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    • 91. 发明授权
    • Method of depositing materials on a non-planar surface
    • 在非平面表面上沉积材料的方法
    • US08318609B2
    • 2012-11-27
    • US12633589
    • 2009-12-08
    • Dan MarohlTimothy J. FranklinRatson Morad
    • Dan MarohlTimothy J. FranklinRatson Morad
    • H01L21/31
    • H01L21/67706C23C14/505H01L21/6776
    • A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
    • 公开了一种用于在非平面基板上实现半导体处理的载体。 载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底,并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。 随着非平面基板同时旋转并且向下平移处理室,旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺,从而允许根据需要均匀沉积。 或者,任何预定图案能够暴露在非平面基板的表面上。 这种载体实现非平面半导体器件的制造,包括但不限于非平面发光二极管,非平面光伏电池等。
    • 95. 发明申请
    • SPUTTERING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
    • 电子设备的溅射装置和制造方法
    • US20120164354A1
    • 2012-06-28
    • US13315576
    • 2011-12-09
    • Yuichi OtaniNobuo Yamaguchi
    • Yuichi OtaniNobuo Yamaguchi
    • C23C14/34
    • C23C14/352C23C14/185C23C14/505H01J37/3417H01J37/3435H01J37/3447
    • The present invention provides a sputtering apparatus that can efficiently laminate thin films in a short time without lowering throughputs, and a manufacturing method of an electronic device. The sputtering apparatus according to an embodiment of the present invention includes a rotatable substrate holder, four target holders obliquely arranged with respect to the substrate holder, and a first shutter and a second shutter that each are provided between the target holders and the substrate holder and have two holes arranged two-fold symmetrical with respect to a rotational axis X. Two of the four target holders are first group target holders arranged two-fold symmetrical with respect to the rotational axis X, and the other two target holders are second group target holders arranged between the first group target holders and two-fold symmetrical with respect to the rotational axis X.
    • 本发明提供一种可以在短时间内有效地层叠薄膜而不降低生产率的溅射装置,以及电子装置的制造方法。 根据本发明的实施例的溅射装置包括可旋转的基板保持器,相对于基板保持器倾斜布置的四个目标保持器,以及分别设置在目标保持器和基板保持器之间的第一闸板和第二闸板, 具有相对于旋转轴线X对称布置的两个孔。四个目标支架中的两个是相对于旋转轴线X布置成双重对称的第一组目标支架,另外两个目标支架是第二组目标 保持器布置在第一组目标保持器之间并且相对于旋转轴线X对称的两折。
    • 97. 发明申请
    • LOADING DEVICE AND SPUTTERING DEVICE USING SAME
    • 使用相同的装载装置和喷射装置
    • US20120160675A1
    • 2012-06-28
    • US13091136
    • 2011-04-21
    • CHUNG-PEI WANG
    • CHUNG-PEI WANG
    • C23C14/34
    • B65G29/00C23C14/505C23C14/56
    • A sputtering device includes a main body and a loading device received in the main body. The main body includes a top portion, a bottom portion, and a sidewall connected between the top portion and the bottom portion, an upper bearing mounted on the top portion, and a lower bearing mounted on the bottom portion. The loading device includes an outer frame, an inner frame received in the outer frame, and a gear device arranged between the outer frame and the in inner frame. The outer frame is rotatably connected to the upper bearing and includes a plurality of first rods arranged in a first circle. The inner frame is rotatably connected to the lower bearing and includes a plurality of second rods arranged in a second circle. The gear device is configured for bringing the outer frame and the inner frame to rotate in opposite directions.
    • 溅射装置包括容纳在主体中的主体和装载装置。 主体包括顶部,底部和连接在顶部和底部之间的侧壁,安装在顶部上的上轴承和安装在底部上的下轴承。 装载装置包括外框架,容纳在外框架中的内框架和布置在外框架和内框架之间的齿轮装置。 外框架可旋转地连接到上轴承并且包括布置在第一圆中的多个第一杆。 内框架可旋转地连接到下轴承并且包括布置在第二圆圈中的多个第二杆。 齿轮装置构造成使外框架和内框架沿相反方向旋转。
    • 100. 发明授权
    • Methods and devices for monitoring and controlling thin film processing
    • 用于监控和控制薄膜加工的方法和装置
    • US08182861B2
    • 2012-05-22
    • US12902476
    • 2010-10-12
    • William David LeeDale C. NessAlan D. Streater
    • William David LeeDale C. NessAlan D. Streater
    • C23C16/52
    • C23C14/505C23C14/546C23C14/547C23C16/4584C23C16/52
    • Thin film processing systems and methods are provided having a moving deposition sensor capable of translation and/or rotation in a manner that exposes the sensor to thin film deposition environments in a flux region substantially the same as the deposition environments experienced by one or more moveable substrates during a selected deposition period. In one embodiment, a thin film monitoring and control system is provided wherein one or more moveable substrates and a moveable deposition sensor are moved along substantially coincident trajectories in a flux region of a thin film deposition system for a selected deposition period. Systems and methods of the present invention may include SC-cut quartz crystal microbalance sensors capable of excitation of at least two different resonant modes.
    • 提供薄膜处理系统和方法,其具有移动的沉积传感器,该移动沉积传感器能够以与由一个或多个可移动基板经历的沉积环境基本相同的通量区域中将传感器暴露于薄膜沉积环境的方式进行平移和/或旋转 在选定的沉积期间。 在一个实施例中,提供了一种薄膜监视和控制系统,其中一个或多个可移动基板和可移动沉积传感器在选定的沉积周期的薄膜沉积系统的通量区域中沿着基本上重合的轨迹移动。 本发明的系统和方法可以包括能够激发至少两种不同谐振模式的SC切割石英晶体微量天平传感器。