also comparing the contamination potential of the wafer (13) with a contamination limit. An EUV projection exposure system (1) for carrying out the method is also disclosed. By rejecting wafers having an especially high contamination risk, the contamination of optical elements in the projection exposure system (1) on wafer exposure may be distinctly reduced.
    • 关于污染极限检查至少一个晶片(13)的方法,其中关于抗污染物质(13a)的晶片(13)的抗蚀剂(13a)的污染潜力被检测为污染物质 晶片(13)在EUV投影曝光系统(1)中曝光之前的污染极限。 该方法优选地包括:将晶片(13)和/或涂覆有与晶片(13)的抗蚀剂(13a)相同的抗蚀剂(13a)的测试盘放置在真空室(19)中,抽真空室 19),并且测量从真空室(19)中的晶片(13)脱气的污染物质的污染潜力,并且还将晶片(13)的污染电位与污染极限进行比较。 还公开了一种用于执行该方法的EUV投影曝光系统(1)。 通过拒绝具有特别高的污染风险的晶片,可以明显减少投影曝光系统(1)中晶片曝光的光学元件的污染。