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1. 发明授权

US10242863B2 Substrate processing apparatus 有权
公开(公告)号：US10242863B2
公开(公告)日：2019-03-26
申请号：US15283923
申请日：2016-10-03
申请人： WET Technology Co., Ltd. , Yi-Cheng Wang
发明人： Yi-Cheng Wang
IPC分类号： H01L21/02 , H01L21/768 , H01L21/683 , H01L21/67
摘要： A substrate processing apparatus for processing a wafer including a temporary substrate and a semiconductor device. The substrate processing apparatus includes a first half portion, a second half portion and a liquid supply unit. The first half portion includes a working platform. The second half portion includes an upper cover having a first surface and a plurality of second holes. The liquid supply unit provides a liquid. The wafer is placed on the working platform, and a second surface of the semiconductor device and the first surface are spaced by a distance sufficient for allowing the liquid to come into contact with the first surface when the liquid flows at the second surface to generate a suction force on the second surface. As such, a peel force is formed between the temporary substrate and the semiconductor device to cause the two to separate from each other.

2. 发明申请

US20110266048A1 HOUSING AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：住房和制造方法
公开(公告)号：US20110266048A1
公开(公告)日：2011-11-03
申请号：US12974071
申请日：2010-12-21
申请人： KAI-RONG LIAO , CHUAN-SHENG LI , CHI-CHUANG HO , YUNG-TA LO , YI-CHENG WANG , SHIH-WEI YANG
发明人： KAI-RONG LIAO , CHUAN-SHENG LI , CHI-CHUANG HO , YUNG-TA LO , YI-CHENG WANG , SHIH-WEI YANG
IPC分类号： H01L23/06 , B29C45/17 , B29C45/14
CPC分类号： B29C45/14 , B29C2045/0058 , B29L2031/3437
摘要： A housing is for an electronic device. The housing includes a main body made of thermoplastic, and a transparent layer formed on the main body. The transparent layer is made of transparent thermosetting plastic.
摘要翻译：外壳用于电子设备。壳体包括由热塑性材料制成的主体和形成在主体上的透明层。透明层由透明热固性塑料制成。

3. 发明申请

US20170243766A1 MINIATURE WAFER PROCESSING APPARATUS 审中-公开
公开(公告)号：US20170243766A1
公开(公告)日：2017-08-24
申请号：US15046879
申请日：2016-02-18
申请人： Yi-Cheng WANG , WET Technology Co., Ltd.
发明人： Yi-Cheng WANG
IPC分类号： H01L21/67
CPC分类号： H01L21/6719 , H01L21/67017
摘要： A miniature wafer processing apparatus includes a first half portion, a second half portion, a gas supply unit, a liquid supply unit, a ring sealing member disposed at peripheries of the first half portion and the second half portion, and a liquid recycling member. The first half portion includes a first hole disposed at a work platform. The second half portion includes an upper cover correspondingly covering the work platform to form a processing chamber, and a second hole disposed at the upper cover. The gas supply unit and the liquid supply unit are in communication with the first hole and the second hole. The liquid recycling member includes a recycling tube, a discharging tube and a filtering portion. With the first half portion and the second half portion, the processing chamber and the overall volume can be reduced.

4. 发明申请

US20170154803A1 NON-CONTACT WAFER TRANSPORT DEVICE 审中-公开
公开(公告)号：US20170154803A1
公开(公告)日：2017-06-01
申请号：US14955717
申请日：2015-12-01
申请人： Yi-Cheng WANG , WET Technology Co., Ltd.
发明人： Yi-Cheng WANG , Pech-Chin WANG , Han-Ming HUANG
IPC分类号： H01L21/683 , B65G47/91
CPC分类号： H01L21/6838 , B25J11/0095 , B25J15/0616 , B25J19/0029 , B65G47/91 , B65G2201/0297
摘要： A non-contact wafer transport device for transporting a wafer to be transported includes a base, a moving arm, a tube disposed in the moving arm and a negative pressure device. The moving arm is pivotally connected to the base, moves relatively to the base, and includes an operating end away from the base. The tube includes a channel that accommodates a fluid, and a suction port that is in communication with the channel and formed at the suction port. The negative pressure device, connected to the channel, generates a negative pressure upon the fluid in the channel to cause the suction port to form a suction force. The suction force acts on the wafer to be transported and causes the wafer to be transported to be kept at a distance from the operating end. Thus, without contacting the wafer, the wafer to be transported can be transported.

