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91. 发明授权

US06458023B1 Multi characterized chemical mechanical polishing pad and method for fabricating the same 有权
标题翻译：多特征化学机械抛光垫及其制造方法
公开(公告)号：US06458023B1
公开(公告)日：2002-10-01
申请号：US09970689
申请日：2001-10-05
申请人： Jin-Ok Moon
发明人： Jin-Ok Moon
IPC分类号： B24D1100
CPC分类号： B24B37/22 , B24B37/26
摘要： A multi characterized CMP (Chemical Mechanical Polishing) pad structure includes a lower pad and an upper pad. The lower pad includes a lower central soft pad region and a lower peripheral soft pad region formed outwardly of the lower central soft pad region, with both the lower central soft pad region and the lower peripheral soft pad region being located in a same plane of the lower pad. The upper pad is disposed on the lower pad, and includes an upper central hard pad region and an upper peripheral soft pad region formed outwardly of the upper central hard pad region, both the upper central hard pad region and the upper peripheral soft pad region being located in the same plane of the upper pad. The lower peripheral soft pad region has a lower hardness factor relative to the lower central soft pad region, and the upper peripheral soft pad region has substantially the same hardness factor as the lower central soft pad region.
摘要翻译：多特征CMP（化学机械抛光）焊盘结构包括下焊盘和上焊盘。下焊盘包括下中心软焊盘区域和形成在下中央软焊盘区域外侧的下周边软焊盘区域，下中央软焊盘区域和下外周软焊盘区域都位于同一平面内下垫上垫片设置在下垫片上，并且包括上中心硬垫区域和形成在上中心硬垫区域外侧的上周软垫区域，上中心硬垫区域和上周软垫区域均为位于上垫的同一平面上。下周边软焊盘区域相对于下部中心软焊盘区域具有较低的硬度因数，并且上部周边软焊盘区域具有与下部中心软焊盘区域基本上相同的硬度系数。

92. 发明授权

US06422921B1 Heat activated detachable polishing pad 失效
标题翻译：热激活可拆卸抛光垫
公开(公告)号：US06422921B1
公开(公告)日：2002-07-23
申请号：US09422898
申请日：1999-10-22
申请人： Gary C. Ettinger
发明人： Gary C. Ettinger
IPC分类号： B24B100
CPC分类号： B24B37/22 , B24B37/24
摘要： A polishing pad is adhered to a platen by a heat activated adhesive. Means are provided to heat the adhesive to a temperature sufficient to soften the adhesive, thereby facilitating removal of the polishing pad from the platen. Embodiments include employing a heat softenable adhesive that preferentially adheres to the polishing pad upon removal of the polishing pad from the platen.
摘要翻译：抛光垫通过热活化粘合剂粘附到压板上。提供了用于将粘合剂加热到足以软化粘合剂的温度的装置，从而有助于从压板移除抛光垫。实施例包括采用可热软化的粘合剂，其在从压板移除抛光垫时优先粘附于抛光垫。

93. 发明授权

US06409904B1 Method and apparatus for depositing and controlling the texture of a thin film 失效
标题翻译：用于沉积和控制薄膜纹理的方法和装置
公开(公告)号：US06409904B1
公开(公告)日：2002-06-25
申请号：US09373681
申请日：1999-08-13
申请人： Cyprian Emeka Uzoh , Homayoun Talieh
发明人： Cyprian Emeka Uzoh , Homayoun Talieh
IPC分类号： C25D552
CPC分类号： H01L23/53238 , B24B37/042 , B24B37/20 , B24B37/22 , B24B37/24 , B24B37/26 , C25D5/00 , C25D5/02 , C25D5/06 , C25D5/22 , C25D5/50 , C25D7/123 , C25D17/14 , C25D21/02 , C25F7/00 , H01L21/2885 , H01L21/3212 , H01L21/6715 , H01L21/76838 , H01L21/76877 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a “proximity” plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a “cold worked” manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.
摘要翻译：本发明提供了一种用于将导电材料镀覆到基底上的方法和装置，并且还改善了在衬底被电镀时导电膜的物理性质。本发明还提供了一种方法和装置，其以“接近”电镀方式在工件表面上平板化导电材料，同时衬垫型材料或其它固定特征以“冷加工”方式与工件表面接触。以这种方式，存储在镀层的冷加工区域中的能量用于加速和增强微结构回收和生长。因此，在较低的退火温度和较短的退火时间下，在镀覆材料中获得大的晶粒尺寸。

