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91. 发明授权

US06492699B1 Image sensor package having sealed cavity over active area 有权
标题翻译：图像传感器封装在有源区域上具有密封腔
公开(公告)号：US06492699B1
公开(公告)日：2002-12-10
申请号：US09577692
申请日：2000-05-22
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： H01L310203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.
摘要翻译：一种图像传感器封装包括具有有效面积的上表面和形成在其上的接合焊盘的图像传感器。上表面的非临界区域在有源区域和接合焊盘之间。窗口覆盖有效区域，并通过窗口支持在非关键区域上支持。窗口，窗口支撑和图像传感器限定了一个密封的空腔，有源区域位于空腔内。特别地，活动区域位于空腔内，其被密封以保护活动区域免受外部湿气，灰尘和污染。

92. 发明授权

US06483030B1 Snap lid image sensor package 有权
标题翻译：快照盖图像传感器包装
公开(公告)号：US06483030B1
公开(公告)日：2002-11-19
申请号：US09457516
申请日：1999-12-08
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： H01L2302
CPC分类号： H01L27/14625 , B29C33/0022 , B29C43/36 , B29C2043/023 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L27/14687 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
摘要翻译：图像传感器封装包括具有锁定特征的模制件。该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。为了形成图像传感器封装，将窗口放置在模制品的口袋中。卡扣盖固定就位。一旦固定，卡扣盖压靠窗口外表面的周边区域。窗口夹在模制件和卡扣盖之间并保持就位。

93. 发明授权

US06441504B1 Precision aligned and marked structure 有权
标题翻译：精确对准和标记结构
公开(公告)号：US06441504B1
公开(公告)日：2002-08-27
申请号：US09558397
申请日：2000-04-25
申请人： Thomas P. Glenn , Steven Webster , Gary L. Swiss
发明人： Thomas P. Glenn , Steven Webster , Gary L. Swiss
IPC分类号： H01L23544
CPC分类号： H01L23/544 , B23D59/001 , B28D5/0058 , H01L24/48 , H01L24/97 , H01L29/0657 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/05599 , H01L2224/16 , H01L2224/274 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/10158 , H01L2924/14 , H01L2924/15183 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A structure includes a substrate such as a wafer or an array of packages. The substrate has a front-side surface and a back-side surface. A reference feature such as a scribe grid is on the front-side surface. In at least one alignment mark is on the back-side surface, the alignment mark having a precise positional relationship to the reference feature on the front-side surface. The reference mark is used to cut the substrate from the back-side surface.
摘要翻译：结构包括诸如晶片或封装阵列的衬底。基板具有前侧表面和后侧表面。诸如划线网格的参考特征位于前侧表面。在背侧表面上至少有一个对准标记，对准标记与前侧表面上的参考特征具有精确的位置关系。参考标记用于从背面切割基板。

94. 发明授权

US06433277B1 Plastic integrated circuit package and method and leadframe for making the package 有权
标题翻译：塑料集成电路封装及封装方法及引线框架
公开(公告)号：US06433277B1
公开(公告)日：2002-08-13
申请号：US09615107
申请日：2000-07-13
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2328
CPC分类号： H01L23/49503 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01037 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171 , Y10T428/24207 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
摘要翻译：公开了用于集成电路管芯的封装以及用于制造这种封装的方法和引线框。封装包括管芯，管芯焊盘，外围金属触点，接合线和密封剂。管芯焊盘和触点位于封装的下表面。芯片焊盘和触头具有侧表面，其包括凹入部分和粗糙度以接合密封剂。制造封装的方法包括提供具有矩形框架中的管芯焊盘的金属引线框架。标签从框架向模片垫延伸。管芯焊盘和突片具有侧表面，其具有凹入部分和凹凸。芯片贴在裸片上。模具电连接到突片。将密封剂施加到引线框架的上表面和侧表面。最后，将引线框架原位切割，使得芯片焊盘和突片从框架上切断，形成封装的侧面，并将封装与引线框架切断。

