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1. 发明公开

KR1020000019906A 본딩패드와리드핑거간에연결된와이어의쇼트방지방법 失效
标题翻译：用于防止连接板和引线指板之间连接的电线短路的方法
公开(公告)号：KR1020000019906A
公开(公告)日：2000-04-15
申请号：KR1019980038258
申请日：1998-09-16
申请人： 앰코 테크놀로지 코리아 주식회사
发明人： 우찬희
IPC分类号： H01L23/48
CPC分类号： H01L2224/05554 , H01L2224/48247 , H01L2224/49179
摘要： PURPOSE: A method for preventing short of wire connected between bonding pad and lead finger is provided to prevent the bending or short of the wire between a function bonding pad and function lead fingers and between a dummy bonding pad and dummy lead fingers. CONSTITUTION: A method for preventing short of wire connected between bonding pad and lead finger comprises a step forming a dummy bonding pad(200), a step designating lead fingers as dummy lead fingers(210), and a step bonding through wire(12) between a function bonding pad(100) and function lead fingers(110) and between the dummy bonding pad(200) and dummy lead fingers(210).
摘要翻译：目的：提供一种防止连接焊盘和引线指的短路的方法，以防止功能焊盘和功能引线指之间以及虚拟焊盘和虚拟引线指之间的线的弯曲或短路。构成：用于防止连接在焊盘和引线指之间的导线短路的方法包括形成虚拟焊盘（200）的步骤，指定引线指作为虚拟引线指（210）的步骤，以及通过导线（12）的阶梯接合，在功能接合焊盘（100）和功能引线指（110）之间以及虚拟焊盘（200）和虚拟引线指（210）之间。

2. 发明公开

KR1020040011776A 본딩 와이어 손상 방지형 반도체 칩 패키지 无效
标题翻译：用于防止接合线损坏的半导体芯片包装
公开(公告)号：KR1020040011776A
公开(公告)日：2004-02-11
申请号：KR1020020044891
申请日：2002-07-30
申请人： 삼성전자주식회사
发明人： 이정삼
IPC分类号： H01L21/60
CPC分类号： H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/49 , H01L2224/49171 , H01L2224/49179 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE: A semiconductor chip package for preventing damage of a bonding wire is provided to prevent the damage of the bonding wire by maintaining uniformly the flow of a liquefied molding material. CONSTITUTION: A semiconductor chip package for preventing damage of a bonding wire includes a semiconductor chip(200), a die pad(210), a plurality of inner leads(230), and a molding material. A plurality of bonding pads(204) are formed on an active region of the semiconductor chip(200). The semiconductor chip is adhered on the die pad(210). A plurality of tie bars(220) are formed on each of the die pad. The inner leads(230) are installed between the tie bars(220). The inner leads are electrically connected to the bonding pad(210) through a bonding wire(250). The molding material is used for sealing the semiconductor chip, the die pad, and the inner leads.
摘要翻译：目的：提供用于防止接合线损坏的半导体芯片封装，以通过均匀地维持液化的模制材料的流动来防止接合线的损坏。构成：用于防止接合线损坏的半导体芯片封装包括半导体芯片（200），芯片焊盘（210），多个内引线（230）和成型材料。多个接合焊盘（204）形成在半导体芯片（200）的有源区上。半导体芯片粘附在芯片焊盘（210）上。在每个芯片焊盘上形成多个连接条（220）。内引线（230）安装在连接杆（220）之间。内部引线通过接合线（250）电连接到接合焊盘（210）。成型材料用于密封半导体芯片，芯片焊盘和内部引线。

3. 发明公开

KR1020170105640A 접착시트 및 반도체 장치의 제조 방법 审中-实审
标题翻译：粘合剂片材和制造半导体器件的方法
公开(公告)号：KR1020170105640A
公开(公告)日：2017-09-19
申请号：KR1020177025281
申请日：2013-03-05
申请人： 히타치가세이가부시끼가이샤
发明人： 코다마메구미 , 토쿠야스타카히로 , 이와쿠라테츠로우
IPC分类号： C09J7/00 , C09J161/04 , C09J133/06 , C09J163/04 , H01L23/00 , H01L21/18
CPC分类号： C09J7/00 , C09J7/10 , C09J113/00 , C09J2201/61 , C09J2203/326 , C09J2413/00 , C09J2461/00 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2221/68377 , H01L2224/27001 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48096 , H01L2224/48106 , H01L2224/48227 , H01L2224/48472 , H01L2224/49179 , H01L2224/73265 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/00 , H01L2224/48095 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , C09J133/068 , C09J161/04 , C09J163/04 , H01L21/185 , H01L24/47
摘要： 본발명의접착시트는, (A)고분자량성분과, (B1)연화점이 50℃미만인열경화성성분과, (B2)연화점이 50℃이상 100℃이하인열경화성성분과, (C)연화점이 100℃이하인페놀수지를포함하는수지조성물로이루어지고, 그수지조성물 100질량%를기준으로하여, 상기 (A)고분자량성분을 11∼22질량%, 상기 (B1)연화점이 50℃미만인열경화성성분을 10∼20질량%, 상기 (B2)연화점이 50℃이상 100℃이하인열경화성성분을 10∼20질량%, 상기 (C)연화점이 100℃이하인페놀수지를 15∼30질량% 함유한다.
摘要翻译：本发明的粘合片，（A）一种高分子量组份和，（B1）和热固性组合物的软化点低于50℃，（B2）的50℃以上100℃的软化点比热固化性成分和，（C）不大于100℃的软化点更（B1）相对于树脂组合物100质量％，软化点低于50℃的热固化性成分为10〜20质量％; （重量），（B2），通过含有小于50℃100℃，（C）的15至30％的软化点（质量）以下的酚醛树脂100℃的热固化性成分的质量的10％至20％，软化点20％。

