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1. 发明授权

US5181317A Method of making an engineering change to a printed wiring board 失效
标题翻译：对印刷电路板进行工程变更的方法
公开(公告)号：US5181317A
公开(公告)日：1993-01-26
申请号：US766244
申请日：1991-09-27
申请人： Mikio Nishihara , Teruo Murase , Kiyotaka Seyama , Kiyoshi Kuwabara , Osamu Ohshima
发明人： Mikio Nishihara , Teruo Murase , Kiyotaka Seyama , Kiyoshi Kuwabara , Osamu Ohshima
IPC分类号： H05K7/06 , H01L21/48 , H05K1/11 , H05K3/22 , H05K3/40 , H05K3/46
CPC分类号： H01L21/485 , H01L21/4853 , H05K3/225 , H05K1/111 , H05K2201/10287 , H05K2201/10704 , H05K3/4015 , Y10T29/49144 , Y10T29/49716 , Y10T29/4981
摘要： A method of making an engineering change to a printed wiring board changes connection for a terminal of an electronic component which is mounted on the printed wiring board through a terminal pad. The terminal is electrically connected to a destination through the terminal pad and wiring within the printed wiring board. The present invention places an insulator, including an insulating material and a conductive layer formed thereon, between the terminal and the terminal pad. The electronic component is mounted on the printed wiring board and the terminal is electrically connected to the conductive layer. A discrete wire is placed between the conductive layer and the destination.
摘要翻译：对印刷电路板进行工程变更的方法通过端子焊盘改变安装在印刷电路板上的电子部件的端子的连接。端子通过端子焊盘电连接到目的地和印刷线路板内的布线。本发明在端子和终端焊盘之间设置绝缘体，包括绝缘材料和形成在其上的导电层。电子部件安装在印刷线路板上，并且端子电连接到导电层。分立导线放置在导电层和目的地之间。

2. 发明授权

US5854534A Controlled impedence interposer substrate 失效
标题翻译：受控阻抗插入器基板
公开(公告)号：US5854534A
公开(公告)日：1998-12-29
申请号：US559369
申请日：1995-11-16
申请人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou Vincent Wang , Larry L. Moresco , Teruo Murase
发明人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou Vincent Wang , Larry L. Moresco , Teruo Murase
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/065 , H05K1/14 , H01L23/52 , H01L23/04 , H01L23/053 , H01L23/34
CPC分类号： H05K1/144 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/5385 , H01L23/5387 , H01L23/66 , H01L25/0652 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/3011
摘要： An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed though rigid segments and signals are routed though a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected. In another embodiment of the invention, a separate power plate is provided for carrying the power lines. Portions of the power plate, with a multilayered thin film structure thereon, are cut and folded to form interposers. Methods of making single-chip interposers are also disclosed.
摘要翻译：示出了用于将集成电路芯片安装到基板的插入器基板及其制造方法。插入器基板包括彼此基本隔离的电源路径和受控阻抗信号路径。电源通过刚性段传送，信号通过薄膜柔性连接器布线，该连接器从插入器基板的上表面延伸到下表面。旁路电容被并入到插入器基板中并且连接到电源，使得其非常靠近集成电路芯片。可以通过在其上形成有通孔的刚性基板上形成包括信号路径的多层薄膜结构来制造插入件，去除离开两端段的基板的中心部分，以及折叠和连接端部段，使得通孔为连接的。在本发明的另一实施例中，提供了用于承载电源线的单独的功率板。在其上具有多层薄膜结构的功率板的部分被切割和折叠以形成插入件。还公开了制造单芯片插入件的方法。