95. 发明授权

US06424031B1 Stackable package with heat sink 有权
标题翻译：具有散热片的可堆叠封装
公开(公告)号：US06424031B1
公开(公告)日：2002-07-23
申请号：US09566680
申请日：2000-05-08
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2302
CPC分类号： H01L25/105 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2225/06551 , H01L2225/06582 , H01L2225/06589 , H01L2225/06593 , H01L2225/1029 , H01L2225/1041 , H01L2225/1082 , H01L2225/1094 , H01L2924/00014 , H01L2924/1815 , H01L2224/05599
摘要： A stackable package for an integrated circuit (e.g., a flip chip) is disclosed. The package includes a molded plastic package body having a first side, an opposite second side, and side surfaces extending vertically between the first and second sides. A plurality of leads extend from the package body. Each lead has a first portion embedded in the package body, a second portion extending vertically adjacent to a peripheral side surface of the package body, and a third portion adjacent to and extending over first side of package body. A surface of embedded first portion of the leads is exposed at the second side of the package body. The package may be vertically stacked on another package and electrically connected thereto. Keys extending from the package body of the first package engage keyholes of the other package. A heat sink is horizontally disposed between the packages. The heat sink has a rectangular body and radiating fins. The heat sink is in direct or indirect thermal contact with the integrated circuits of at least one of the packages. The indirect thermal contact may be through a die pad or thermal adhesive.
摘要翻译：公开了一种用于集成电路（例如，倒装芯片）的可堆叠封装。该包装包括具有第一侧，相对的第二侧和在第一和第二侧之间垂直延伸的侧表面的模制塑料封装主体。多个引线从封装主体延伸。每个引线具有嵌入封装主体中的第一部分，与封装主体的周边侧表面垂直相邻延伸的第二部分，以及与封装主体的第一侧相邻并且在第一侧延伸的第三部分。引线的嵌入式第一部分的表面在封装体的第二侧露出。封装可以垂直堆叠在另一个封装上并与之电连接。从第一包装的包装体延伸的钥匙接合另一个包装的钥匙孔。散热器水平布置在包装之间。散热片有一个矩形体和散热片。散热器与至少一个封装的集成电路直接或间接地热接触。间接热接触可以通过管芯焊盘或热粘合剂。

96. 发明授权

US06407381B1 Wafer scale image sensor package 有权
标题翻译：晶圆尺寸图像传感器封装
公开(公告)号：US06407381B1
公开(公告)日：2002-06-18
申请号：US09610314
申请日：2000-07-05
申请人： Thomas P. Glenn , Steven Webster , Tony Arellano
发明人： Thomas P. Glenn , Steven Webster , Tony Arellano
IPC分类号： H01L310203
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/94 , H01L27/14618 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.
摘要翻译：图像传感器封装包括具有接合焊盘的图像传感器和图像传感器的上表面上的有效区域。图像传感器封装还包括在图像传感器的上表面上的窗口支撑。窗户支撑件完全包围包括活动区域和接合垫的上表面。一个窗口与窗口支撑件接触，窗口覆盖有效区域。通常，窗户支撑和窗户完全包围，从而保护图像传感器的有效区域。

97. 发明授权

US06320251B1 Stackable package for an integrated circuit 有权
标题翻译：用于集成电路的可堆叠封装
公开(公告)号：US06320251B1
公开(公告)日：2001-11-20
申请号：US09484192
申请日：2000-01-18
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2302
CPC分类号： H01L23/49555 , H01L23/3107 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/105 , H01L2224/16 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1005 , H01L2225/1029 , H01L2225/1041 , H01L2225/1082 , H01L2924/01013 , H01L2924/01028 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： Package embodiments for integrated circuits or other electronic devices are disclosed, along with methods of making and interconnecting the packages. The packages include a package body formed of molded encapsulant. Leads extend from a first end that is embedded at a lower surface of the package body second end that is outside the package body. The leads are bent up the sides of the package and over the top surface of the package. The packages have mounting keys so that a plurality of packages may be precisely stacked one on top of the other. Abutting leads of the stacked packages may be electrically interconnected. The packages also may be placed next to each other so that their leads abut and may be electrically interconnected.
摘要翻译：公开了用于集成电路或其他电子设备的封装实施例，以及制造和互连封装的方法。包装包括由模制密封剂形成的包装体。引线从嵌入在封装主体外部的封装主体第二端的下表面的第一端延伸。引线沿着封装的侧面向上弯曲并且在封装的顶部表面上方弯曲。这些包装具有安装键，使得可以将多个包装精确堆叠在另一个的顶部上。堆叠的封装的接合引线可以电连接。封装也可以彼此相邻放置，使得它们的引线邻接并且可以电连接。

