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1. 发明授权

US06347584B1 Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
标题翻译：使用具有双重释放层的凹版印刷电路板制造方法
公开(公告)号：US06347584B1
公开(公告)日：2002-02-19
申请号：US09589346
申请日：2000-06-08
申请人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
发明人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
IPC分类号： B41N106
CPC分类号： B41N1/06 , B41M1/10 , H05K1/0306 , H05K1/0313 , H05K1/0393 , H05K3/207 , H05K2203/0113
摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.
摘要翻译：使用凹版印刷制造电子元件以提高印刷产量的方法。使用具有双重释放层结构的凹版1。在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

2. 发明授权

US06514364B2 Manufacturing method of wiring board, and conductive paste used therein 失效
标题翻译：接线板的制造方法及其中使用的导电糊
公开(公告)号：US06514364B2
公开(公告)日：2003-02-04
申请号：US09459778
申请日：1999-12-13
申请人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
发明人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
IPC分类号： B32B3112
CPC分类号： H05K3/207 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4647 , H05K2203/0113
摘要： The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.
摘要翻译：导电粒子可以不受粘合剂层的软化和去除的影响而被烧结。结果，可以形成高精度的布线图案，而不会导致导电图案的变形。其包括在膜上填充具有导电性成分和树脂的导电膏的布线图案的槽的步骤，将具有导电性浆料的膜的导电性糊料侧表面粘接到陶瓷基板的粘合剂层侧面的工序具有粘合剂层的步骤，通过从具有膜，导电浆料，粘合剂层，陶瓷基板和膜的第一层压体剥离薄膜基材，在粘合剂层表面上形成导电图案的步骤，并且将导电浆料填充物将凹槽放置在粘合剂层的表面上，以及烧制具有陶瓷基板，粘合剂层和导电图案的第二层压体的步骤，去除粘合剂层并烧结导电颗粒，其中导电糊剂至少（i）在粘合剂层软化之后烧结，或（ii）在粘合剂层被燃烧之后。

3. 发明申请

US20050013082A1 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US20050013082A1
公开(公告)日：2005-01-20
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L21/60 , H05K3/28 , H05K3/34 , H02H1/00
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

4. 发明授权

US06374733B1 Method of manufacturing ceramic substrate 有权
标题翻译：制造陶瓷基板的方法
公开(公告)号：US06374733B1
公开(公告)日：2002-04-23
申请号：US09601776
申请日：2000-09-25
申请人： Masaaki Hayama , Noboru Mouri , Hayami Matsunaga , Masayuki Mizuno , Eiji Kawamoto , Yuji Yagi
发明人： Masaaki Hayama , Noboru Mouri , Hayami Matsunaga , Masayuki Mizuno , Eiji Kawamoto , Yuji Yagi
IPC分类号： B41M110
CPC分类号： H05K3/4647 , H01L21/4867 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0306 , H05K1/092 , H05K3/207 , H05K3/4053 , H05K3/4061 , H05K3/4605 , H05K3/4667 , H05K2203/0113 , H05K2203/0139
摘要： The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.
摘要翻译：本发明涉及用于各种电子设备的陶瓷基板的制造方法，更具体地说，涉及通过凹版印刷形成导体图案的陶瓷基板的制造方法。通过使用屏幕掩模，金属掩模或拉制装置中的任何一个，在凹版中提供导电膏，因此导电浆可以均匀地供给到期望的位置。可以通过重复印刷来调整导电浆料的供给量，从而可以根据图案设定最佳量。结果，可以容易地形成厚膜的精细布线图案，并且可以获得布线电阻低，布线密度高，布线图形尺寸精度高的陶瓷电路板。

5. 发明授权

US07382628B2 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

6. 发明申请

US20050051358A1 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/02 , H05K1/14 , H05K3/28 , H05K3/34 , H05K3/46 , H05K9/00 , H05K7/06
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

7. 发明授权

US06998532B2 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US06998532B2
公开(公告)日：2006-02-14
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L23/28
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

8. 发明授权

US4595178A Leg for vacuum tank for refining molten steel 失效
标题翻译：用于精炼钢水的真空罐腿
公开(公告)号：US4595178A
公开(公告)日：1986-06-17
申请号：US687634
申请日：1984-12-31
申请人： Hitoshi Kato , Eiji Kawamoto
发明人： Hitoshi Kato , Eiji Kawamoto
IPC分类号： C21C7/10 , F27D1/00 , F27D3/15
CPC分类号： F27D3/1518 , C21C7/10 , F27D1/0006
摘要： A leg is fitted through a joint material into each of a pair of vertical openings on a bottom wall of a vacuum tank for refining molten steel, for protecting the vertical openings from molten steel. The abovementioned leg has an annular inner wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal annular rows arranged one on the other so as to form an inner bore for passing molten steel therethrough. The leg also has an annular outer wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal rows arranged one on the other so as to cover substantially the entire outer surface of the annular inner wall. The inner surface of the annular outer wall is in contact with the outer surface of the annular inner wall through a joint material.
摘要翻译：一个腿通过接头材料装配到真空罐的底壁上的一个垂直开口中，用于精炼钢水，用于保护垂直开口免受钢水的影响。上述腿具有环形内壁，该内壁通过多个相互排列的多个水平环形列中的多个氧化镁 - 铬烧制的径向堆叠接合材料而形成，以形成用于使钢水通过的内孔。腿还具有环形外壁，该环形外壁通过将多个相互排列的多个水平排中的多个氧化镁 - 铬烧制的径向砖堆叠在一起而形成，以便基本上覆盖环形内壁的整个外表面。环形外壁的内表面通过接头材料与环形内壁的外表面接触。

9. 发明授权

US07532485B2 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US07532485B2
公开(公告)日：2009-05-12
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.
摘要翻译：多层模块包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。连接端子设置在电路板的树脂层或另一表面处，并且设置用于在模块的两个表面之间连接的通孔。还包括在与连接端子相对应的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。绝缘层设置在导体层之间，绝缘层分别具有用于连接端子之间连接的导电接合。模块中的通孔和电子部件的位置不受通孔的位置的限制。

10. 发明申请

US20050249933A1 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board 失效
标题翻译：制造用于复合板的电路，复合板和芯板的复合板的制造方法
公开(公告)号：US20050249933A1
公开(公告)日：2005-11-10
申请号：US10660054
申请日：2003-09-11
申请人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
发明人： Shigeru Yamane , Eiji Kawamoto , Hideaki Komoda , Takeshi Suzuki , Toshihiro Nishii , Shinji Nakamura
IPC分类号： H05K1/09 , B32B5/00 , B32B5/14 , B32B15/08 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/40 , D04H1/00
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译：包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。结果，提高了产率，可获得可靠的电路板。

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