专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10082036B2 Vane ring band with nano-coating 有权
公开(公告)号：US10082036B2
公开(公告)日：2018-09-25
申请号：US14843689
申请日：2015-09-02
申请人： Rolls-Royce Corporation
发明人： Wade A. Vest
IPC分类号： F01D9/04 , F01D17/14 , B29C33/38 , B29C45/00 , B29C45/17 , B22C9/10 , B22D29/00 , F01D5/28 , F01D17/16 , B29K101/00 , B29L31/00
CPC分类号： F01D9/042 , B22C9/10 , B22D29/003 , B29C33/3842 , B29C45/0055 , B29C45/17 , B29C2045/0058 , B29C2045/0079 , B29K2101/00 , B29L2031/7504 , F01D5/288 , F01D9/041 , F01D17/14 , F01D17/162 , F05D2220/32 , F05D2230/21 , F05D2230/90 , F05D2240/12 , F05D2240/80 , F05D2300/10 , F05D2300/43 , F05D2300/609 , F05D2300/611
摘要： An inner band used on a turbine engine is disclosed herein. The inner band may include a core comprising polymeric materials and a shell comprising nanocrystalline metallic materials applied to the core to cover at least a portion of the core.

2. 发明申请

US20180207351A1 Rectal Catheter Plastic Component for a Rectal Catheter Assembly, and Method for Producing a Rectal Catheter Plastic Component 审中-公开
公开(公告)号：US20180207351A1
公开(公告)日：2018-07-26
申请号：US15878487
申请日：2018-01-24
申请人： Raumedic AG
发明人： Björn Gläsel
IPC分类号： A61M3/02 , A61M25/10
CPC分类号： A61M3/0295 , A61M3/0279 , A61M3/0283 , A61M25/0015 , A61M25/04 , A61M25/1034 , A61M25/1036 , A61M2025/004 , A61M2207/00 , A61M2210/1064 , A61M2210/1067 , B29C45/0055 , B29C2045/0058 , B29K2075/00 , B29L2031/7543
摘要： A rectal catheter plastic component is a constituent part of a rectal catheter assembly. The one piece plastic component has a cylindrical main body with an outer jacket wall. A connector component end serves for the attachment of a peripheral hose. A free component end serves for rectal insertion. At least one media lumen, extending along the main body, is arranged between at least one media connector port and at least one media opening. The media connector port is located at the connector component end, and the media opening is configured in the free component end. A further balloon-filling lumen, extending along the main body, extends between a filling connector port and a balloon-filling opening. The filling connector port is located at the connector component end, and the balloon-filling opening is configured in a balloon attachment region of the plastic component for the attachment of a balloon cuff.

3. 发明申请

US20170066164A1 Method for Manufacturing a Plug for a Container Neck 审中-公开
标题翻译：制造容器颈部塞子的方法
公开(公告)号：US20170066164A1
公开(公告)日：2017-03-09
申请号：US15308501
申请日：2015-05-11
申请人： Novembal USA Inc.
发明人： Michel LUZZATO , Anthony GAILLARD , Fabien FLAMAND , Ronald Kirk DODD
IPC分类号： B29C45/00 , B65D41/34 , B26F1/00
CPC分类号： B29C45/0081 , B26F1/0023 , B26F2210/04 , B29C45/0055 , B29C2045/0056 , B29C2045/0058 , B29K2023/06 , B29K2023/10 , B29L2001/00 , B29L2031/565 , B65D41/3423
摘要： The present disclosure relates to a manufacturing method for a plug for a container neck. In one implementation, a skirt of the plug is molded and provided with an attachment device adapted to removably attach to the container neck and with a permanent retention strip around the container neck. The retention strip is adapted to pass, by folding, from a molding configuration to an operating configuration. A peripheral break line is then cut out in the skirt, adapted so as to be broken during the first opening of the plug. In some implementations, the retention strip may be prefolded and thereby pass from a molding configuration to an intermediate prefolded configuration. The retention strip is then folded until it passes into an operating configuration. In some implementations, the folding of the retention strip may pass the retention strip from an intermediate prefolded configuration to an operating configuration.
摘要翻译：本公开涉及一种用于容器颈部的塞子的制造方法。在一个实施方案中，插塞的裙部被模制并且设置有适于可移除地附接到容器颈部并且在容器颈部周围具有永久保持条的附接装置。保持条适于通过折叠从模制配置传递到操作构型。然后在裙部中切出外围断裂线，适于在插头的第一次打开期间被破坏。在一些实施方案中，保留条可以被预先折叠，从而从模制构型传递到中间预折叠构型。然后将保持条折叠直到其进入操作构型。在一些实施方案中，保持条的折叠可以将保持条从中间预折叠构型传递到操作构型。