3. 发明授权

US5544017A Multichip module substrate 失效
标题翻译：多芯片模块基板
公开(公告)号：US5544017A
公开(公告)日：1996-08-06
申请号：US277163
申请日：1994-07-19
申请人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Teruo Murase , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou V. Wang
发明人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Teruo Murase , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou V. Wang
IPC分类号： H01L21/48 , H01L23/473 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/065 , H05K1/14
CPC分类号： H01L21/486 , H01L21/4857 , H01L23/473 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/5385 , H01L23/66 , H01L25/0652 , H05K1/144 , H01L2224/16 , H01L2924/00013 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support base exposing the underside of the thin film structure, thereby allowing high density connectors to be mounted on both surfaces of the thin film structure, greatly enhancing the ability to communicate signals between adjacent substrates in the chip module. This avoids the need to route the signals either through the rigid support base or to the edges of the thin film structure. Power and ground, which do not require a high connection density, are routed in low impedance paths through the support base. Preferably, the thin film structure is made of alternating layers of patterned metal, such as copper, and a low dielectric organic polymer, such as a polyimide.
摘要翻译：公开了一种用于三维多芯片模块的多芯片模块基板及其制造方法。衬底包括薄膜结构，用于将信号路由到集成电路芯片上并从集成电路芯片路由到刚性支撑基底上。在支撑基体中形成孔，露出薄膜结构的下侧，从而允许将高密度连接器安装在薄膜结构的两个表面上，大大增强了在芯片模块中的相邻基板之间传递信号的能力。这避免了将信号路由通过刚性支撑底座或薄膜结构的边缘的需要。不需要高连接密度的电源和接地路径通过支持底座的低阻抗路径。优选地，薄膜结构由诸如铜的图案化金属的交替层和诸如聚酰亚胺的低介电有机聚合物制成。

4. 发明授权

US4352533A Connector device for printed boards 失效
标题翻译：印刷电路板连接器
公开(公告)号：US4352533A
公开(公告)日：1982-10-05
申请号：US199932
申请日：1980-06-18
申请人： Teruo Murase , Kyoichiro Kawano , Akiyoshi Oshitani
发明人： Teruo Murase , Kyoichiro Kawano , Akiyoshi Oshitani
IPC分类号： H01R24/00 , H01R13/629 , H01R31/00 , H05K1/00
CPC分类号： H01R12/7082 , H01R13/629 , H01R31/00
摘要： A connector device for printed boards, comprising at least one pair of opposed male connectors on the printed boards, each male connector having at least one projecting terminal, at least one female connector which is movably attached to the terminals of one of the male connectors. The electrical connection between the corresponding projecting terminals of the two opposing male connectors being established and broken by the displacement of the female connectors.
摘要翻译： PCT No.PCT / JP79 / 00273 Sec。 371日期1980年6月30日第 102（e）1980年6月18日PCT申请1979年10月29日PCT公布。第WO80 / 01022号公报一种用于印刷板的连接器装置，包括在印刷板上的至少一对相对的阳连接器，每个阳连接器具有至少一个突出端子，至少一个阴连接器，其可移动地连接到其中一个公连接器。两个相对的阳连接器的相应的突出端子之间的电连接被母连接器的位移建立和断开。

5. 发明授权

US5017738A Connecting apparatus 失效
标题翻译：连接装置
公开(公告)号：US5017738A
公开(公告)日：1991-05-21
申请号：US483170
申请日：1990-02-22
申请人： Hiroki Tsuji , Kyoichiro Kawano , Teruo Murase
发明人： Hiroki Tsuji , Kyoichiro Kawano , Teruo Murase
IPC分类号： H01R4/02 , H05K3/24 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H05K3/244 , H01R4/02 , H05K3/3463 , H05K2201/0116 , H05K2201/0373 , H05K2201/2036 , H05K2203/0723 , H05K3/3431 , H05K3/36 , H05K3/4007 , Y10T428/12681
摘要： A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The plating layers are respectively impregnated with tin-zinc alloy and gallium. The electrical connection is established between the pads of the printed circuit board and the pads of the mother board through a liquid alloy by placing the plating layers in contact with each other. For the first printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while solder is temporarily adhered to the spacer. For the second printed circuit board having the pads and the connecting pads, tin or indium layer is provided on the surface of the pads, then the spacer of the first printed circuit board is positioned and fixed to the connecting pad of the second printed circuit board. Thus, electrical connection can be formed by way of the contact of gallium-tin or gallium-indium liquid alloy between the pads of both the printed circuit boards.
摘要翻译：一种连接装置，其中在印刷电路板的表面焊盘上和设置在母板的焊盘上的触点的表面上提供多孔银镀层。镀层分别浸渍有锡 - 锌合金和镓。通过使电镀层彼此接触，通过液体合金在印刷电路板的焊盘和母板的焊盘之间建立电连接。对于具有焊盘和间隔物的第一印刷电路板，镓颗粒粘附到焊盘，而焊料暂时粘附到间隔件上。对于具有焊盘和连接焊盘的第二印刷电路板，在焊盘的表面上设置锡或铟层，然后将第一印刷电路板的间隔件定位并固定到第二印刷电路板的连接焊盘。因此，可以通过在两个印刷电路板的焊盘之间接合镓锡或镓铟液体合金来形成电连接。

