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    • 3. 发明公开
    • 플럭스 조성물 및 솔더링 방법
    • 焊剂组合物和焊接方法
    • KR1020120060766A
    • 2012-06-12
    • KR1020110128129
    • 2011-12-02
    • 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
    • 플레밍데이비드디.갤래거마이크케이.김상호윈클마크알.리우시앙-퀴안
    • C07C217/52B23K35/363
    • PURPOSE: A flux composition is provided to be compatible with various epoxy based underfill material, and not to require cleansing soldering surface before introducing underfill composition for forming final electric conjugation part. CONSTITUTION: A flux composition comprises a fluxing agent in chemical formula 1 as an initial component. In chemical formula 1, R^1, R^2, R^3 and R^4 is respectively and independently selected from a substituted or unsubstituted C1-80 alkyl group, and a substituted or unsubstituted C7-80 arylalkyl group. 0-3 of the R^1, R^2, R^3 and R^4 are hydrogen. The composition additionally comprises solvent, and the solvent is an organic solvent selected from hydrocarbon, aromatic hydrocarbon, ketone, ether, alcohol, ester, amide, glycol, glycol ether, glycol derivative, and petroleum solvent.
    • 目的:提供助焊剂组合物以与各种环氧基底层填充材料相容,并且在引入用于形成最终电接合部件的底部填充组合物之前不需要清洁焊接表面。 构成:助熔剂组合物包含化学式1中的助熔剂作为初始组分。 在化学式1中,R 1,R 2,R 3和R 4分别独立地选自取代或未取代的C 1-8烷基和取代或未取代的C 7〜80芳烷基。 R ^ 1,R ^ 2,R ^ 3和R ^ 4的0-3为氢。 该组合物另外包含溶剂,溶剂是选自烃,芳烃,酮,醚,醇,酯,酰胺,二醇,二醇醚,二醇衍生物和石油溶剂的有机溶剂。