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91. 发明申请

US20070256765A1 High Strength Spring Steel, High Strength Springs and Manufacturing Method Thereof 审中-公开
标题翻译：高强度弹簧钢，高强度弹簧及其制造方法
公开(公告)号：US20070256765A1
公开(公告)日：2007-11-08
申请号：US11661139
申请日：2004-08-26
申请人： Kazuyoshi Kimura , Hiroshi Koyama , Akira Tange , Isamu Okuyama , Yosuke Hisano , Akio Yoneguchi
发明人： Kazuyoshi Kimura , Hiroshi Koyama , Akira Tange , Isamu Okuyama , Yosuke Hisano , Akio Yoneguchi
IPC分类号： C21D9/02 , C22C38/42
CPC分类号： F16F1/021 , B24C1/10 , C22C38/04 , C22C38/06 , C22C38/34 , C22C38/42 , C22C38/50
摘要： A high strength spring steel of this invention is characterized in containing, in percent of mass, of C: 0.36-0.48%; Si: 1.80-2.80%; Mn: 0.20-1.40%; P: 0.015% or less; S: 0.010% or less; Cu: 0.10-0.50%; Ni: 0.10-2.00%; Cr: 0.05-1.20%; s-Al: 0.005-0.040%; N: 0.002-0.012%; O: 0.002% or less, while the remainder is constituted of Fe and inevitable impurities and the quantity of inclusions of 10 μm or larger in diameter per field of vision of 100 mm2 is 10 or less. A manufacturing method of high strength spring of this invention is characterized in that the high strength spring steel which is tempered to HRC52 or higher is formed into a spring shape by hot forming or cold forming and warm shot peening is carried out so as to produce a high strength spring of 1176 MPa or higher in maximum shearing stress.
摘要翻译：本发明的高强度弹簧钢的特征在于以质量％计含有C：0.36-0.48％; Si：1.80-2.80％; Mn：0.20-1.40％; P：0.015％以下; S：0.010％以下; Cu：0.10-0.50％; Ni：0.10〜2.00％ Cr：0.05-1.20％ s-Al：0.005-0.040％; N：0.002-0.012％ O：0.002％以下，余量由Fe和不可避免的杂质构成，并且每个视野100mm 2以上的直径为10μm以上的夹杂物的量为10个以下。本发明的高强度弹簧的制造方法的特征在于，回火到HRC52以上的高强度弹簧钢通过热成型或冷成型而形成为弹簧形状，并进行温喷丸硬化，以产生最大剪切应力为1176 MPa以上的高强度弹簧。

92. 发明申请

US20060058480A1 Polymerizable monomer polymeric compound resin compositions for photoresist and method for producing semiconductor 审中-公开
标题翻译：用于光致抗蚀剂的可聚合单体聚合物树脂组合物和用于制备半导体的方法
公开(公告)号：US20060058480A1
公开(公告)日：2006-03-16
申请号：US10516176
申请日：2004-06-09
申请人： Hiroshi Koyama , Kiyoharu Tsutsumi
发明人： Hiroshi Koyama , Kiyoharu Tsutsumi
IPC分类号： C08F214/18
CPC分类号： C07D493/04 , C08F20/30 , G03F7/0397
摘要： A polymerizable monomer of the present invention is represented by the following formula (1); R1, R2 and R3 are each a hydrogen atom, a fluorine atom, an alkyl group or a fluoroalkyl group, W is a single bond or a linkage group and n is 0 or 1, where at least one of R1, R2 and R3 is a fluorine atom or a fluoroalkyl group when n=1; and the ring in the formula may have a substituent. The polymerizable monomer of the present invention can provide an appropriate hydrophilicity or hydrophilicity and transparency to a photoresist polymer.
摘要翻译：本发明的可聚合单体由下式（1）表示;

93. 发明授权

US07004612B2 Planar light source device and liquid-crystal display device 失效
标题翻译：平面光源装置和液晶显示装置
公开(公告)号：US07004612B2
公开(公告)日：2006-02-28
申请号：US11003732
申请日：2004-12-06
申请人： Tomotsugu Takahashi , Takahiko Ueda , Hiroshi Koyama
发明人： Tomotsugu Takahashi , Takahiko Ueda , Hiroshi Koyama
IPC分类号： F21V7/04
CPC分类号： G02B6/0055 , G02B6/0065
摘要： Provided is a planar light source device, which comprises a light guide having at least one side end serving as a light incident side and having one surface serving as a light-emitting side, a light source disposed in the vicinity of the side end of the light guide, and a light reflector disposed on the other side opposite to the light-emitting side, and which is characterized in that the light guide is essentially formed of a polyolefin resin, the light reflector is also essentially formed of a polyolefin resin, and when a piece of the light reflector having a face size of 1.5 cm×1.5 cm is prepared, and it is pressed against the surface of the light guide with its reflective face being in contact with the surface of the light guide under a load of 135 g/cm2 thereto, and, in that condition, when it is reciprocated 10 times on the surface of the light guide to a width of 5 cm every time at a speed of 2.5 cm/sec, then the surface of the light guide is not substantially scratched by it. The planar light source device is characterized in that the light guide therein is hardly scratched and the device is lightweight.
摘要翻译：提供一种平面光源装置，其包括具有至少一个侧端用作光入射侧并具有一个表面用作发光侧的光导，设置在该光源的侧端附近的光源导光体和配置在与发光侧相反的另一侧的光反射体，其特征在于，所述导光体基本上由聚烯烃树脂形成，所述光反射体也基本上由聚烯烃树脂形成，并且当准备具有1.5cm×1.5cm面积的光反射体的一部分时，其反射面在135°的负载下与导光体的表面接触而被压靠在导光体的表面上 g / cm 2，并且在该条件下，每当以2.5cm / sec的速度每次在导光体的表面上往复运动10次至5cm的宽度时，则导光体的表面基本上不划伤由它编辑。平面光源装置的特征在于，其中的导光体几乎不被划伤，并且该装置重量轻。