6. 发明授权

US4815987A Electrical connector 失效
公开(公告)号：US4815987A
公开(公告)日：1989-03-28
申请号：US136776
申请日：1987-12-22
申请人： Kyoichiro Kawano , Hiroki Tsuji , Teruo Murase
发明人： Kyoichiro Kawano , Hiroki Tsuji , Teruo Murase
IPC分类号： H01R13/193 , H05K7/10
CPC分类号： H05K7/1007 , H01R13/193
摘要： An electrical connector includes a plug having a number of contact pins and a jack having a number of receptacle contacts corresponding to the contact pins. Each of the receptacle contacts has a parallel portion and a widened portion. A contact pressing member having partition walls is movable in such a manner that, when the contact pressing member is in a first position, the partition walls are positioned at the parallel portions of the receptacle contacts to allow an easy insertion of the contact pins. When the contact pressing member is moved to a second position, the partition walls are moved to the widened portions of the receptacle contacts so that the gaps between the widened portions are narrowed. Therefore, the receptacle contacts are pressed into firm contact with the contact pins.

7. 发明授权

US06539137B1 Thermo-electric signal coupler 失效
标题翻译：热电信号耦合器
公开(公告)号：US06539137B1
公开(公告)日：2003-03-25
申请号：US09520545
申请日：2000-03-08
申请人： Larry L. Moresco , Vivek Mansingh , Teruo Murase
发明人： Larry L. Moresco , Vivek Mansingh , Teruo Murase
IPC分类号： G02B612
CPC分类号： G01J5/34 , H05K1/0201 , H05K1/0237
摘要： A signal coupler is comprised of a transmitting section and a receiving section. The receiving section includes a polymer pyroelectric film element having a greater than 1% by volume of a high thermal diffusivity material, such as aluminum nitride, to improve the thermal diffusivity of the polymer film. A preferred embodiment of the transmitting section includes a thin film resistive heater to generate thermal pulses which are coupled to the receiving section by a thin film of thermal grease disposed between the receiving section and the transmitting section.
摘要翻译：信号耦合器由发送部分和接收部分组成。接收部分包括具有大于1体积％的诸如氮化铝的高热扩散性材料的聚合物热电膜元件，以改善聚合物膜的热扩散率。传输部分的优选实施例包括薄膜电阻加热器，以产生热脉冲，其通过设置在接收部分和发射部分之间的导热油脂薄膜耦合到接收部分。

