会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Electronic device manufacturing method and sputtering method
    • 电子器件制造方法和溅射法
    • US09090974B2
    • 2015-07-28
    • US13596734
    • 2012-08-28
    • Nobuo YamaguchiKazuaki Matsuo
    • Nobuo YamaguchiKazuaki Matsuo
    • C23C14/34C23C14/50H01J37/34
    • H01J37/3441C23C14/0068C23C14/3407C23C14/35C23C14/50C23C14/505C23C14/564H01J37/3405H01J37/3447H01J2237/3323
    • An electronic device manufacturing method includes a first step of moving a substrate holder close to a first shield member and locating a first projecting portion formed on the first shield member and having a ring shape and a second projecting portion having a ring shape and formed on a second shield member installed on the surface of the substrate holder at the outer peripheral portion of a substrate at a position to engage with each other in a noncontact state, a second step of, after the first step, sputtering a target while maintaining the first projecting portion and the second projecting portion at the position to engage with each other in the noncontact state, and a third step of, after the second step, setting the first shield member in an open state and sputtering the target to perform deposition on the substrate.
    • 一种电子设备制造方法,包括:第一步骤,使基板保持器靠近第一屏蔽部件移动,并且定位形成在第一屏蔽部件上的具有环形的第一突出部分和具有环形的第二突出部分,并形成在 第二屏蔽构件,其安装在基板保持件的表面上,在基板的外周部分处于非接触状态下彼此接合的位置;第二步骤,在第一步骤之后,溅射靶,同时保持第一突出 部分和第二突出部分在非接触状态下彼此接合的位置,以及第三步骤,在第二步骤之后,将第一屏蔽构件设置在打开状态,并溅射靶以在基板上进行沉积。
    • 9. 发明授权
    • Sputtering method and sputtering apparatus
    • 溅射方法和溅射装置
    • US08992743B2
    • 2015-03-31
    • US13483370
    • 2012-05-30
    • Nobuo YamaguchiKazuaki Matsuo
    • Nobuo YamaguchiKazuaki Matsuo
    • C23C14/50C23C14/00C23C14/34C23C14/56H01J37/34
    • C23C14/505C23C14/0063C23C14/3492C23C14/564H01J37/3408H01J37/3447
    • This invention provides a sputtering method which can generate an electric discharge under practical conditions and maintain the pressure in a plasma space uniform, and a sputtering apparatus used for the same. The sputtering method includes a first gas introduction step (step S403) of introducing a process gas from a first gas introduction port formed in a sputtering space defined by a deposition shield plate, a substrate holder, and the target which are disposed in a process chamber, a voltage application step (step S407) of applying a voltage to the target after the first gas introduction step, and a second gas introduction step (step S405) of introducing a process gas from a second gas introduction port formed outside the sputtering space.
    • 本发明提供一种溅射方法,其可以在实际条件下产生放电并保持等离子体空间中的压力均匀,并且使用溅射方法。 溅射方法包括:第一气体导入步骤(步骤S403),其从形成在由沉积屏蔽板,基板保持器和靶材定义的溅射空间中的第一气体导入口引入处理气体,所述第一气体导入口设置在处理室 ,在第一气体导入工序之后,向目标物施加电压的电压施加步骤(步骤S407),以及从形成在溅射空间外部的第二气体导入口引入处理气体的第二气体导入工序(步骤S405)。