94. 发明申请

US20020018848A1 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines 失效
公开(公告)号：US20020018848A1
公开(公告)日：2002-02-14
申请号：US09970100
申请日：2001-10-02
发明人： Vishnu K. Argarwal , Scott G. Meikle
IPC分类号： C23C016/00 , B05D005/00 , B05D003/02
CPC分类号： B24B37/26 , B24B37/22 , B24D3/22 , Y10S977/776 , Y10S977/883 , Y10S977/888
摘要： Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the pattern elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.

95. 发明授权

US06306021B1 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers 失效
标题翻译：抛光垫，抛光方法和用于镜面抛光半导体晶片的抛光机
公开(公告)号：US06306021B1
公开(公告)日：2001-10-23
申请号：US09237881
申请日：1999-01-27
申请人： Hisashi Masumura , Makoto Kobayashi , Teruaki Fukami , Tsutomu Takaku , Mamoru Okada
发明人： Hisashi Masumura , Makoto Kobayashi , Teruaki Fukami , Tsutomu Takaku , Mamoru Okada
IPC分类号： B24B500
CPC分类号： B24B37/22 , B24B37/24
摘要： There is disclosed a polishing pad for mirror-polishing a semiconductor wafer, especially in a finish polishing process, by use of a polishing machine which includes a turn table on which a polishing pad is attached, a unit for feeding a polishing agent onto a surface of the polishing pad, and a mechanism for pressing a semiconductor wafer onto the surface of the polishing pad. The polishing pad includes a top layer formed of a porous soft material, a bottom layer formed of a rubber elastomer, and an intermediate layer formed of a hard plastic sheet. The hard plastic sheet is disposed between the top layer and the bottom layer and is bonded to the bottom layer. In the polishing pad, undulation produced in the bottom layer due to a horizontal force generated during polishing is prevented from being transferred to the top layer of the polishing pad, and unevenness in polishing stock removal stemming from warpage or undulation of a wafer itself can be mitigated.
摘要翻译：公开了一种用于对半导体晶片进行镜面抛光的抛光垫，特别是在精抛光工艺中，通过使用抛光机，该抛光机包括其上安装有抛光垫的转台，用于将抛光剂供给到表面上的单元的抛光垫，以及用于将半导体晶片压到抛光垫的表面上的机构。抛光垫包括由多孔软质材料形成的顶层，由橡胶弹性体形成的底层和由硬塑料片形成的中间层。硬塑料片设置在顶层和底层之间并结合到底层。在抛光垫中，由于抛光期间产生的水平力，底层产生的波动被转移到抛光垫的顶层，并且由晶片本身的翘曲或起伏引起的抛光原料去除的不均匀性可以是缓解

96. 发明申请

US20010019940A1 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines 有权
标题翻译：用于微电子器件基板组件的机械或化学机械平面化的抛光垫和平面化机器，以及制造和使用这种焊盘和机器的方法
公开(公告)号：US20010019940A1
公开(公告)日：2001-09-06
申请号：US09819260
申请日：2001-03-27
发明人： Vishnu K. Agarwal , Scott G. Meikle
IPC分类号： B24D011/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/22 , Y10S977/776 , Y10S977/883 , Y10S977/888
摘要： Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the patter elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.
摘要翻译：用于制造微电子器件的抛光垫，以及用于制造和使用这种抛光垫的装置和方法。在本发明的一个方面，用于平坦化微电子器件衬底组件的抛光垫具有包括第一表面和第二表面的背衬构件，分布在衬垫构件的第一表面上的多个图案元件和硬覆盖层超过图案元素。图案元件限定远离背衬构件的第一表面突出的多个轮廓表面。覆盖层至少基本上符合图案元件的轮廓表面，以形成多个突出远离背衬构件的第一表面的硬结节。硬结节定义研磨元件以接触和研磨来自微电子器件衬底组件的材料。因此，覆盖层限定抛光垫的平坦化表面的至少一部分。

