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1. 发明授权

US07532485B2 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US07532485B2
公开(公告)日：2009-05-12
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.
摘要翻译：多层模块包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。连接端子设置在电路板的树脂层或另一表面处，并且设置用于在模块的两个表面之间连接的通孔。还包括在与连接端子相对应的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。绝缘层设置在导体层之间，绝缘层分别具有用于连接端子之间连接的导电接合。模块中的通孔和电子部件的位置不受通孔的位置的限制。

2. 发明申请

US20060261472A1 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US20060261472A1
公开(公告)日：2006-11-23
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H01L23/34
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.
摘要翻译：一种多层模块，其包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。已经在树脂层或电路板的另一表面设置了连接端子，并且还提供了用于在模块的两个表面之间连接的通孔。还包括在对应于连接端子的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。在导体层和导体层之间设置绝缘层，绝缘层分别具有用于连接端子之间连接的导电接合层。在上述结构中，模块中的通孔和电子部件的位置不受通孔的位置的限制。

3. 发明授权

US07694415B2 Method of manufacturing component-embedded printed wiring board 失效
标题翻译：组件嵌入式印刷电路板的制造方法
公开(公告)号：US07694415B2
公开(公告)日：2010-04-13
申请号：US11434763
申请日：2006-05-17
申请人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
发明人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
IPC分类号： H05K3/30
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.
摘要翻译：印刷电路板（PWB）包括：（a）形成在与电子部件相对应的位置处的流体树脂嵌入部，使得嵌入部分覆盖电子部件，（b）与顶部平行放置的树脂流速加速器电路板的表面并围绕嵌入部分，以及（c）至少在加速器和电路板之间放置树脂。流体树脂嵌入部分填充与粘合树脂相同的树脂。这种结构允许加速器在施加到PWB上的压力下压缩树脂，使得树脂趋于沿着电路板流动。结果，流体树脂嵌入部分被树脂充分填充而不会留下任何空气，从而可获得可靠的PWB。

4. 发明申请

US20100147569A1 COMPONENT-EMBEDDED PRINTED WIRING BOARD 审中-公开
标题翻译：组件嵌入式印刷线路板
公开(公告)号：US20100147569A1
公开(公告)日：2010-06-17
申请号：US12709573
申请日：2010-02-22
申请人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
发明人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
IPC分类号： H05K1/00
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.
摘要翻译：公开了一种组件嵌入式印刷电路板（PWB）。该PWB包括（a）在与电子部件相对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行放置的树脂流速加速器并且包围所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。流体树脂嵌入部分填充与粘合树脂相同的树脂。这种结构允许加速器在施加到PWB上的压力下压缩树脂，使得树脂趋于沿着电路板流动。结果，流体树脂嵌入部分被树脂充分填充而不会留下任何空气，从而可获得可靠的PWB。

5. 发明申请

US20060260122A1 Component-embedded printed wiring board and method of manufacturing the same 失效
标题翻译：组件嵌入式印刷电路板及其制造方法
公开(公告)号：US20060260122A1
公开(公告)日：2006-11-23
申请号：US11434763
申请日：2006-05-17
申请人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
发明人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at place corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with a pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any airs, and the reliable PWB is thus obtainable.
摘要翻译：公开了一种组件嵌入式印刷电路板（PWB）。该PWB包括（a）在与电子部件对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行设置的树脂流速加速器，围绕所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。流体树脂嵌入部分填充与粘合树脂相同的树脂。这种结构允许加速器以施加到PWB的压力来压缩树脂，使得树脂趋于沿着电路板流动。结果，流体树脂嵌入部分被树脂充分填充而不留下任何空气，从而可获得可靠的PWB。