5. 发明授权

US08551290B2 Apparatus for substrate processing with fluid 有权
标题翻译：用流体衬底处理的装置
公开(公告)号：US08551290B2
公开(公告)日：2013-10-08
申请号：US12243254
申请日：2008-10-01
申请人： Yi-Cheng Wang
发明人： Yi-Cheng Wang
IPC分类号： B65G47/22
CPC分类号： H01L21/67051 , H01L21/6708
摘要： An apparatus for substrate processing, mainly includes a processing unit and a fluid supply unit. The processing unit includes a platform for laying a substrate. The platform includes a plurality of injection holes defined thereon, the injection holes obliquely and downwardly extend from a top surface of the platform. The fluid supply unit includes a plurality of containers containing fluids for supplying to the processing unit and fluid-connected to the injection holes of the platform. The fluids from the fluid supply unit can be obliquely injected out from the injection holes and slightly floats and moves the substrate over the platform and reacts with the substrate.
摘要翻译：一种基板处理装置，主要包括处理单元和流体供给单元。处理单元包括用于铺设基板的平台。平台包括限定在其上的多个喷射孔，喷射孔从平台的顶表面倾斜地向下延伸。流体供应单元包括多个容器，其容纳用于供给到处理单元并流体连接到平台的喷射孔的流体。来自流体供应单元的流体可以从注射孔倾斜地注入并稍微漂浮并将基底移动到平台上并与基底反应。

6. 发明授权

US07893679B2 Pulse width modulation controller, circuit and method thereof with short circuit protection 有权
标题翻译：脉宽调制控制器，电路及其短路保护方法
公开(公告)号：US07893679B2
公开(公告)日：2011-02-22
申请号：US12275379
申请日：2008-11-21
申请人： Chien Peng Yu , Yi Cheng Wang , Ye Hsuan Yan , Chih Chi Hsu
发明人： Chien Peng Yu , Yi Cheng Wang , Ye Hsuan Yan , Chih Chi Hsu
IPC分类号： G05F1/00
CPC分类号： H02M3/156 , H02M1/32
摘要： A PWM comprises a voltage transformation module, a voltage-sensing module and a timer. The voltage transformation module is configured to transform an input voltage into an output voltage. The voltage-sensing module is coupled to the voltage transformation module and configured to detect a voltage of a first terminal, wherein the voltage of the first terminal is proportional to the output voltage. The timer is configured to measure the time duration for which the voltage of the first terminal is lower than a reference voltage, wherein the timer initiates a short circuit signal when the time duration is greater than a predetermined value.
摘要翻译： PWM包括电压变换模块，电压感测模块和定时器。电压变换模块被配置为将输入电压变换为输出电压。电压感测模块耦合到电压变换模块，并被配置为检测第一端子的电压，其中第一端子的电压与输出电压成比例。定时器被配置为测量第一端子的电压低于参考电压的持续时间，其中当持续时间大于预定值时，定时器启动短路信号。

7. 发明申请

US20080074089A1 CURRENT MODE PWM BOOST CIRCUIT AND FEEDBACK SIGNAL SENSING METHOD THEREOF 有权
标题翻译：电流模式PWM升压电路及其反馈信号传感方法
公开(公告)号：US20080074089A1
公开(公告)日：2008-03-27
申请号：US11670038
申请日：2007-02-01
申请人： Chien Peng YU , Yi Cheng WANG , Ye Hsuan YAN
发明人： Chien Peng YU , Yi Cheng WANG , Ye Hsuan YAN
IPC分类号： G05F1/00
CPC分类号： H02M3/156 , H02M1/08
摘要： A feedback signal sensing method includes the steps of: providing a pulse width modulation (PWM) signal having a period; charging a capacitor by a current source during a pulse duration of the period, so as to form an equivalent slope compensation ramp signal; conducting an inductor current flowing from a boost inductor to flow through an equivalent resistor during the pulse duration of the period, so as to form an equivalent inductor current signal; and using a coupling characteristic of the capacitor together with the equivalent slope compensation ramp signal and the equivalent inductor current signal to form a feedback signal.
摘要翻译：反馈信号检测方法包括以下步骤：提供具有周期的脉宽调制（PWM）信号; 在该周期的脉冲持续时间期间由电流源对电容器充电，以形成等效的斜坡补偿斜坡信号; 在该周期的脉冲持续时间期间，引导从升压电感器流过的电感电流流过等效电阻器，以形成等效电感器电流信号; 并且使用电容器的耦合特性与等效斜坡补偿斜坡信号和等效电感器电流信号一起形成反馈信号。

