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    • 2. 发明授权
    • Compositions and methods for thermosetting molecules in organic compositions
    • 有机组合物中热固性分子的组成和方法
    • US06803441B2
    • 2004-10-12
    • US10267380
    • 2002-10-08
    • Kreisler LauFeng Quan LiuBoris KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • Kreisler LauFeng Quan LiuBoris KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • C08G6378
    • C08G61/12C08G61/02C08G2650/60
    • In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    • 在制造低介电常数聚合物的方法中,提供了一种热固性单体,其中该热固性单体具有笼形化合物或芳基核心结构,以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中,将热固性单体引入聚合物中以形成低介电常数聚合物,其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷,二金刚烷,硅,苯基和亚噻吩基,而优选的臂包括亚芳基,支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料,并且聚合物的介电常数可以通过改变臂的整个长度来控制。
    • 5. 发明授权
    • Compositions and methods for thermosetting molecules in organic compositions
    • 有机组合物中热固性分子的组成和方法
    • US07049386B2
    • 2006-05-23
    • US10176335
    • 2002-06-19
    • Kreisler S. LauFeng Quan LiuBoris A. KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • Kreisler S. LauFeng Quan LiuBoris A. KorolevEmma BroukRuslan ZherebinDavid Nalewajek
    • C08G63/78
    • C08G61/02C08G61/12C08G65/40C08G2650/60
    • In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    • 在制造低介电常数聚合物的方法中,提供了一种热固性单体,其中该热固性单体具有笼形化合物或芳基核心结构,以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中,将热固性单体引入聚合物中以形成低介电常数聚合物,其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 沉积的笼状化合物和核心结构包括金刚烷,金刚烷,硅,苯基和亚噻吩基,而优选的臂包括芳烯,支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料,并且聚合物的介电常数可以通过改变臂的整个长度来控制。
    • 10. 发明申请
    • Fluorinated divinyl ethers
    • 氟化二乙烯基醚
    • US20060122301A1
    • 2006-06-08
    • US11006879
    • 2004-12-08
    • Haridasan NairDavid Nalewajek
    • Haridasan NairDavid Nalewajek
    • C08K3/26
    • C08F216/125C07C41/06C07C43/17C07C43/172C07C2601/14
    • Fluorinated divinyl ethers having structures according to Formula I or II: RfCX═CY—O—Z—O—CH═CH2  (I) RfCX═CY—O—M—O—CY═CXRf  (II) wherein Rf is fluorine or a C1-C20 fluorinated alkyl; X and Y are independently hydrogen, a halogen, or a C1-C20 fluorinated alkylene; Z is a C1-C20 alkylene, C3-C10 cycloalkylene, four to ten ring member aromatic and non-aromatic heterocycloalkylene, C6-C15 arylene, or C7-C20 arylalkylene; and M is a C1-C20 alkylene, C3-C18 fluorinated alkylene provided that the chain does not terminate with -CHF- or -CF2-, or a C3-C18 diol having the formula —HO—CH2—(CF2)n—CH2—OH— wherein n is an integer from 1 to 16. Curable compositions, polymers, films, coatings, and optical devices comprising fluorinated divinyl ether compounds are also disclosed as well as processes for producing optical devices from the fluorinated divinyl ether compounds and processes for producing the fluorinated divinyl ethers.
    • 具有根据式I或II的结构的氟化二乙烯基醚:<?in-line-formula description =“In-line Formulas”end =“lead”?> R CX-CY-OZO-CH -CH 2(I)<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas” end =“lead”?> R CX-CY-OMO-CY-CXR (II)<?in-line-formula description =“In-Line Formulas “end =”tail“?>其中R 1是氟或C 1 -C 20氟代烷基; X和Y独立地是氢,卤素或C 1 -C 20氟代亚烷基; Z是C 1 -C 20亚烷基,C 3 -C 10亚环烷基,4至10个环成员 芳族和非芳族杂环亚烷基,C 6 -C 15亚芳基或C 7 -C 20芳基亚烷基; 并且M是C 1 -C 20亚烷基,C 3 -C 18氟化亚烷基,条件是链 不用-CHF-或-CF 2 - 或具有式-HO-CH 2的C 3 -C 18二醇终止, 其中n是1至16的整数。(2)其中n是1至16的整数。 还公开了包含氟化二乙烯基醚化合物的可固化组合物,聚合物,膜,涂料和光学装置,以及从氟化二乙烯基醚化合物生产光学器件的方法和用于生产氟化二乙烯基醚的方法。