8. 发明授权

US6102710A Controlled impedance interposer substrate and method of making 失效
标题翻译：受控阻抗插入器基板及其制造方法
公开(公告)号：US6102710A
公开(公告)日：2000-08-15
申请号：US70493
申请日：1998-04-30
申请人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou Vincent Wang , Larry L. Moresco , Teruo Murase
发明人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-chou Vincent Wang , Larry L. Moresco , Teruo Murase
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/065 , H05K1/14 , H01R12/00
CPC分类号： H05K1/144 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/5385 , H01L23/5387 , H01L23/66 , H01L25/0652 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/3011
摘要： An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed through rigid segments and signals are routed through a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected. In another embodiment of the invention, a separate power plate is provided for carrying the power lines. Portions of the power plate, with a multilayered thin film structure thereon, are cut and folded to form interposers. Methods of making single-chip interposers are also disclosed.
摘要翻译：示出了用于将集成电路芯片安装到基板的插入器基板及其制造方法。插入器基板包括彼此基本隔离的电源路径和受控阻抗信号路径。电源通过刚性段布线，信号通过从内插器基板的上表面延伸到下表面的薄膜柔性连接器。旁路电容被并入到插入器基板中并且连接到电源，使得其非常靠近集成电路芯片。可以通过在其上形成有通孔的刚性基板上形成包括信号路径的多层薄膜结构来制造插入件，去除离开两端段的基板的中心部分，以及折叠和连接端部段，使得通孔为连接的。在本发明的另一实施例中，提供了用于承载电源线的单独的功率板。在其上具有多层薄膜结构的功率板的部分被切割和折叠以形成插入件。还公开了制造单芯片插入件的方法。

9. 发明授权

US5778529A Method of making a multichip module substrate 失效
标题翻译：制造多芯片模块基板的方法
公开(公告)号：US5778529A
公开(公告)日：1998-07-14
申请号：US651479
申请日：1996-05-22
申请人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Teruo Murase , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-Chou Vincent Wang
发明人： Solomon I. Beilin , William T. Chou , David Kudzuma , Michael G. Lee , Teruo Murase , Michael G. Peters , James J. Roman , Som S. Swamy , Wen-Chou Vincent Wang
IPC分类号： H01L21/48 , H01L23/473 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/065 , H05K1/14 , H01K3/10 , H05K3/10
CPC分类号： H01L21/486 , H01L21/4857 , H01L23/473 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/5385 , H01L23/66 , H01L25/0652 , H05K1/144 , H01L2224/16 , H01L2924/00013 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support base exposing the underside of the thin film structure, thereby allowing high density connectors to be mounted on both surfaces of the thin film structure, greatly enhancing the ability to communicate signals between adjacent substrates in the chip module. This avoids the need to route the signals either through the rigid support base or to the edges of the thin film structure. Power and ground, which do not require a high connection density, are routed in low impedance paths through the support base. Preferably, the thin film structure is made of alternating layers of patterned metal, such as copper, and a low dielectric organic polymer, such as a polyimide.
摘要翻译：公开了一种用于三维多芯片模块的多芯片模块基板及其制造方法。衬底包括薄膜结构，用于将信号路由到集成电路芯片上并从集成电路芯片路由到刚性支撑基底上。在支撑基体中形成孔，露出薄膜结构的下侧，从而允许将高密度连接器安装在薄膜结构的两个表面上，大大增强了在芯片模块中的相邻基板之间传递信号的能力。这避免了将信号路由通过刚性支撑底座或薄膜结构的边缘的需要。不需要高连接密度的电源和接地路径通过支持底座的低阻抗路径。优选地，薄膜结构由诸如铜的图案化金属的交替层和诸如聚酰亚胺的低介电有机聚合物制成。

10. 发明授权

US4998884A Connector apparatus for high density coaxial cables 失效
标题翻译：高密度同轴电缆连接器
公开(公告)号：US4998884A
公开(公告)日：1991-03-12
申请号：US301707
申请日：1989-01-26
申请人： Kouji Ishikawa , Kyoichiro Kawano , Teruo Murase , Jerzy R. Sochor , C. Timothy Norman
发明人： Kouji Ishikawa , Kyoichiro Kawano , Teruo Murase , Jerzy R. Sochor , C. Timothy Norman
IPC分类号： H01R13/629 , H01R13/64 , H01R43/26 , H01R13/652
CPC分类号： H01R43/26 , H01R13/629 , H01R13/64
摘要： An apparatus for connecting a high density cable assembly having a shield and to be connected to corresponding contact pins provided on a substrate having a grounding grid formed of conductive guides, each having a predetermined number of contact pins therein, including a connector to which the cable assembly is connected and which is to be mounted to the associated guide. The connector has a connector body, a connector cover surrounding the connector body, and a latching device provided between the connector cover and the connector body for easily latching and unlatching the connector to and from the associated guides.

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