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    • 1. 发明申请
    • SEMICONDUCTOR TESTING DEVICE, SEMICONDUCTOR DEVICE, AND TESTING METHOD
    • 半导体测试器件,半导体器件和测试方法
    • US20100283497A1
    • 2010-11-11
    • US12810877
    • 2008-12-16
    • Koichiro NoguchiYoshio KamedaKoichi NoseMasayuki MizunoToshinobu Ono
    • Koichiro NoguchiYoshio KamedaKoichi NoseMasayuki MizunoToshinobu Ono
    • G01R31/26
    • G01R31/31908
    • A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
    • 提供了能够实现高速延迟测试的半导体测试装置,半导体器件和测试方法。 半导体测试装置(1a-1c)包括:各自配置有第一输入端子SI的触发器(11),第二输入端子D,接受指示第一模式或第二模式的模式信号的模式端子SE,时钟端子CK 接收时钟信号和输出端子Q,当模式信号指示第一模式时,触发器(11)选择第一输入端子SI,当模式信号指示第二模式时选择第二输入端子D,并且保持信息为 由与输入端Q同步地基于模式信号选择的输入端接收,并从输出端Q输出; 并且保持单元12保持设定值,并将设定值提供给第一输入端子SI。
    • 2. 发明授权
    • Semiconductor testing device, semiconductor device, and testing method
    • 半导体测试装置,半导体器件和测试方法
    • US08441277B2
    • 2013-05-14
    • US12810877
    • 2008-12-16
    • Koichiro NoguchiYoshio KamedaKoichi NoseMasayuki MizunoToshinobu Ono
    • Koichiro NoguchiYoshio KamedaKoichi NoseMasayuki MizunoToshinobu Ono
    • G01R31/26
    • G01R31/31908
    • A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
    • 提供了能够实现高速延迟测试的半导体测试装置,半导体器件和测试方法。 半导体测试装置(1a-1c)包括:各自配置有第一输入端子SI的触发器(11),第二输入端子D,接受指示第一模式或第二模式的模式信号的模式端子SE,时钟端子CK 接收时钟信号和输出端子Q,当模式信号指示第一模式时,触发器(11)选择第一输入端子SI,当模式信号指示第二模式时选择第二输入端子D,并且保持信息为 由与输入端Q同步地基于模式信号选择的输入端接收,并从输出端Q输出; 并且保持单元12保持设定值,并将设定值提供给第一输入端子SI。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME
    • 半导体器件及其测试方法
    • US20110260747A1
    • 2011-10-27
    • US13139609
    • 2009-12-22
    • Yoshio KamedaYoshihiro NakagawaKoichiro NoguchiMasayuki MizunoKoichi Nose
    • Yoshio KamedaYoshihiro NakagawaKoichiro NoguchiMasayuki MizunoKoichi Nose
    • G01R31/26G05F1/10
    • G01R31/2884G01R31/3012
    • A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
    • 半导体器件(1)包括其上形成有多个半导体芯片形成区域(1A)的半导体晶片(11),设置在所述半导体芯片形成区域(1A)的每一个内的电路部分(12) 半导体晶片(11),设置在每个半导体芯片形成区域(1A)内并连接到电路部分(12))的控制电路部分(14),其控制供应到电路部分(12)的电力, 连接到多个控制电路部分(14)的电源线(18)和连接到多个控制电路部分(14)的参考电力线(17)。 在每个控制电路部分(14)中,基于来自参考电力线(17)的参考电压来控制从电源线(18)供应的电力的电压。
    • 4. 发明授权
    • Semiconductor device and method of testing the same
    • 半导体器件及其测试方法
    • US08513970B2
    • 2013-08-20
    • US13139609
    • 2009-12-22
    • Yoshio KamedaYoshihiro NakagawaKoichiro NoguchiMasayuki MizunoKoichi Nose
    • Yoshio KamedaYoshihiro NakagawaKoichiro NoguchiMasayuki MizunoKoichi Nose
    • G01R31/02
    • G01R31/2884G01R31/3012
    • A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
    • 半导体器件(1)包括其上形成有多个半导体芯片形成区域(1A)的半导体晶片(11),设置在所述半导体芯片形成区域(1A)的每一个内的电路部分(12) 半导体晶片(11),设置在每个半导体芯片形成区域(1A)内并连接到电路部分(12))的控制电路部分(14),其控制供应到电路部分(12)的电力, 连接到多个控制电路部分(14)的电源线(18)和连接到多个控制电路部分(14)的参考电力线(17)。 在每个控制电路部分(14)中,基于来自参考电力线(17)的参考电压来控制从电源线(18)供应的电力的电压。
    • 10. 发明授权
    • Aging diagnostic device, aging diagnostic method
    • 老化诊断仪,老化诊断方法
    • US08674774B2
    • 2014-03-18
    • US13394542
    • 2010-09-01
    • Eisuke SaneyoshiKoichi NoseMasayuki Mizuno
    • Eisuke SaneyoshiKoichi NoseMasayuki Mizuno
    • H03L7/24G01R31/28
    • G01R31/2856G01R31/2882G01R31/2884H03K5/133
    • There is provided an aging diagnostic device including: a reference ring oscillator (101) that constitutes a ring oscillator using an odd-numbered plurality of logic gates constituted using a CMOS circuit; a test ring oscillator (102) that constitutes a ring oscillator using an odd-numbered plurality of logic gates having the same configuration as that of the logic gate; a load unit (104) that inputs a load signal to the test ring oscillator (102); a control unit (105) that simultaneously inputs a control signal instructing a start of oscillation of the reference ring oscillator (101) and the test ring oscillator (102) to the reference ring oscillator (101) and the test ring oscillator (102); and a comparison unit (103) that compares differences in the amount of movement of pulses within the reference ring oscillator (101) and the test ring oscillator (102), respectively, in the same time.
    • 提供了一种老化诊断装置,包括:构成使用CMOS电路构成的奇数多个逻辑门的环形振荡器的参考环形振荡器(101) 使用具有与逻辑门相同配置的奇数多个逻辑门构成环形振荡器的测试环振荡器(102); 负载单元(104),其向所述测试环形振荡器(102)输入负载信号; 控制单元(105),其同时将参考环形振荡器(101)和测试环形振荡器(102)的振荡开始的控制信号输入到参考环形振荡器(101)和测试环形振荡器(102); 以及比较单元(103),其分别同时比较参考环形振荡器(101)和测试环形振荡器(102)中的脉冲的移动量的差异。