97. 发明授权

US06267659B1 Stacked polish pad 失效
标题翻译：堆积抛光垫
公开(公告)号：US06267659B1
公开(公告)日：2001-07-31
申请号：US09564785
申请日：2000-05-04
申请人： Shyng-Tsong Chen , Michael F. Lofaro , Woody Ray Smith
发明人： Shyng-Tsong Chen , Michael F. Lofaro , Woody Ray Smith
IPC分类号： B24D1100
CPC分类号： B24B37/22 , B24B37/24 , B24B49/08 , B24D13/20
摘要： A polishing pad assembly is described for use in a chemical-mechanical polishing apparatus having a polishing platen. The polishing pad assembly includes a first pad disposed on the platen. The first pad comprises a sealable enclosure with a flexible outer skin and partially filled with a porous material. A control is adapted to inject fluid into and to remove fluid from the enclosure. The first pad has a hardness which is variable according to an amount of fluid in the enclosure. A second pad is disposed on the first pad.
摘要翻译：描述了一种用于具有研磨台板的化学机械抛光装置中的抛光垫组件。抛光垫组件包括设置在台板上的第一垫。第一垫包括具有柔性外表皮并部分填充有多孔材料的可密封外壳。控制器适于将流体注入并从外壳中移除流体。第一垫具有根据外壳中的流体量可变的硬度。第二垫设置在第一垫上。

98. 发明授权

US5853317A Polishing pad and polishing apparatus having the same 失效
标题翻译：抛光垫和抛光装置
公开(公告)号：US5853317A
公开(公告)日：1998-12-29
申请号：US881983
申请日：1997-06-25
申请人： Yoshiaki Yamamoto
发明人： Yoshiaki Yamamoto
IPC分类号： B24B37/20 , B24B37/22 , B24B37/26 , B24D11/00 , B24D13/12 , B24D13/14 , H01L21/304 , B24B29/00
CPC分类号： B24B37/22 , B24B37/26 , Y10S451/921
摘要： A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.
摘要翻译：由柔性材料制成的抛光垫包括第一主表面，第二主表面和大量孔。第一主表面由可旋转的抛光对象构件推动，通过使用浆料来抛光推压的抛光对象构件的抛光对象表面。第二主表面粘附到可旋转的压板上。多个孔在第一和第二主表面之间延伸并用作浆料储存器。这些孔在第二主表面上的开口面积大于第一主表面上的开口面积。还公开了抛光装置。

99. 发明授权

US5609517A Composite polishing pad 失效
标题翻译：复合抛光垫
公开(公告)号：US5609517A
公开(公告)日：1997-03-11
申请号：US560721
申请日：1995-11-20
申请人： Michael F. Lofaro
发明人： Michael F. Lofaro
IPC分类号： B24B37/22 , B24B37/26 , B24D13/14 , B24D11/00
CPC分类号： B24B37/22 , B24B37/26
摘要： A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.
摘要翻译：提供了复合抛光垫，其具有支撑层，附着到支撑层的节点，以及附着到支撑层的上层，其围绕但不覆盖节点。支撑层，节点和上层都可以具有不同的硬度。

100. 发明授权

US5516400A Techniques for assembling polishing pads for chemical-mechanical polishing of silicon wafers 失效
标题翻译：组装硅晶片化学机械抛光抛光垫的技术
公开(公告)号：US5516400A
公开(公告)日：1996-05-14
申请号：US239493
申请日：1994-05-09
申请人： Nicholas F. Pasch , Thomas G. Mallon , Mark A. Franklin
发明人： Nicholas F. Pasch , Thomas G. Mallon , Mark A. Franklin
IPC分类号： B24B1/00 , B24B37/22 , B24D13/14 , H01L21/304
CPC分类号： B24B37/22 , Y10S438/959 , Y10S451/921 , Y10T156/1026 , Y10T156/1034 , Y10T156/1052
摘要： A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.
摘要翻译：公开了一种在化学机械半导体晶片抛光装置中将抛光垫安装在台板上的技术。下垫安装到压板上，并被修剪成压板的尺寸。上垫被安装到下垫，并且其尺寸使得上垫的极端外边缘部分延伸超过下垫的修剪外边缘。上垫的外边缘部分朝向下垫片向下变形。以这种方式，抛光浆料从衬垫到衬垫界面转移。此外，可以在上垫的前表面上形成一体的环形唇缘，从而产生用于浆料的储存器，以将其保留在上垫的表面上，以增强抛光浆料在淤浆洗涤之前的停留时间上垫

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