94. 发明申请

US20050245706A1 6-Trifluoromethyl-2 vinyloxy-4-oxatricyclo[4.2.1.03,7]noname-5-one, and polymer compound 审中-公开
标题翻译： 6-三氟甲基-2-乙烯基氧基-4-氧杂三环[4.2.1.03,7]壬-5-酮和高分子化合物
公开(公告)号：US20050245706A1
公开(公告)日：2005-11-03
申请号：US10522062
申请日：2004-06-17
申请人： Hiroshi Koyama , Kiyoharu Tsutsumi
发明人： Hiroshi Koyama , Kiyoharu Tsutsumi
IPC分类号： C07D307/77 , C07D307/93 , C08F16/26 , C08F12/20
CPC分类号： C07D307/93 , C08F16/26
摘要： 6-trifluoromethyl-2-vinyloxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one of the present invention is represented by the following formula (1). This compound can be produced by reacting 6-trifluoromethyl-2-hydroxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one represented by the following formula (2) with a compound represented by the following formula (3a) or (3b), wherein Ra and Rb are each a hydrogen atom or a hydrocarbon group.
摘要翻译：本发明的6-三氟甲基-2-乙烯基氧基-4-氧杂三环[4.2.1.0 3,7]壬-5-酮由下式（1）表示。该化合物可以通过使由下式（2）表示的6-三氟甲基-2-羟基-4-羟基三环[4.2.1.0 3,7]壬-5-酮与表示的化合物通过下式（3a）或（3b），其中R a和R b各自为氢原子或烃基。

95. 发明申请

US20050200019A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050200019A1
公开(公告)日：2005-09-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

96. 发明授权

US06309579B1 Method for forming a casting which includes an insert 失效
标题翻译：用于形成铸件的方法，其包括插入件
公开(公告)号：US06309579B1
公开(公告)日：2001-10-30
申请号：US09472985
申请日：1999-12-28
申请人： Hiroshi Koyama , Tsutomu Onoue , Keigo Asano , Tadatsugu Nakamura , Izuru Shoji
发明人： Hiroshi Koyama , Tsutomu Onoue , Keigo Asano , Tadatsugu Nakamura , Izuru Shoji
IPC分类号： B29C4514
CPC分类号： B29C45/73 , B29C45/14073 , B29C45/7337 , B29C2045/14852 , B29C2045/7343 , B29C2045/7356
摘要： An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
摘要翻译：插入件由可移动的保持构件保持在模具组内的空腔中。当插入物被保持构件保持时，将熔融的树脂注入腔中。保持构件在给定的时间与插入物分离。保持构件的表面被加热到高于模具的内表面的温度的温度。保持构件表面接触熔融树脂。模具内表面暴露在空腔中。

97. 发明授权

US5750792A Highly purified 1-aminopropanediol-2,3 失效
标题翻译：高纯度的1-氨基丙二醇-2,3
公开(公告)号：US5750792A
公开(公告)日：1998-05-12
申请号：US761815
申请日：1996-12-06
申请人： Hiroshi Koyama , Etsuo Takemoto
发明人： Hiroshi Koyama , Etsuo Takemoto
IPC分类号： C07C213/10 , C07C215/10 , C07C211/03
CPC分类号： C07C215/10 , C07C213/10
摘要： 1-aminopropanediol-2,3 containing 2-aminopropanediol-1,3 of less than 0.30% by weight can be prepared by the present purification process, which comprises distilling a l-aminopropanediol-2,3 containing at least 0.3% of 2-aminopropanediol-1,3 based on the weight of 1-aminopropanediol-2,3 with a distillation column, said distillation column having low pressure loss.
摘要翻译：可以通过本纯化方法制备含有小于0.30重量％的2-氨基丙二醇-1,3-的1-氨基丙二醇-2,3，其包括蒸馏含有至少0.3％的2-氨基丙二醇-2,3-二氨基丙二醇-1,3-基于1-氨基丙二醇-2,3的重量与蒸馏塔，所述蒸馏塔具有低压力损失。

