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    • 7. 发明公开
    • 탈휘 압출기, 그리고 이를 사용하는 중합체 조성물의 탈휘 압출 방법 및 중합체의 제조 방법
    • 탈휘압출기,그리고이를사용하는중합체조성물의탈휘압출방법및중합체의제조방법
    • KR1020120005408A
    • 2012-01-16
    • KR1020110067840
    • 2011-07-08
    • 스미또모 가가꾸 가부시끼가이샤
    • 스미다마사카즈야마자키가즈히로니시타니아키라
    • B29B7/84B29C47/76
    • B29C47/385B29C47/0877B29C47/76B29C47/763
    • PURPOSE: A devolatilizing extruder is provided to prevent the attaching of non-reacted monomer and polymer to shaft seal bearing part. CONSTITUTION: A devolatilizing extruder(100) comprises: a cylinder(10) consisting of a polymer composition supply port(12), gas discharge ports(14), a polymer exit(16) and a through hole(18); a rotatable screw(20) which is inserted into the cylinder through the through hole; and a shaft seal bearing part(30) supplying the shaft part(20a) of the screw, which is reached from the through hole to the outside of the cylinder. The shaft seal bearing part comprises a first shaft seal part(32), a second shaft seal part(34) between the first shaft seal part and the cylinder, and a gas inlet part(36) flowing gas into the second shaft seal part. The shaft seal bearing part has a gap as a flowing path, between the inner wall of the through hole, and the surface of the shaft part of the screw. Gas, which is inserted into the second shaft seal part through the gas inlet part, is discharged to the inside of the cylinder through the gap of the shaft bearing part.
    • 目的:提供脱挥发分挤出机以防止将未反应的单体和聚合物附着到轴封轴承部分。 (100)包括:由聚合物组合物供应口(12),排气口(14),聚合物出口(16)和通孔(18)组成的圆筒(10); 一个可转动的螺钉(20),它通过通孔插入圆柱体中; 和将从通孔到达圆筒外部的螺杆的轴部(20a)供给的轴密封轴承部(30)。 轴封轴承部包括第一轴封部(32),第一轴封部与气缸之间的第二轴封部(34)以及使气体流入第二轴封部的气体导入部(36)。 轴密封件轴承部在通孔的内壁与螺杆的轴部的表面之间具有作为流路的间隙。 通过气体入口部分插入第二轴密封部分的气体通过轴承部分的间隙排出到气缸内部。
    • 8. 发明公开
    • 폴리머 함유 액체용 정지형 탈휘발화 장치
    • 含液体聚合物的静态灭活装置
    • KR1020070067617A
    • 2007-06-28
    • KR1020060125590
    • 2006-12-11
    • 술저 켐테크 악티엔게젤샤프트
    • 슈트라이프펠릭스아.
    • B29B7/84
    • B01D3/06B01D19/0047
    • A static devolatilization device for polymer containing liquid is provided to generate the mixture of liberated gas and low-gas polymer during foaming the liquid. In the static devolatilization device(1) for polymer containing liquid(7) for devolatilizing polymers by expanding the liquid pressurized in a container(10), a devolatilized polymer discharge pump(3) is positioned at a base portion of a sump region. An extraction line(4) for gas generated from volatile components is connected to upper regions(11,12) of the container. At least one phase separation chamber(2) is disposed at the upper region and composed of an inlet(20) for the liquid to be treated; a lower opening(210) formed at a polymer discharge region; and one or plural upper openings(220) formed at a gas exhaust region.
    • 提供用于含聚合物的液体的静态脱挥发分装置以在液体发泡过程中产生释放气体和低气体聚合物的混合物。 在用于通过膨胀在容器(10)中被加压的液体来挥发聚合物的含聚合物的液体(7)的静态脱挥发分装置(1)中,脱挥发分的聚合物排出泵(3)位于集水区域的基部。 用于从挥发性组分产生的气体的萃取管线(4)连接到容器的上部区域(11,12)。 至少一个相分离室(2)设置在上部区域并由用于待处理液体的入口(20)组成; 在聚合物排出区域形成的下开口(210) 以及形成在排气区域的一个或多个上开口(220)。
    • 9. 发明公开
    • 반도체 밀봉용 에폭시 수지 조성물의 제조 방법
    • 半导体密封用途环氧树脂生产方法
    • KR1020050083653A
    • 2005-08-26
    • KR1020057003054
    • 2004-01-30
    • 히타치가세이가부시끼가이샤
    • 이시까와라,미쯔오다야,고우지고바야시,리끼야에비하라,히데끼야마다,다떼오
    • B29B7/84H01L21/56
    • B29B7/84B29C47/46B29C47/6037H01L21/565H01L2924/0002H01L2924/00
    • A method of producing a semiconductor- sealing-purpose epoxy resin compound by using a kneader, the latter having a suction hole disposed downstream in a direction to feed the epoxy resin compound from a kneading region, with a supply port and a delivery port disposed upstream and downstream, respectively, in the epoxy resin compound feed direction. At the same time as the volatile gas in the kneader is discharged outside the kneader through the suction hole, the epoxy resin compound is kneaded while introducing the outside air into the kneader through the openings in the supply port and delivery port. Since discharge of the volatile gas can be efficiently effected under continuous operation conditions for the kneader, the residual amount of the volatile component in the kneaded epoxy resin composition is greatly reduced; thus, generation of voids is reduced by sealing the semiconductor device by using this epoxy resin compound.
    • 通过使用捏合机制造半导体密封用环氧树脂化合物的方法,所述捏合机具有设置在从捏合区域供给环氧树脂化合物的方向的下游的吸入孔,配置有上游侧的供给口和排出口 和下游,分别在环氧树脂化合物进料方向。 在捏合机中的挥发性气体通过抽吸孔排出到捏合机外的同时,环氧树脂化合物被捏合,同时通过供给口和输送口中的开口将外部空气引入捏合机。 由于可以在连续搅拌机的操作条件下有效地进行挥发性气体的排出,因此大大降低了混炼环氧树脂组合物中挥发成分的残留量。 因此,通过使用该环氧树脂化合物密封半导体器件来减少空隙的产生。