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1. 发明授权

US08481248B2 Method for fabricating micromachine component of resin 失效
标题翻译：制造树脂微机械部件的方法
公开(公告)号：US08481248B2
公开(公告)日：2013-07-09
申请号：US11922529
申请日：2006-06-15
申请人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
发明人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
IPC分类号： G03F7/22
CPC分类号： F04D29/281 , B29C64/106 , B29C64/124 , B29L2031/7496 , B81C99/008 , F04D29/023 , F05D2230/31 , F05D2300/44
摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
摘要翻译：一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻形成限定微机械部件的周缘部的气隙部和构成微机械部件的内部结构的气隙部，形成多层结构，在多层结构体上设置干膜抗蚀剂的工序（c）并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙形成，并且步骤（d）用于分离具有多层的微机械部件通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层结构。

2. 发明申请

US20090035706A1 Method for Fabricating Micromachine Component of Resin 失效
标题翻译：制造树脂微机械成分的方法
公开(公告)号：US20090035706A1
公开(公告)日：2009-02-05
申请号：US11922529
申请日：2006-06-15
申请人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
发明人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
IPC分类号： G03F7/20
CPC分类号： F04D29/281 , B29C64/106 , B29C64/124 , B29L2031/7496 , B81C99/008 , F04D29/023 , F05D2230/31 , F05D2300/44
摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge potion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
摘要翻译：一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻以形成限定微机械部件的周向边缘部分的气隙部分和构成微机械部件的内部结构以形成多层结构的气隙部分，用于在多层结构上沉积干膜抗蚀剂的步骤（c）并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙形成，并且步骤（d）用于分离具有多层st的微机械部件通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层的结构。

3. 发明申请

US20120217638A1 WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE 有权
标题翻译：接线方法和功能设备
公开(公告)号：US20120217638A1
公开(公告)日：2012-08-30
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L21/762
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

4. 发明申请

US20060130527A1 Method of fabricating mold for glass press 审中-公开
标题翻译：制造玻璃压制模具的方法
公开(公告)号：US20060130527A1
公开(公告)日：2006-06-22
申请号：US10557843
申请日：2004-03-22
申请人： Shuji Tanaka , Masayoshi Esashi
发明人： Shuji Tanaka , Masayoshi Esashi
IPC分类号： C03B11/08 , B28B7/38 , B05D1/36
CPC分类号： B32B18/00 , B81C99/009 , B81C2201/034 , C03B11/082 , C03B11/086 , C03B2215/22 , C03B2215/32 , C03B2215/412 , C04B35/565 , C04B37/001 , C04B37/006 , C04B2235/656 , C04B2235/6567 , C04B2235/963 , C04B2237/083 , C04B2237/123 , C04B2237/365 , C04B2237/568 , C04B2237/64 , C04B2237/704 , C04B2237/708
摘要： A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.
摘要翻译：一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。在这种制造玻璃压模的方法中，通过插入金属薄膜，可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

5. 发明授权

US09478503B2 Integrated device 有权
标题翻译：集成设备
公开(公告)号：US09478503B2
公开(公告)日：2016-10-25
申请号：US14389103
申请日：2013-02-28
申请人： Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
发明人： Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
IPC分类号： H01L23/552 , H01L23/538 , B81B7/00 , H01L21/78 , H01L21/683 , H01L21/306 , H01L25/18 , H01L27/06 , H01L25/07 , H01L25/16 , B81C1/00 , H01L25/00 , H01L29/06
CPC分类号： H01L23/552 , B81B7/008 , B81C1/00238 , B81C2203/0792 , H01L21/3043 , H01L21/30625 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/5386 , H01L25/072 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/0611 , H01L29/0657 , H01L2221/68327 , H01L2224/94 , H01L2924/0002 , H01L2924/00 , H01L2224/03
摘要： An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
摘要翻译：提供了具有高绝缘公差的集成器件。在相邻的装置之间设有具有倾斜侧面的凹槽。当安装电子电路或MEMS装置的一侧是前表面时，由于倾斜表面，凹槽从前表面变窄到后表面。模具材料（绝缘材料）设置在凹槽内，使得多个装置机械地接合在一起，彼此电绝缘。形成相邻器件之间形成电导通的线构件沿着沟槽的侧表面和底表面。为了将线导出到背面，凹槽的底表面具有孔，使得线构件从孔的背面露出。

6. 发明授权

US09215089B2 Touch sensor system 有权
标题翻译：触摸传感器系统
公开(公告)号：US09215089B2
公开(公告)日：2015-12-15
申请号：US13502078
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G06F13/00 , H04L12/40 , G01L1/14 , G01L5/22 , G06F13/376
CPC分类号： H04L12/40032 , G01L1/142 , G01L1/146 , G01L5/228 , G06F13/376 , H04L12/40013
摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
摘要翻译：触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据发送单元，其将传感器数据信号输出到总线的信号线。快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

7. 发明授权

US08823114B2 Sensor device having electrode draw-out portions through side of substrate 有权
标题翻译：传感器装置具有通过衬底侧的电极引出部分
公开(公告)号：US08823114B2
公开(公告)日：2014-09-02
申请号：US13502083
申请日：2010-10-13
申请人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： H01L29/84 , H01L23/48 , G01L5/22 , G01L1/14 , B81C1/00 , H01L23/00 , H01L23/10
CPC分类号： B81C1/00238 , B81B2201/0264 , B81B2207/012 , B81C2201/019 , B81C2203/032 , B81C2203/0792 , G01L1/146 , G01L1/148 , G01L5/228 , H01L23/10 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/94 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/3512 , H01L2924/00
摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
摘要翻译：提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。传感器结构具有接触感应表面和传感器电极。信号处理集成电路嵌入在半导体衬底中。传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

8. 发明授权

US08796850B2 Wiring connection method and functional device 有权
标题翻译：接线方式及功能设备
公开(公告)号：US08796850B2
公开(公告)日：2014-08-05
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

9. 发明授权

US08613231B2 Sheet-like tactile sensor system 有权
标题翻译：片状触觉传感器系统
公开(公告)号：US08613231B2
公开(公告)日：2013-12-24
申请号：US13502082
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
IPC分类号： G01D7/00 , G01L3/00 , G01L3/22
CPC分类号： G01L5/228 , G01L1/142 , G01L1/144 , G01L1/146 , G06F3/0414
摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
摘要翻译：提供能够检测法向应力的多个法向应力检测传感器单元和片层部。片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置，检测片部分。

10. 发明授权

US08336399B2 Sensor system 有权
标题翻译：传感器系统
公开(公告)号：US08336399B2
公开(公告)日：2012-12-25
申请号：US12903673
申请日：2010-10-13
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G01D7/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
摘要翻译：传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分，其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得第一感测装置的检测特性与第二感测装置的检测特性不同。

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