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    • 3. 发明申请
    • Wafer processing system, wafer processing method, and ion implantation system
    • 晶圆处理系统,晶圆加工方法和离子注入系统
    • US20060182532A1
    • 2006-08-17
    • US11254854
    • 2005-10-21
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • B65G1/00
    • H01L21/67213H01L21/67201H01L21/67745
    • Two load lock chambers having a load lock pedestal are provided adjacent to a vacuum process chamber through a vacuum intermediate chamber. A passage opening is provided between the vacuum process chamber and the vacuum intermediate chamber. Two wafer retaining arms are installed between a platen device in the vacuum process chamber and the vacuum intermediate chamber. The two wafer retaining arms are reciprocatingly movable between the corresponding load lock pedestals and the platen device while passing through the passage opening and crossing with an overpass each other at different levels. By retaining an unprocessed wafer by one of the wafer retaining arms and retaining a processed wafer by the other wafer retaining arm, transfer of the unprocessed wafer from one of the load lock pedestals to the platen device and transfer of the processed wafer from the platen device to the other load lock pedestal are performed simultaneously.
    • 具有负载锁定基座的两个负载锁定室通过真空中间室邻近真空处理室设置。 在真空处理室和真空中间室之间设有通道开口。 两个晶片保持臂安装在真空处理室中的压板装置和真空中间室之间。 两个晶片保持臂在相应的负载锁定基座和压板装置之间可往复运动,同时穿过通道开口并与不同级别的立交桥交叉。 通过用晶片保持臂中的一个保持未加工的晶片并通过另一个晶片保持臂保持经处理的晶片,将未加工的晶片从负载锁定基座之一转移到压板装置,并将经处理的晶片从压板装置 到另一个负载锁定基座同时进行。
    • 4. 发明申请
    • Ion implanter and method for controlling the same
    • 离子注入机及其控制方法
    • US20040251432A1
    • 2004-12-16
    • US10864343
    • 2004-06-10
    • Sumitomo Eaton Nova Corporation
    • Makoto SanoMichiro SugitaniMitsuaki KabasawaMitsukuni Tsukihara
    • H01J037/304
    • H01J37/304H01J37/3171H01J2237/31703
    • The present invention is applied to an ion implanter provided with a vacuum pressure compensation mechanism. The pressure compensation mechanism samples measured beam currents and vacuum pressures in the vicinity of wafers in preliminary implantation and stores function parameters in a memory unit which are obtained by calculating parameters of a predetermined function by fitting the relationship between the measured beam currents and the vacuum pressures. In actual implantation, the pressure compensation mechanism corrects the measured beam current using the function parameters stored as a function of the vacuum pressure, and based on the corrected beam current, the dosage control is performed. In the present invention, an actual beam loss is compensated for based on the estimation from a pressure in the vicinity of the wafers in a region downstream of a mass analysis slit.
    • 本发明适用于设置有真空压力补偿机构的离子注入机。 压力补偿机构对初步注入中的晶片附近的测量束电流和真空压力进行采样,并将功能参数存储在存储器单元中,该功能参数通过计算测量的光束电流和真空压力之间的关系来计算预定功能的参数而获得 。 在实际植入中,压力补偿机构使用作为真空压力的函数存储的功能参数来校正测量的束电流,并且基于校正的束电流,执行剂量控制。 在本发明中,基于从质量分析狭缝下游的区域中的晶片附近的压力的估计来补偿实际的光束损失。
    • 7. 发明授权
    • Ion implanting system
    • 离子注入系统
    • US4904902A
    • 1990-02-27
    • US181765
    • 1988-04-14
    • Tadamoto TamaiMasateru Sato
    • Tadamoto TamaiMasateru Sato
    • C23C14/54C23C14/48G01R29/24H01J37/02H01J37/317H01L21/265H01L21/66
    • H01J37/026H01J37/3171
    • In an ion implanting apparatus, a first conductor member for monitoring the charge-up of the workpiece is positioned on the front face of a wafer disk, a second conductor member electrically connected with the first conductor member for distributing the charge on the first conductor member is positioned on the rear face of the wafer disk, and a third conductor capable of forming capacitive coupling with the second conductor member is fixed to a disk chamber. When the first conductor member is charged, the charge is distributed also to the second conductor member. When the second conductor member passes by the third conductor member by the rotation of the disk, charge is induced on the third conductor member depending on the charged state of the second conductor member. The first, the second and the third conductor members can be effectively shielded from the surroundings. Charge detection with a high S/N ratio is made possible.
    • 在离子注入装置中,用于监视工件的充电的第一导体构件位于晶片盘的正面上,第二导体构件与第一导体构件电连接,用于将电荷分配在第一导体构件 位于晶片盘的背面,并且能够与第二导体构件形成电容耦合的第三导体被固定到盘室。 当第一导体构件被充电时,电荷也分配给第二导体构件。 当第二导体构件通过盘的旋转通过第三导体构件时,根据第二导体构件的充电状态,在第三导体构件上感应电荷。 第一,第二和第三导体构件可以被有效地屏蔽环境。 具有高S / N比的充电检测成为可能。