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    • 91. 发明授权
    • Plastic encapsulated semiconductor light emitting device with a cover of fluorescent particles
    • 具有荧光颗粒盖的塑料封装半导体发光器件
    • US06472765B1
    • 2002-10-29
    • US09597038
    • 2000-06-20
    • Takeshi SanoHiroyuki Kawae
    • Takeshi SanoHiroyuki Kawae
    • H01L2328
    • H01L33/505H01L33/60H01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012
    • A plastic encapsulated semiconductor light emitting device comprises a plurality of leads 1, 2, one of which is formed with a dished portion 5; a semiconductor light emitting element 3 attached on a bottom surface 6 of the dished portion 5 for electrical connection of the light emitting element across the plurality of leads 1, 2; a plastic encapsulant 9 for sealing each end of the leads 1, 2, and the semiconductor light emitting element 3; a light-permeating cover 20 attached to an outer surface of the plastic encapsulant 9; and fluorescent particles 16 contained in the cover 20. As the number of fluorescent particles 16 at the vertex of the upper portion 22 is larger than that of the fluorescent particles 16 in the cylindrical lower portion 21, the semiconductor light emitting device can emit light with the nearly uniform light wavelength at any angular distance from the central axis of the plastic encapslant 9.
    • 塑料封装的半导体发光器件包括多个引线1,2,其中一个引线形成有一个碟形部分5; 安装在碟形部分5的底面6上的半导体发光元件3,用于将发光元件电连接到多个引线1,2; 用于密封引线1,2和半导体发光元件3的每一端的塑料密封剂9; 附着在塑料密封剂9的外表面上的透光罩20; 和包含在盖20中的荧光颗粒16.由于上部22的顶点处的荧光体颗粒16的数量大于圆筒形下部21中的荧光颗粒16的数量,所以半导体发光装置可以发光 在与塑料包封物9的中心轴线成任意角度距离处的近似均匀的光波长。