专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110084573A1 ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME 有权
标题翻译：弹性波装置及使用该装置的电子装置
公开(公告)号：US20110084573A1
公开(公告)日：2011-04-14
申请号：US12903326
申请日：2010-10-13
申请人： Toru YAMAJI , Tetsuhiro Korechika , Koji Kawakita , Eiji Kawamoto , Mitsuhiro Furukawa , Kozo Murakami
发明人： Toru YAMAJI , Tetsuhiro Korechika , Koji Kawakita , Eiji Kawamoto , Mitsuhiro Furukawa , Kozo Murakami
IPC分类号： H01L41/047 , H01L41/053
CPC分类号： H03H9/132 , H03H9/059 , H03H9/1092
摘要： An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.
摘要翻译：弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。第二连接电极的水平截面形状是非圆形的。

2. 发明授权

US08471433B2 Elastic wave device and electronic device using the same 有权
标题翻译：弹性波装置及使用其的电子装置
公开(公告)号：US08471433B2
公开(公告)日：2013-06-25
申请号：US12903326
申请日：2010-10-13
申请人： Toru Yamaji , Tetsuhiro Korechika , Koji Kawakita , Eiji Kawamoto , Mitsuhiro Furukawa , Kozo Murakami
发明人： Toru Yamaji , Tetsuhiro Korechika , Koji Kawakita , Eiji Kawamoto , Mitsuhiro Furukawa , Kozo Murakami
IPC分类号： H03H9/02 , H03H9/05
CPC分类号： H03H9/132 , H03H9/059 , H03H9/1092
摘要： An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.
摘要翻译：弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。第二连接电极的水平截面形状是非圆形的。

3. 发明授权

US08564171B2 Acoustic wave element and electronic device including the same 有权
标题翻译：声波元件和包括其的电子设备
公开(公告)号：US08564171B2
公开(公告)日：2013-10-22
申请号：US13248148
申请日：2011-09-29
申请人： Toru Yamaji , Mitsuhiro Furukawa , Koji Kawakita , Eiji Kawamoto
发明人： Toru Yamaji , Mitsuhiro Furukawa , Koji Kawakita , Eiji Kawamoto
IPC分类号： H03H9/25
CPC分类号： H03H9/1092
摘要： An acoustic wave element includes a piezoelectric substrate, an IDT electrode, a sidewall, a lid, and an adhesive layer. The IDT electrode is provided on the piezoelectric substrate. The sidewall is provided around the IDT electrode above the piezoelectric substrate. The lid is provided above the sidewall so as to cover a space above the IDT electrode. The adhesive layer is made of an adhesive provided between the lid and the sidewall. The top surface of the sidewall has a groove. The groove is filled with an adhesive, which reduces the protrusion amount of the adhesive.
摘要翻译：声波元件包括压电基片，IDT电极，侧壁，盖子和粘合剂层。 IDT电极设置在压电基片上。侧壁设置在压电基板上方的IDT电极周围。盖子设置在侧壁上方以覆盖IDT电极上方的空间。粘合剂层由设置在盖和侧壁之间的粘合剂制成。侧壁的顶面具有凹槽。凹槽填充有粘合剂，这降低了粘合剂的突出量。

4. 发明授权

US08334737B2 Acoustic wave device and electronic apparatus using the same 有权
标题翻译：声波装置及使用其的电子装置
公开(公告)号：US08334737B2
公开(公告)日：2012-12-18
申请号：US12836867
申请日：2010-07-15
申请人： Toru Yamaji , Koji Kawakita , Eiji Kawamoto
发明人： Toru Yamaji , Koji Kawakita , Eiji Kawamoto
IPC分类号： H03H9/00 , H01L41/00
CPC分类号： H03H9/1092 , H03H9/02937
摘要： An acoustic wave device includes a piezoelectric substrate, an IDT electrode on the substrate, an internal electrode above the substrate, a side wall above the internal electrode, a lid on the side wall, an electrode base layer on the internal electrode, a connection electrode on the electrode base layer, and an anti-corrosion layer between the internal electrode and the side wall. The internal electrode is electrically connected to the IDT electrode. The side wall surrounds the IDT electrode. The lid covers the IDT electrode to provide a space above the IDT electrode. The electrode base layer is provided outside the space and the side wall. The anti-corrosion layer protrudes outside the side wall, and is made of material less soluble in plating solution than the internal electrode. This acoustic wave device prevents the internal electrode from breaking due to plating solution, hence being manufactured at a high yield rate.
摘要翻译：声波装置包括压电基板，基板上的IDT电极，基板上方的内部电极，内部电极上的侧壁，侧壁上的盖，内部电极的电极基极层，连接电极在电极基底层上，以及内部电极和侧壁之间的防腐蚀层。内部电极与IDT电极电连接。侧壁围绕IDT电极。盖子覆盖IDT电极，以提供IDT电极上方的空间。电极基层设置在空间和侧壁的外侧。防腐层突出到侧壁的外侧，并且由比内部电极更不溶于电镀溶液的材料制成。该声波装置防止内部电极由于电镀液而破裂，因此以高产率制造。

