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    • 3. 发明申请
    • APPARATUS FOR SUBSTRATE PROCESSING WITH FLUID
    • 用于液体加工底物的装置
    • US20090045034A1
    • 2009-02-19
    • US12243254
    • 2008-10-01
    • Yi-Cheng WANG
    • Yi-Cheng WANG
    • B65G47/22
    • H01L21/67051H01L21/6708
    • An apparatus for substrate processing, mainly includes a processing unit and a fluid supply unit. The processing unit includes a platform for laying a substrate. The platform includes a plurality of injection holes defined thereon, the injection holes obliquely and downwardly extend from a top surface of the platform. The fluid supply unit includes a plurality of containers containing fluids for supplying to the processing unit and fluid-connected to the injection holes of the platform. The fluids from the fluid supply unit can be obliquely injected out from the injection holes and slightly floats and moves the substrate over the platform and reacts with the substrate.
    • 一种基板处理装置,主要包括处理单元和流体供给单元。 处理单元包括用于铺设基板的平台。 平台包括限定在其上的多个喷射孔,喷射孔从平台的顶表面倾斜地向下延伸。 流体供应单元包括多个容器,其容纳用于供给到处理单元并流体连接到平台的喷射孔的流体。 来自流体供应单元的流体可以从注射孔倾斜地注入并稍微漂浮并将基底移动到平台上并与基底反应。