98. 发明授权

US06246566B1 Electrostatic discharge protection package and method 有权
标题翻译：静电放电保护封装及方法
公开(公告)号：US06246566B1
公开(公告)日：2001-06-12
申请号：US09246574
申请日：1999-02-08
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01G300
CPC分类号： H05K9/0067 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： A package includes a substrate mechanically supporting circuitry. A conductive cover (e.g., a metal sheet) is over the circuitry so that the circuitry is exposed below an opening in the conductive cover. A bent down corner of the conductive cover is inserted into a hole in the substrate. A solder ball is placed on the other end of the hole. During a subsequent heating, the solder ball is drawn up through the hole. When cooled, the conductive material grasps onto the tip of the bent down corner, thereby establishing a good connection between the conductive cover and the newly formed conductive via. As a finger approaches the circuitry (e.g., a fingerprint detection circuit), the finger first discharges electrostatic charge into the cover, not into the circuit, thereby protecting the circuit. In another package, the cover is composed of a highly resistive material, to slowly dissipate the electrostatic charge. Thus, the induced parasitic currents in the circuit are relatively low and damage to the circuit is avoided.
摘要翻译：封装包括基板机械支撑电路。导电盖（例如，金属片）在电路之上，使得电路暴露在导电盖中的开口下方。将导电盖的弯曲的角部插入基板的孔中。焊球放置在孔的另一端。在随后的加热期间，焊球通过孔被拉出。当冷却时，导电材料抓住弯曲的下角的尖端，从而在导电盖和新形成的导电通孔之间建立良好的连接。当手指靠近电路（例如，指纹检测电路）时，手指首先将静电电荷放入到盖中，而不是进入电路，从而保护电路。在另一个封装中，盖由高电阻材料组成，以缓慢地耗散静电电荷。因此，电路中感应的寄生电流相对较低，并且避免了对电路的损坏。

99. 发明授权

US6143588A Method of making an integrated circuit package employing a transparent encapsulant 有权
标题翻译：制造采用透明密封剂的集成电路封装的方法
公开(公告)号：US6143588A
公开(公告)日：2000-11-07
申请号：US176048
申请日：1998-10-20
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L23/28 , H01L23/29 , H01L23/31 , H01L31/02 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/8592 , H01L24/45 , H01L2924/01013 , H01L2924/01014 , H01L2924/01037 , H01L2924/01039 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/14 , H01L2924/15311
摘要： A method of making an integrated circuit package for EPROM, CCD, and other optical integrated circuit devices is disclosed. First, a substrate base having metallized vias extending there through is provided. Second, an integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. Third, a bead of a viscous adhesive material is applied onto the substrate around the device. The bead covers the side surfaces of the device, the periphery of the upper first surface of the device, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. Fourth, a layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. Fifth, the encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light to illuminate the light sensitive circuitry of the device.
摘要翻译：公开了一种制造用于EPROM，CCD和其它光学集成电路器件的集成电路封装的方法。首先，提供具有在其上延伸的金属化通孔的基板基底。第二，将集成电路管芯固定到衬底的第一表面上，并且电连接到金属化通孔。第三，将粘性粘合剂材料的珠粒施加到装置周围的基底上。珠覆盖装置的侧表面，装置的上第一表面的周边和接合线。模头和模具的上部第一表面在模具上方形成空腔。第四，一层透明的包封材料沉积在模具中，由珠形成的空腔内。第五，封装材料硬化，随后形成封装的外表面。透明封装材料允许光照亮器件的光敏电路。

100. 发明授权

US5962810A Integrated circuit package employing a transparent encapsulant 失效
标题翻译：采用透明密封剂的集成电路封装
公开(公告)号：US5962810A
公开(公告)日：1999-10-05
申请号：US926507
申请日：1997-09-09
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L23/28 , H01L23/29 , H01L23/31 , H01L31/02 , H01L31/0203 , H01L23/02
CPC分类号： H01L31/0203 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/8592 , H01L24/45 , H01L2924/01013 , H01L2924/01014 , H01L2924/01037 , H01L2924/01039 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/14 , H01L2924/15311
摘要： An integrated circuit package for EPROM, CCD, and other optical integrated circuit devices has a substrate base having metallized vias extending there through. An integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. An adhesive bead is applied onto the substrate around the die. The bead covers the side surfaces of the die, the periphery of the upper first surface of the die, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. A layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. The encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light of a selected frequency to illuminate the light sensitive circuitry of the die.
摘要翻译：用于EPROM，CCD和其它光学集成电路器件的集成电路封装具有在其上延伸有金属化通孔的衬底基底。集成电路管芯固定到衬底的第一表面上，并且电连接到金属化通孔。在模具周围的基底上施加粘合剂珠粒。珠覆盖模具的侧表面，模具的上第一表面的周边和接合线。模头和模具的上部第一表面在模具上方形成空腔。一层透明的包封材料沉积在由该珠形成的空腔内的模具上。封装材料被硬化，随后形成封装的外表面。透明封装材料允许所选频率的光照射模具的光敏电路。

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