5. 发明申请

US20110012695A1 ACOUSTIC WAVE DEVICE AND ELECTRONIC APPARATUS USING THE SAME 有权
标题翻译：声波装置和使用它的电子装置
公开(公告)号：US20110012695A1
公开(公告)日：2011-01-20
申请号：US12836867
申请日：2010-07-15
申请人： Toru Yamaji , Koji Kawakita , Eiji Kawamoto
发明人： Toru Yamaji , Koji Kawakita , Eiji Kawamoto
IPC分类号： H03H9/64
CPC分类号： H03H9/1092 , H03H9/02937
摘要： An acoustic wave device includes a piezoelectric substrate, an IDT electrode on the substrate, an internal electrode above the substrate, a side wall above the internal electrode, a lid on the side wall, an electrode base layer on the internal electrode, a connection electrode on the electrode base layer, and an anti-corrosion layer between the internal electrode and the side wall. The internal electrode is electrically connected to the IDT electrode. The side wall surrounds the IDT electrode. The lid covers the IDT electrode to provide a space above the IDT electrode. The electrode base layer is provided outside the space and the side wall. The anti-corrosion layer protrudes outside the side wall, and is made of material less soluble in plating solution than the internal electrode. This acoustic wave device prevents the internal electrode from breaking due to plating solution, hence being manufactured at a high yield rate.
摘要翻译：声波装置包括压电基板，基板上的IDT电极，基板上方的内部电极，内部电极上的侧壁，侧壁上的盖，内部电极的电极基极层，连接电极在电极基底层上，以及内部电极和侧壁之间的防腐蚀层。内部电极与IDT电极电连接。侧壁围绕IDT电极。盖子覆盖IDT电极，以提供IDT电极上方的空间。电极基层设置在空间和侧壁的外侧。防腐层突出到侧壁的外侧，并且由比内部电极更不溶于电镀溶液的材料制成。该声波装置防止内部电极由于电镀液而破裂，因此以高产率制造。

6. 发明申请

US20050013082A1 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US20050013082A1
公开(公告)日：2005-01-20
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L21/60 , H05K3/28 , H05K3/34 , H02H1/00
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

7. 发明授权

US06347584B1 Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
标题翻译：使用具有双重释放层的凹版印刷电路板制造方法
公开(公告)号：US06347584B1
公开(公告)日：2002-02-19
申请号：US09589346
申请日：2000-06-08
申请人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
发明人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
IPC分类号： B41N106
CPC分类号： B41N1/06 , B41M1/10 , H05K1/0306 , H05K1/0313 , H05K1/0393 , H05K3/207 , H05K2203/0113
摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.
摘要翻译：使用凹版印刷制造电子元件以提高印刷产量的方法。使用具有双重释放层结构的凹版1。在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

8. 发明授权

US4595178A Leg for vacuum tank for refining molten steel 失效
标题翻译：用于精炼钢水的真空罐腿
公开(公告)号：US4595178A
公开(公告)日：1986-06-17
申请号：US687634
申请日：1984-12-31
申请人： Hitoshi Kato , Eiji Kawamoto
发明人： Hitoshi Kato , Eiji Kawamoto
IPC分类号： C21C7/10 , F27D1/00 , F27D3/15
CPC分类号： F27D3/1518 , C21C7/10 , F27D1/0006
摘要： A leg is fitted through a joint material into each of a pair of vertical openings on a bottom wall of a vacuum tank for refining molten steel, for protecting the vertical openings from molten steel. The abovementioned leg has an annular inner wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal annular rows arranged one on the other so as to form an inner bore for passing molten steel therethrough. The leg also has an annular outer wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal rows arranged one on the other so as to cover substantially the entire outer surface of the annular inner wall. The inner surface of the annular outer wall is in contact with the outer surface of the annular inner wall through a joint material.
摘要翻译：一个腿通过接头材料装配到真空罐的底壁上的一个垂直开口中，用于精炼钢水，用于保护垂直开口免受钢水的影响。上述腿具有环形内壁，该内壁通过多个相互排列的多个水平环形列中的多个氧化镁 - 铬烧制的径向堆叠接合材料而形成，以形成用于使钢水通过的内孔。腿还具有环形外壁，该环形外壁通过将多个相互排列的多个水平排中的多个氧化镁 - 铬烧制的径向砖堆叠在一起而形成，以便基本上覆盖环形内壁的整个外表面。环形外壁的内表面通过接头材料与环形内壁的外表面接触。

9. 发明授权

US07532485B2 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US07532485B2
公开(公告)日：2009-05-12
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.
摘要翻译：多层模块包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。连接端子设置在电路板的树脂层或另一表面处，并且设置用于在模块的两个表面之间连接的通孔。还包括在与连接端子相对应的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。绝缘层设置在导体层之间，绝缘层分别具有用于连接端子之间连接的导电接合。模块中的通孔和电子部件的位置不受通孔的位置的限制。

10. 发明申请

US20050249933A1 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US20050249933A1
公开(公告)日：2005-11-10
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： H05K1/09 , B32B5/00 , B32B5/14 , B32B15/08 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40 , D04H1/00
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式