4. 发明授权

US09371191B2 Bucket for a bucket elevator 有权
标题翻译：斗式提升机斗
公开(公告)号：US09371191B2
公开(公告)日：2016-06-21
申请号：US14186769
申请日：2014-02-21
申请人： Tapco, Inc.
发明人： Paul D. Taylor
IPC分类号： B65G17/12 , B65G47/40 , B65G17/42 , B29C45/00 , B65G17/36 , B29L31/00
CPC分类号： B65G17/126 , B29C45/0055 , B29C2045/0058 , B29C2793/009 , B29L2031/712 , B65G17/36
摘要： A bucket is adapted to be spaced relatively close to adjacent buckets and has sides with a contoured upper edge to facilitate carrying material above the water level capacity of the bucket.
摘要翻译：铲斗适于相对靠近相邻的铲斗间隔开，并且具有带轮廓的上边缘的侧面，以便于将物料运送到桶的水位能力以上。

5. 发明授权

US09186828B2 Methods for forming elongated antennas with plastic support structures for electronic devices 有权
标题翻译：用于形成用于电子设备的塑料支撑结构的细长天线的方法
公开(公告)号：US09186828B2
公开(公告)日：2015-11-17
申请号：US13490356
申请日：2012-06-06
申请人： Jerzy Guterman , Jonathan Haylock , Boon W. Shiu , Peter Jeziorek , Erdinc Irci , Jiang Zhu , Mattia Pascolini
发明人： Jerzy Guterman , Jonathan Haylock , Boon W. Shiu , Peter Jeziorek , Erdinc Irci , Jiang Zhu , Mattia Pascolini
IPC分类号： H01Q1/24 , H01P11/00 , B29C45/00 , B29C33/76 , H01Q1/12 , H01Q1/22 , H01Q1/38 , H01Q7/00 , B29C45/14 , B29C45/16
CPC分类号： B29C45/0055 , B29C33/76 , B29C45/14639 , B29C45/16 , B29C2045/0058 , H01Q1/12 , H01Q1/2266 , H01Q1/38 , H01Q7/00
摘要： Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.
摘要翻译：电子设备可以设置有天线结构。天线结构可以包括覆盖有图案化天线迹线的天线支撑结构。天线支撑结构可以安装在电子设备中，使得被图案化天线迹线覆盖的天线支撑结构的表面与电子设备壳体的平坦表面齐平。显示器覆盖层或其它平面结构可以附接到天线支撑结构的表面和壳体粘合剂的平面表面。注塑和挤压技术可用于形成具有细长平行腔的支撑结构。注射模制工具可以具有在一端由支撑结构支撑的模芯，支撑配合模芯结构的端部处的接合特征或支撑销。模制互连器件可以焊接到激光直接结构元件以形成天线。

6. 发明授权

US09138925B2 Method for forming bilayer patches 有权
标题翻译：形成双层贴片的方法
公开(公告)号：US09138925B2
公开(公告)日：2015-09-22
申请号：US14261255
申请日：2014-04-24
申请人： Applied Silicone Corporation
发明人： R. Alastair Winn , Nolan Pasko
IPC分类号： B29C45/16 , A61F2/12 , B32B25/20 , B29C33/56 , B29C45/00 , B32B25/08 , B32B27/28
CPC分类号： A61F2/12 , B29C33/56 , B29C33/58 , B29C43/24 , B29C45/0001 , B29C45/0055 , B29C45/1615 , B29C45/1657 , B29C65/02 , B29C2045/0058 , B29K2083/00 , B29L2031/7532 , B32B25/08 , B32B25/20 , B32B27/283 , B32B2250/02 , B32B2250/24 , B32B2305/72 , B32B2305/77 , B32B2535/00 , B32B2556/00 , Y10T428/31504 , Y10T428/31663
摘要： A method for injection molding thin materials (sub-millimeter) having low green strength could make certain manufacturing processes significantly more efficient yet has heretofore been unavailable. Provided herein is a method that enables injection molding of thin materials by using a mold with contact surfaces having a low surface energy release agent disposed thereon. The low surface energy release agent may be applied as a coating on a conventional mold or the mold itself or just the contact surfaces thereof may be formed of a low surface energy release material. The method finds particular applicability in making special contour patches for medical and cosmetic implants and prosthetics. A preferred approach involves injection molding a thin layer of unvulcanized material on a cold mold, injection molding a thin layer of vulcanized material on a hot mold, transferring the vulcanized layer to the unvulcanized layer on the cold mold, and removing the combined layers.
摘要翻译：注塑成型具有低绿色强度的薄材料（亚毫米）的方法可以使某些制造工艺显着更有效率，但迄今为止尚不可用。本文提供了一种通过使用具有设置在其上的具有低表面能释放剂的接触表面的模具来使薄材料注射成型的方法。低表面能释放剂可以作为涂层施加在常规模具或模具本身上，或者其接触表面可以由低表面能释放材料形成。该方法特别适用于制造医疗和化妆品植入物和假肢的特殊轮廓补片。优选的方法包括在冷模具上注射成型的未硫化材料层，在热模具上注塑成型硫化材料薄层，将硫化层转移到冷模具上的未硫化层，以及去除组合层。

