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1. 发明申请

US20050249933A1 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US20050249933A1
公开(公告)日：2005-11-10
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： H05K1/09 , B32B5/00 , B32B5/14 , B32B15/08 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40 , D04H1/00
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

2. 发明授权

US07754321B2 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US07754321B2
公开(公告)日：2010-07-13
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： B32B27/04
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

3. 发明授权

US06833042B2 Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US06833042B2
公开(公告)日：2004-12-21
申请号：US10149667
申请日：2002-10-09
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： B29C6500
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

4. 发明授权

US06890449B2 Method for manufacturing printed-circuit board 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US06890449B2
公开(公告)日：2005-05-10
申请号：US10048927
申请日：2001-06-05
申请人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
发明人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H01K13/00 , H05K3/36
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
摘要翻译：一种制造PCB的方法，包括以下步骤：在前面和背面上形成具有释放层的衬底中的通孔; 在通孔中填充导电膏; 去除释放层并在金属箔的两个面上设置金属箔; 并热压它们。通孔的直径大于形成在释放层上的相应孔的直径。根据本发明，当导电膏被压缩时，从基板的表面突出的导电糊被截留在通孔的边缘。这种配置可以防止出现不良布线图形的短路。因此，足够量的导电膏可以从基板的表面突出。因此，在压缩之后，确保导电浆料内部和导电性糊料与金属箔之间的稳定的电连接，从而可以制造出具有高可靠性的PCB。

5. 发明授权

US06523258B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US06523258B2
公开(公告)日：2003-02-25
申请号：US09799812
申请日：2001-03-07
申请人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka
发明人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka
IPC分类号： H05K302
CPC分类号： H05K3/4069 , H05K3/0032 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A method of performing a printed circuit board including the steps of: (a) disposing a first release film on the surface of a substrate and a second release film on the back of the substrate; (b) forming a through-hole in the first release film, the second release film, and the substrate; (c) filling conductive paste into a through-hole; (d) removing the first release film and the second release film from the substrate with the through-hole filled with the conductive paste; (e) placing a first metallic member on the surface of the substrate with the release films removed and placing a second metallic member on the back of the substrate; (f) compressing under heat the substrate with the first metallic member and the second metallic member disposed thereon; and (g) forming a desired circuit pattern on the first metallic member and the second metallic member.
摘要翻译：一种执行印刷电路板的方法，包括以下步骤：（a）在基板的表面上设置第一剥离膜和在基板的背面设置第二剥离膜; （b）在第一脱模膜，第二剥离膜和基材中形成通孔; （c）将导电膏填充到通孔中; （d）使填充有导电糊的通孔从基板上除去第一剥离膜和第二剥离膜; （e）将第一金属构件放置在基板的表面上，同时移除释放膜并将第二金属构件放置在基板的背面上; （f）在第一金属构件和设置在其上的第二金属构件的基板上加热压缩; 和（g）在第一金属构件和第二金属构件上形成期望的电路图案。

6. 发明授权

US07532485B2 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US07532485B2
公开(公告)日：2009-05-12
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.
摘要翻译：多层模块包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。连接端子设置在电路板的树脂层或另一表面处，并且设置用于在模块的两个表面之间连接的通孔。还包括在与连接端子相对应的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。绝缘层设置在导体层之间，绝缘层分别具有用于连接端子之间连接的导电接合。模块中的通孔和电子部件的位置不受通孔的位置的限制。

7. 发明授权

US5448055A Direct-contact type image sensor using optical fiber array with light absorbing cladding 失效
标题翻译：直接接触式图像传感器，采用光吸收包层光纤阵列
公开(公告)号：US5448055A
公开(公告)日：1995-09-05
申请号：US161123
申请日：1993-12-02
申请人： Tetsuro Nakamura , Eiji Kawamoto , Shinji Fujiwara
发明人： Tetsuro Nakamura , Eiji Kawamoto , Shinji Fujiwara
IPC分类号： G02B6/08 , H04N1/031 , H01J40/14
CPC分类号： H04N1/0312 , G02B6/08 , H04N1/0311 , H04N1/0315
摘要： The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.
摘要翻译：本发明提供一种直接接触型图像传感器装置，其中具有电极和感光元件阵列的图像传感器芯片通过倒装芯片接合方法安装在光纤阵列板上。光纤阵列板包括：第一不透明基板，第二不透明基板，通过布置多根光纤形成的光纤阵列;以及与光纤阵列的侧面接触设置的透明部件，所述光纤阵列并且所述透明构件插入在所述第一和第二不透明基板之间。多个光纤中的每一个包括中心芯，设置在芯的外表面上的包层以及设置在包层的外表面上的光吸收层。图像传感器芯片以这样的方式设置，使得光敏元件阵列沿着光纤阵列的上端布置，并且在除了透明构件之外的光纤阵列板的一部分中，透明构件形成用于透射光的狭缝。

8. 发明申请

US20050013082A1 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US20050013082A1
公开(公告)日：2005-01-20
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L21/60 , H05K3/28 , H05K3/34 , H02H1/00
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

9. 发明授权

US06347584B1 Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
标题翻译：使用具有双重释放层的凹版印刷电路板制造方法
公开(公告)号：US06347584B1
公开(公告)日：2002-02-19
申请号：US09589346
申请日：2000-06-08
申请人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
发明人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
IPC分类号： B41N106
CPC分类号： B41N1/06 , B41M1/10 , H05K1/0306 , H05K1/0313 , H05K1/0393 , H05K3/207 , H05K2203/0113
摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.
摘要翻译：使用凹版印刷制造电子元件以提高印刷产量的方法。使用具有双重释放层结构的凹版1。在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

10. 发明授权

US4595178A Leg for vacuum tank for refining molten steel 失效
标题翻译：用于精炼钢水的真空罐腿
公开(公告)号：US4595178A
公开(公告)日：1986-06-17
申请号：US687634
申请日：1984-12-31
申请人： Hitoshi Kato , Eiji Kawamoto
发明人： Hitoshi Kato , Eiji Kawamoto
IPC分类号： C21C7/10 , F27D1/00 , F27D3/15
CPC分类号： F27D3/1518 , C21C7/10 , F27D1/0006
摘要： A leg is fitted through a joint material into each of a pair of vertical openings on a bottom wall of a vacuum tank for refining molten steel, for protecting the vertical openings from molten steel. The abovementioned leg has an annular inner wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal annular rows arranged one on the other so as to form an inner bore for passing molten steel therethrough. The leg also has an annular outer wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal rows arranged one on the other so as to cover substantially the entire outer surface of the annular inner wall. The inner surface of the annular outer wall is in contact with the outer surface of the annular inner wall through a joint material.
摘要翻译：一个腿通过接头材料装配到真空罐的底壁上的一个垂直开口中，用于精炼钢水，用于保护垂直开口免受钢水的影响。上述腿具有环形内壁，该内壁通过多个相互排列的多个水平环形列中的多个氧化镁 - 铬烧制的径向堆叠接合材料而形成，以形成用于使钢水通过的内孔。腿还具有环形外壁，该环形外壁通过将多个相互排列的多个水平排中的多个氧化镁 - 铬烧制的径向砖堆叠在一起而形成，以便基本上覆盖环形内壁的整个外表面。环形外壁的内表面通过接头材料与环形内壁的外表面接触。

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