8. 发明申请

US20180096837A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180096837A1
公开(公告)日：2018-04-05
申请号：US15283923
申请日：2016-10-03
申请人： Yi-Cheng Wang , WET Technology Co., Ltd.
发明人： Yi-Cheng Wang
IPC分类号： H01L21/02 , H01L21/768
CPC分类号： H01L21/02068 , H01L21/67 , H01L21/6835 , H01L21/76814 , H01L2221/68381
摘要： A substrate processing apparatus for processing a wafer including a temporary substrate and a semiconductor device. The substrate processing apparatus includes a first half portion, a second half portion and a liquid supply unit. The first half portion includes a working platform. The second half portion includes an upper cover having a first surface and a plurality of second holes. The liquid supply unit provides a liquid. The wafer is placed on the working platform, and a second surface of the semiconductor device and the first surface are spaced by a distance sufficient for allowing the liquid to come into contact with the first surface when the liquid flows at the second surface to generate a suction force on the second surface. As such, a peel force is formed between the temporary substrate and the semiconductor device to cause the two to separate from each other.

9. 发明申请

US20060113602A1 MOS circuit arrangement 审中-公开
标题翻译： MOS电路布置
公开(公告)号：US20060113602A1
公开(公告)日：2006-06-01
申请号：US10999722
申请日：2004-11-29
申请人： Cheng-Yu Fang , Wei-Jung Chen , Sheng-Ti Lee , Chien-Peng Yu , Yi-Cheng Wang
发明人： Cheng-Yu Fang , Wei-Jung Chen , Sheng-Ti Lee , Chien-Peng Yu , Yi-Cheng Wang
IPC分类号： H01L29/94
CPC分类号： H01L27/0266 , H01L29/78
摘要： A MOS circuit arrangement includes a silicon substrate, a semiconductor device, a field oxide layer, and a poly-protective layer. The silicon substrate has a conductive doping incorporated therein, wherein the semiconductor device is electrically connected with the silicon substrate. The field oxide layer is formed on the silicon substrate at a position spaced apart from the terminal of the semiconductor device to form an active region between the field oxide layer and the semiconductor device. The poly-protective layer deposited on the active region to communicate the field oxide layer with the terminal of the semiconductor device, wherein the poly-protective layer provides a junction breakdown path between the semiconductor device and the silicon substrate to increase a junction breakdown voltage of the semiconductor device.
摘要翻译： MOS电路装置包括硅衬底，半导体器件，场氧化物层和多保护层。硅衬底具有掺入其中的导电掺杂，其中半导体器件与硅衬底电连接。场氧化物层形成在硅衬底上与半导体器件的端子间隔开的位置处，以在场氧化物层和半导体器件之间形成有源区。沉积在有源区上的多晶硅保护层将场氧化物层与半导体器件的端子连通，其中多晶硅保护层在半导体器件和硅衬底之间提供结击穿通路径，以增加晶体管的击穿电压半导体器件。

10. 发明申请

US20100026266A1 PULSE WIDTH MODULATION CONTROLLER, CIRCUIT AND METHOD THEREOF WITH SHORT CIRCUIT PROTECTION 有权
标题翻译：脉冲宽度调制控制器，电路及其短路保护方法
公开(公告)号：US20100026266A1
公开(公告)日：2010-02-04
申请号：US12275379
申请日：2008-11-21
申请人： CHIEN PENG YU , YI CHENG WANG , YE HSUAN YAN , CHIH CHI HSU
发明人： CHIEN PENG YU , YI CHENG WANG , YE HSUAN YAN , CHIH CHI HSU
IPC分类号： G05F1/569
CPC分类号： H02M3/156 , H02M1/32
摘要： A PWM comprises a voltage transformation module, a voltage-sensing module and a timer. The voltage transformation module is configured to transform an input voltage into an output voltage. The voltage-sensing module is coupled to the voltage transformation module and configured to detect a voltage of a first terminal, wherein the voltage of the first terminal is proportional to the output voltage. The timer is configured to measure the time duration for which the voltage of the first terminal is lower than a reference voltage, wherein the timer initiates a short circuit signal when the time duration is greater than a predetermined value.
摘要翻译： PWM包括电压变换模块，电压感测模块和定时器。电压变换模块被配置为将输入电压变换为输出电压。电压感测模块耦合到电压变换模块，并被配置为检测第一端子的电压，其中第一端子的电压与输出电压成比例。定时器被配置为测量第一端子的电压低于参考电压的持续时间，其中当持续时间大于预定值时，定时器启动短路信号。

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