6. 发明申请

US20050233122A1 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein 审中-公开
标题翻译：层叠基板的制造方法以及用于其中的模块和层压基板的半导体装置的制造装置
公开(公告)号：US20050233122A1
公开(公告)日：2005-10-20
申请号：US11107852
申请日：2005-04-18
申请人： Mikio Nishimura , Toshihiko Mori , Kazuhiko Honjou , Junichi Kimura , Toshihiro Nishii , Shinji Harada , Motoyoshi Kitagawa
发明人： Mikio Nishimura , Toshihiko Mori , Kazuhiko Honjou , Junichi Kimura , Toshihiro Nishii , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： B32B3/00 , H01L21/56 , H01L23/31 , H01L23/538 , H05K1/18 , H05K3/28 , H05K3/46
CPC分类号： H05K1/186 , H01L21/56 , H01L23/3121 , H01L2224/16225 , H01L2224/73204 , H01L2924/01078 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K3/284 , H05K3/4652 , H05K2203/063 , Y10T428/24917
摘要： The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.
摘要翻译：本发明提供一种能够实现小型便携式电子设备的层压基板的制造方法。预浸料141是在第一温度范围内保持板状的热固性树脂，在第二温度范围内具有热流动性，并且在第三温度范围内固化，积分过程（118）包括加热预浸料（141）的软化（120）到第二温度范围，并且软化浸渍在预浸料坯（141）中的树脂，在预浸料坯（141）之前压制预浸料坯（141）的强制流动（122）达到第三温度范围，并迫使树脂流入空间和间隙半导体（105），电阻器（106）和基板（101），以及加热预浸料（141）的硬化（123）至第三温度范围。结果，在不使用中间材料的情况下，可以用树脂牢固地填充半导体（105），电阻器（106）和基板（101）之间形成的空间和间隙。

7. 发明授权

US07546107B2 Apparatus and method for interference canceller in a high frequency receiver and transmitter 失效
标题翻译：高频接收机和发射机中干扰消除器的装置和方法
公开(公告)号：US07546107B2
公开(公告)日：2009-06-09
申请号：US10587183
申请日：2005-12-13
申请人： Masaaki Noda , Motoyoshi Kitagawa
发明人： Masaaki Noda , Motoyoshi Kitagawa
IPC分类号： H04B1/00 , H04M1/00
CPC分类号： H04B1/126 , H04B1/525
摘要： A high frequency receiver capable of stably canceling interference by a transmission signal even if a transmission signal input from a TV antenna is changed. Phase shifter (212) for changing a phase of an interfering distributed transmission signal, detector (216) for detecting a level of a transmission signal included in a receive signal input via an antenna, and level regulator (213) for changing a level of the distributed transmission signal in accordance with this level are provided. A signal input via level regulator (213) and phase shifter (212) and a receive signal are synthesized to be input into mixer (206). Since a transmission signal can be cancelled even if a transmission signal input from an antenna is changed, a high frequency receiver can receive a signal stably when a transmission signal is changed.
摘要翻译：即使从TV天线输入的发送信号发生变化，能够稳定地消除发送信号的干扰的高频接收机。用于改变干扰分布式发送信号的相位的移相器（212），用于检测包括在通过天线输入的接收信号中的发送信号的电平的检测器（216）和用于改变经由天线输入的电平的电平调节器（213）提供了根据该级别的分布式传输信号。通过电平调节器（213）和移相器（212）的输入信号和接收信号被合成输入到混频器（206）中。由于即使从天线输入的发送信号发生变化也能够消除发送信号，所以当发送信号变化时，高频接收机能够稳定地接收信号。

8. 发明申请

US20070173282A1 High Frequency receiver, integrated circuit used therefor, portable equipment using them, transmitter used therefor, and manufacturing method thereof 失效
标题翻译：高频接收机，用于其的集成电路，使用它们的便携式设备，其使用的发射机及其制造方法
公开(公告)号：US20070173282A1
公开(公告)日：2007-07-26
申请号：US10587183
申请日：2005-12-13
申请人： Masaaki Noda , Motoyoshi Kitagawa
发明人： Masaaki Noda , Motoyoshi Kitagawa
IPC分类号： H04B1/44 , H04B1/18 , H04B1/26 , H04M1/00
CPC分类号： H04B1/126 , H04B1/525
摘要： A high frequency receiver capable of stably canceling interference by a transmission signal even if a transmission signal input from a TV antenna is changed. Phase shifter (212) for changing a phase of an interfering distributed transmission signal, detector (216) for detecting a level of a transmission signal included in a receive signal input via an antenna, and level regulator (213) for changing a level of the distributed transmission signal in accordance with this level are provided. A signal input via level regulator (213) and phase shifter (212) and a receive signal are synthesized to be input into mixer (206). Since a transmission signal can be cancelled even if a transmission signal input from an antenna is changed, a high frequency receiver can receive a signal stably when a transmission signal is changed.
摘要翻译：即使从TV天线输入的发送信号发生变化，能够稳定地消除发送信号的干扰的高频接收机。用于改变干扰分布式发送信号的相位的移相器（212），用于检测包括在通过天线输入的接收信号中的发送信号的电平的检测器（216）和用于改变经由天线输入的电平的电平调节器（213）提供了根据该级别的分布式传输信号。通过电平调节器（213）和移相器（212）的输入信号和接收信号被合成输入到混频器（206）中。由于即使从天线输入的发送信号发生变化也能够消除发送信号，所以当发送信号变化时，高频接收机能够稳定地接收信号。