98. 发明授权

US5680720A Illuminated signboard 失效
标题翻译：照明招牌
公开(公告)号：US5680720A
公开(公告)日：1997-10-28
申请号：US762795
申请日：1996-12-09
申请人： Harumitsu Asazuma , Hiroshi Koyama
发明人： Harumitsu Asazuma , Hiroshi Koyama
IPC分类号： B32B27/20 , B29C55/02 , B29K105/04 , B29K105/16 , B29L7/00 , B29L9/00 , B32B27/08 , C08J5/18 , G09F13/04 , G09F13/16 , B32B27/32
CPC分类号： C08J5/18 , B32B27/08 , G09F13/16 , C08J2323/12 , Y10S428/908 , Y10S428/91 , Y10T428/249987 , Y10T428/249992 , Y10T428/31909
摘要： An illuminated sign board which comprises a film having printing, a frame, and a light source is described. The film is a semi-transparent film made of a stretched resin film containing a finely divided powder of a white inorganic material. The semi-transparent film satisfies the following requirements (1) to (4): (1) an opacity of from 40% to 70%; (2) a whiteness of from 80% to 100%; (3) a total light beam average reflectance of from 30 to 60%; and (4) a total light beam average transmittance of from 30% to 70%.
摘要翻译：描述了包括具有打印的胶片，框架和光源的照明标志板。该膜是由含有白色无机材料的细粉末的拉伸树脂膜制成的半透明膜。半透明膜满足以下要求（1）〜（4）：（1）不透明度为40〜70％。（2）白度为80％至100％; （3）总光束平均反射率为30〜60％; 和（4）总光束平均透射率为30％至70％。

99. 发明授权

US5043290A Process for forming electrodes for semiconductor devices by focused ion beam technology 失效
标题翻译：通过聚焦离子束技术形成半导体器件电极的工艺
公开(公告)号：US5043290A
公开(公告)日：1991-08-27
申请号：US338274
申请日：1989-04-14
申请人： Tadashi Nishioka , Yoji Mashiko , Hiroaki Morimoto , Hiroshi Koyama
发明人： Tadashi Nishioka , Yoji Mashiko , Hiroaki Morimoto , Hiroshi Koyama
IPC分类号： H01L21/768
CPC分类号： H01L21/76877 , Y10S148/02 , Y10S148/05 , Y10S148/131 , Y10S148/158
摘要： A process for forming electrodes for semiconductor devices having a semiconductor substrate and an electrically conductive portion covered and protected by an electrically insulating coating. The process includes the steps of forming an electrically conductive film on the electrically insulating coating, forming an electrode to be connected to an external circuit on the electrically conductive film at a position overlying the electrically conductive portion by exposing portions of the electrically insulating coating and the first electrically conductive film to a converged ion beam, electrically connecting the electrode to the exposed portions of the electrically conductive film, and removing the portions of the electrically conductive film not covered by the electrode. As a result, the likelihood of breakdown of the internal circuit of the semiconductor device connected to the electrically conductive portion while the electrode is being formed is greatly reduced.

100. 发明授权

US4984455A System for detecting speed of engine for vehicle 失效
标题翻译：车辆发动机速度检测系统
公开(公告)号：US4984455A
公开(公告)日：1991-01-15
申请号：US503844
申请日：1990-04-03
申请人： Hiroshi Koyama , Masami Kondo , Hiroshi Kawahara
发明人： Hiroshi Koyama , Masami Kondo , Hiroshi Kawahara
IPC分类号： F02D29/00 , F02D41/22 , F02D41/34 , F02D45/00 , G01P21/02
CPC分类号： F02D41/0097 , F02D41/222 , G01P21/02
摘要： A system for detecting the speed of an engine for a vehicle calculates the engine speed in accordance with a signal which is outputted from a main rotation sensor in accordance with the operation of the engine. In case the main rotation sensor is subjected to malfunction, the engine speed is calculated using a back-up signal. Namely, an auxiliary rotation sensor detects the rotation of a portion of a power transmission device. When the above portion of the power transmission device is connected to an output shaft of the engine, the signal from the auxiliary rotation sensor is used as the back-up signal. When the two are disconnected from each other, a signal, representing the condition of the operation of an actuator for controlling the amount of supply of fuel to the engine, is used as the back-up signal.
摘要翻译：用于检测车辆的发动机的速度的系统根据从主旋转传感器输出的根据发动机的操作的信号来计算发动机转速。在主旋转传感器发生故障的情况下，使用备用信号计算发动机转速。即，辅助旋转传感器检测动力传递装置的一部分的旋转。当动力传递装置的上述部分连接到发动机的输出轴时，来自辅助旋转传感器的信号用作备用信号。当两者彼此断开时，表示用于控制向发动机供给燃料量的致动器的操作状态的信号作为备用信号。

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