7. 发明申请

US20150239670A1 BUCKET FOR A BUCKET ELEVATOR 有权
标题翻译： BUCKET电梯的BUCKET
公开(公告)号：US20150239670A1
公开(公告)日：2015-08-27
申请号：US14186769
申请日：2014-02-21
申请人： Tapco, Inc.
发明人： Paul D. Taylor
IPC分类号： B65G17/12 , B29C45/00 , B65G17/36
CPC分类号： B65G17/126 , B29C45/0055 , B29C2045/0058 , B29C2793/009 , B29L2031/712 , B65G17/36
摘要： A bucket is adapted to be spaced relatively close to adjacent buckets and has sides with a contoured upper edge to facilitate carrying material above the water level capacity of the bucket.
摘要翻译：铲斗适于相对靠近相邻的铲斗间隔开，并且具有带轮廓的上边缘的侧面，以便于将物料运送到桶的水位能力以上。

8. 发明授权

US09109093B2 Formation of structural components using ceramic fibers 有权
标题翻译：使用陶瓷纤维形成结构件
公开(公告)号：US09109093B2
公开(公告)日：2015-08-18
申请号：US13040116
申请日：2011-03-03
申请人： Michael K. Pilliod , Paul Choiniere
发明人： Michael K. Pilliod , Paul Choiniere
IPC分类号： H04M1/00 , C08J5/04 , B29C45/00 , C08L77/00 , B29K303/04 , B29L31/34
CPC分类号： C08J5/044 , B29C45/0005 , B29C45/0055 , B29C2045/0058 , B29C2793/0018 , B29C2793/009 , B29K2303/04 , B29L2031/3437 , C08J2355/02 , C08J2367/02 , C08J2369/00 , C08K3/22 , C08K7/08 , C08K9/00 , Y10T403/47 , C08L77/00
摘要： Materials, apparatus and methods of forming structural components for consumer electronics devices are described. In one embodiment, ceramic fibers, such as alumina, are mixed with a thermoplastic, such as nylon, to form a composite material usable in an injection molding process. The volume percent of ceramic fibers used with the thermoplastic can be selected to improve the strength properties of the composite material. Pigments can be added to the composite material to affect its aesthetic appeal. In one embodiment, the composite material including the ceramic fibers can be used to form frame components usable in a consumer electronic device. The frame components can be load bearing structures that are externally visible or used within the interior of the device.
摘要翻译：描述了形成用于消费电子设备的结构部件的材料，装置和方法。在一个实施方案中，诸如氧化铝的陶瓷纤维与诸如尼龙的热塑性塑料混合以形成可用于注射成型工艺的复合材料。可以选择与热塑性材料一起使用的陶瓷纤维的体积百分数，以改善复合材料的强度性能。颜料可以添加到复合材料中以影响其美学吸引力。在一个实施例中，包括陶瓷纤维的复合材料可用于形成可用于消费电子设备中的框架部件。框架部件可以是外部可见的或在设备内部使用的承载结构。

9. 发明授权

US09073286B2 Composite molded article and manufacturing method thereof 有权
标题翻译：复合成形品及其制造方法
公开(公告)号：US09073286B2
公开(公告)日：2015-07-07
申请号：US13807757
申请日：2011-07-01
申请人： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
发明人： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
IPC分类号： B32B3/08 , B29C45/00 , B29C45/16 , B29C45/17 , B60J10/00 , B60J10/02 , B29C45/14 , B29L31/30
CPC分类号： B32B3/08 , B29C45/0055 , B29C45/14467 , B29C45/1657 , B29C45/1676 , B29C45/1704 , B29C2045/0058 , B29C2045/1668 , B29L2031/3005 , B29L2031/302 , B60J7/16 , B60J10/20 , B60J10/34 , B60J10/365 , B60J10/70 , Y10T428/24289
摘要： A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.
摘要翻译：一种复合成形体的制造方法，其特征在于，具有：将具有通孔的主体部件形成为周壁的步骤，该主体部件通过从具有所述主体部件的主体部件中的围绕中空空间的周壁的表面突出的突出部沿纵向形成在其中的中空空间; 将主体部件设置在注射成型模具中; 通过主体构件形成缓冲构件成型腔，以及在主体构件的纵向方向上形成在注射成型模具内部的成型模面，并允许通孔与空腔连通; 以及将从注射口注入的加热熔融的弹性聚合物材料从通孔填充到空腔和中空空间中，由此形成缓冲构件和填充部分。

10. 发明申请

US20150181727A1 PANEL-MOLDED ELECTRONIC ASSEMBLIES 有权
标题翻译：面板模制电子组件
公开(公告)号：US20150181727A1
公开(公告)日：2015-06-25
申请号：US14635467
申请日：2015-03-02
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K5/00 , H05K5/02 , H05K5/04 , B23P15/00 , H01F27/28 , H05K1/11 , H05K1/02 , H05K1/18 , H01F27/24 , B29C45/16 , H05K7/14
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , B29C2045/0058 , B29C2045/169 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01F27/24 , H01F27/2804 , H01F2027/2809 , H01R43/24 , H05K1/0209 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K7/1427 , H05K7/209 , H05K2201/066 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。提供散热鳍片或表面安装可焊接表面。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积密封剂，间隙通道为互连提供安全机构间距和挫折。封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式