9. 发明授权

US6052571A Tuner for PSK or PAM data applications 失效
标题翻译：调谐器用于PSK或PAM数据应用
公开(公告)号：US6052571A
公开(公告)日：2000-04-18
申请号：US969253
申请日：1997-11-13
申请人： Akira Mishima , Shigeharu Sumi , Motoyoshi Kitagawa
发明人： Akira Mishima , Shigeharu Sumi , Motoyoshi Kitagawa
IPC分类号： H01F21/02 , H01F21/04 , H01F41/04 , H03B5/18 , H03J1/00 , H03J1/14 , H03J3/00 , H03J7/06 , H03L7/099 , H03L7/18 , H04L27/152 , H04L27/227 , H04L27/233 , H03J3/28 , H03J5/02 , H03L7/08 , H04L27/22
CPC分类号： H03L7/0805 , H01F21/02 , H01F21/04 , H01F41/045 , H03B5/1841 , H03J1/0041 , H03J1/005 , H03J1/14 , H03J3/00 , H03J7/065 , H03L7/099 , H03L7/18 , H04L27/152 , H04L27/227 , H04L27/233
摘要： A high frequency apparatus for receiving digitally modulated high frequency signals withstands vibration and has a simple tuning adjustment. The apparatus has an input terminal, a mixer which mixes the input signals and an output signal from a local oscillator, a voltage controlled oscillator which includes the local oscillator, an oscillating section, a movable conductive member and, a gluing agent for maintaining an adjusted state, and a control loop having a high loop band width which is large enough so that noise of the local oscillator is not dominated by noise of the voltage controlled oscillator.
摘要翻译：一种用于接收经数字调制的高频信号经受振动并具有简单的调谐调节的高频装置。该装置具有输入端子，混合输入信号和来自本地振荡器的输出信号的混频器，包括本地振荡器的压控振荡器，振荡部分，可移动导电部件和用于保持调节的粘合剂状态和具有足够大的高环路带宽的控制环路，使得本地振荡器的噪声不受压控振荡器的噪声的支配。

10. 发明申请

US20090316364A1 HIGH FREQUENCY DEVICE 审中-公开
标题翻译：高频器件
公开(公告)号：US20090316364A1
公开(公告)日：2009-12-24
申请号：US12548527
申请日：2009-08-27
申请人： Takashi Yamada , Hideki Nanba , Shinji Takano , Toshiaki Nakamura , Yasuteru Asakawa , Motoyoshi Kitagawa
发明人： Takashi Yamada , Hideki Nanba , Shinji Takano , Toshiaki Nakamura , Yasuteru Asakawa , Motoyoshi Kitagawa
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K9/006 , H01P1/2053
摘要： A high frequency device includes an antenna connector adapted to be connected with an antenna, a board, a conductor layer provided on an upper surface of the board, a filter mounted on the upper surface of the board and connected with the antenna connector, and a high frequency circuit mounted on a lower surface of the board and connected with the filter. The filter includes a case having a hollow shape having an opening which opens downward, and a resonator accommodated in the case. The case has a lower end around the opening. The lower end of the case is joined to the conductor layer. The high frequency device has a small size.
摘要翻译：高频器件包括适于与天线连接的天线连接器，板，设置在板的上表面上的导体层，安装在板的上表面并与天线连接器连接的滤波器高频电路安装在电路板的下表面并与滤波器连接。过滤器包括具有中空形状的壳体，其具有向下开口的开口和容纳在壳体中的谐振器。外壳在开口周围有一个下端。壳体的下端连接到导体层。高频设备尺寸小。

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