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    • 4. 发明申请
    • Method for Fabricating Micromachine Component of Resin
    • 制造树脂微机械成分的方法
    • US20090035706A1
    • 2009-02-05
    • US11922529
    • 2006-06-15
    • Nao HondaSatoshi MoriShuji TanakaMasayoshi Esashi
    • Nao HondaSatoshi MoriShuji TanakaMasayoshi Esashi
    • G03F7/20
    • F04D29/281B29C64/106B29C64/124B29L2031/7496B81C99/008F04D29/023F05D2230/31F05D2300/44
    • A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge potion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
    • 一种用于制造树脂微机械部件的方法,包括在基板上形成牺牲层的步骤(a),在牺牲层上依次形成至少两个感光性树脂组合物层的步骤(b),并对各感光性树脂组合物进行光刻 以形成限定微机械部件的周向边缘部分的气隙部分和构成微机械部件的内部结构以形成多层结构的气隙部分,用于在多层结构上沉积干膜抗蚀剂的步骤(c) 并进行干膜抗蚀剂层的光刻,形成固化的干膜抗蚀剂层,其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙 形成,并且步骤(d)用于分离具有多层st的微机械部件 通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层的结构。
    • 5. 发明授权
    • Method for fabricating micromachine component of resin
    • 制造树脂微机械部件的方法
    • US08481248B2
    • 2013-07-09
    • US11922529
    • 2006-06-15
    • Nao HondaSatoshi MoriShuji TanakaMasayoshi Esashi
    • Nao HondaSatoshi MoriShuji TanakaMasayoshi Esashi
    • G03F7/22
    • F04D29/281B29C64/106B29C64/124B29L2031/7496B81C99/008F04D29/023F05D2230/31F05D2300/44
    • A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
    • 一种用于制造树脂微机械部件的方法,包括在基板上形成牺牲层的步骤(a),在牺牲层上依次形成至少两个感光性树脂组合物层的步骤(b),并对各感光性树脂组合物进行光刻 形成限定微机械部件的周缘部的气隙部和构成微机械部件的内部结构的气隙部,形成多层结构,在多层结构体上设置干膜抗蚀剂的工序(c) 并进行干膜抗蚀剂层的光刻,形成固化的干膜抗蚀剂层,其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙 形成,并且步骤(d)用于分离具有多层的微机械部件 通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层结构。