会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明申请
    • APPARATUS FOR CHEMICAL MECHANICAL POLISHING
    • 化学机械抛光装置
    • US20120322345A1
    • 2012-12-20
    • US13163227
    • 2011-06-17
    • Jagan RangarajanAlpay Yilmaz
    • Jagan RangarajanAlpay Yilmaz
    • B24B1/00
    • B24B37/04
    • Embodiments of the invention generally relate to systems and methods to CMP substrates. The systems generally include a polishing system that has a polishing module and cleaning module. Each of the polishing module and the cleaning module can be partitioned into independently operable sections. Each section of the polishing module includes a platen, at least one load cup, and at least one polishing head. Each section of the cleaning module includes a cleaning station and one or more robots adapted to advance substrates through the cleaning station. The methods generally include polishing a plurality of substrates in a polishing system having independently operable sections. During the polishing of the substrates in one section, a second of the independently operable stations may be maintained or cleaned.
    • 本发明的实施例一般涉及CMP衬底的系统和方法。 该系统通常包括具有抛光模块和清洁模块的抛光系统。 抛光模块和清洁模块中的每一个可以被划分成可独立操作的部分。 抛光模块的每个部分包括压板,至少一个负载杯和至少一个抛光头。 清洁模块的每个部分包括清洁站和一个或多个机器人,其适于使基板通过清洁站。 所述方法通常包括在具有可独立操作的部分的抛光系统中抛光多个基板。 在一个部分中抛光衬底期间,可以维持或清洁可独立操作的第二个工位。