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    • 5. 发明授权
    • Ion implanter and method for controlling the same
    • 离子注入机及其控制方法
    • US06984833B2
    • 2006-01-10
    • US10864343
    • 2004-06-10
    • Makoto SanoMichiro SugitaniMitsuaki KabasawaMitsukuni Tsukihara
    • Makoto SanoMichiro SugitaniMitsuaki KabasawaMitsukuni Tsukihara
    • H01J37/304H01J37/317
    • H01J37/304H01J37/3171H01J2237/31703
    • The present invention is applied to an ion implanter provided with a vacuum pressure compensation mechanism. The pressure compensation mechanism samples measured beam currents and vacuum pressures in the vicinity of wafers in preliminary implantation and stores function parameters in a memory unit which are obtained by calculating parameters of a predetermined function by fitting the relationship between the measured beam currents and the vacuum pressures. In actual implantation, the pressure compensation mechanism corrects the measured beam current using the function parameters stored as a function of the vacuum pressure, and based on the corrected beam current, the dosage control is performed. In the present invention, an actual beam loss is compensated for based on the estimation from a pressure in the vicinity of the wafers in a region downstream of a mass analysis slit.
    • 本发明适用于设置有真空压力补偿机构的离子注入机。 压力补偿机构对初步注入中的晶片附近的测量束电流和真空压力进行采样,并将功能参数存储在存储器单元中,该功能参数通过计算测量的光束电流和真空压力之间的关系来计算预定功能的参数而获得 。 在实际植入中,压力补偿机构使用作为真空压力的函数存储的功能参数来校正测量的束电流,并且基于校正的束电流,执行剂量控制。 在本发明中,基于从质量分析狭缝下游的区域中的晶片附近的压力的估计来补偿实际的光束损失。