4. 发明授权

KR101571526B1 전자기 장애를 차폐하는 집적회로 패키지 시스템 有权
标题翻译：用于屏蔽电磁干扰的集成电路封装系统
公开(公告)号：KR101571526B1
公开(公告)日：2015-11-24
申请号：KR1020080112935
申请日：2008-11-13
申请人： 스태츠 칩팩 피티이. 엘티디.
发明人： 도병태 , 콴힙회 , 후앙루이
IPC分类号： H05K9/00 , H01L23/60
CPC分类号： H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49171 , H01L2224/49175 , H01L2224/49179 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/1626 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 집적회로패키지방법은, 기판을제공하는단계와; 상기기판에집적회로를연결하는단계와; 상기집적회로주위에차폐부재를장착하는단계와; 상기차폐부재바로위에전도성차폐층을부착하는단계와; 시스템상호접속부를상기차폐부재에연결하는단계를포함한다.

5. 发明公开

KR1020090063084A 전자기 장애를 차폐하는 집적회로 패키지 시스템 有权
标题翻译：用于屏蔽电磁干扰的集成电路封装系统
公开(公告)号：KR1020090063084A
公开(公告)日：2009-06-17
申请号：KR1020080112935
申请日：2008-11-13
申请人： 스태츠 칩팩 피티이. 엘티디.
发明人： 도병태 , 콴힙회 , 후앙루이
IPC分类号： H05K9/00 , H01L23/60
CPC分类号： H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49171 , H01L2224/49175 , H01L2224/49179 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/1626 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system for shielding electromagnetic interference is provided to shield reliably the electromagnetic interference with a low cost without increasing a horizontal dimension or a vertical dimension of an integrated circuit package. A substrate supplying process is performed to provide a substrate(102). An integrated circuit connection process is performed to connect an integrated circuit with the substrate. A shielding member installation process is performed to install a shielding member(120) around the integrated circuit. A conductive shielding layer attachment process is performed to attach a conductive shielding layer(128) on the shielding member. A system interconnection unit(130) is connected to the shielding member. A conductive adhesive(116) is attached between the shielding member and the substrate.
摘要翻译：提供用于屏蔽电磁干扰的集成电路封装系统，以便在不增加集成电路封装的水平尺寸或垂直尺寸的情况下，以低成本可靠地屏蔽电磁干扰。执行基板供给处理以提供基板（102）。执行集成电路连接处理以将集成电路与衬底连接。执行屏蔽构件安装处理以在集成电路周围安装屏蔽构件（120）。执行导电屏蔽层附着工艺以将导电屏蔽层（128）附着在屏蔽部件上。系统互连单元（130）连接到屏蔽构件。导电粘合剂（116）附着在屏蔽构件和基板之间。

6. 发明授权

KR1019950000205B1 리이드 프레임 및 이를 사용한 반도체 장치 失效
标题翻译：引导框架和使用相同的半导体器件
公开(公告)号：KR1019950000205B1
公开(公告)日：1995-01-11
申请号：KR1019860007396
申请日：1986-09-04
申请人： 가부시끼가이샤 히다치 세이사꾸쇼 , 히다치마이크로컴퓨터 엔지니어링 가부시키가이샤
发明人： 하기와라야스히사 , 마스다마사지가
IPC分类号： H01L23/48
CPC分类号： H01L21/4825 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/49179 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： 내용 없음.
摘要翻译：根据本发明的引线框架被构造成使得与突片悬挂引线相邻设置的内部引线的宽度或长度大于其它内部引线的宽度或长度，由此在结合到引线时可以完全支撑导线，因此，可以可靠地进行接合，并且可以防止电线短路的发生。因此，可以提供高可靠性的半导体装置。

7. 发明公开

KR1020160139043A 접착시트 및 반도체 장치의 제조 방법 无效
标题翻译：粘合片及制造半导体器件的方法
公开(公告)号：KR1020160139043A
公开(公告)日：2016-12-06
申请号：KR1020167032236
申请日：2013-03-05
申请人： 히타치가세이가부시끼가이샤
发明人： 코다마메구미 , 토쿠야스타카히로 , 이와쿠라테츠로우
IPC分类号： C09J7/00 , C09J161/04 , C09J133/06 , C09J163/04 , H01L23/00 , H01L21/18
CPC分类号： C09J7/00 , C09J7/10 , C09J113/00 , C09J2201/61 , C09J2203/326 , C09J2413/00 , C09J2461/00 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2221/68377 , H01L2224/27001 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48096 , H01L2224/48106 , H01L2224/48227 , H01L2224/48472 , H01L2224/49179 , H01L2224/73265 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/00 , H01L2224/48095 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , C09J133/068 , C09J161/04 , C09J163/04 , H01L21/185 , H01L24/47
摘要： 본발명의접착시트는, (A)고분자량성분과, (B1)연화점이 50℃미만인열경화성성분과, (B2)연화점이 50℃이상 100℃이하인열경화성성분과, (C)연화점이 100℃이하인페놀수지를포함하는수지조성물로이루어지고, 그수지조성물 100질량%를기준으로하여, 상기 (A)고분자량성분을 11∼22질량%, 상기 (B1)연화점이 50℃미만인열경화성성분을 10∼20질량%, 상기 (B2)연화점이 50℃이상 100℃이하인열경화성성분을 10∼20질량%, 상기 (C)연화점이 100℃이하인페놀수지를 15∼30질량% 함유한다.
摘要翻译：本发明的粘合片包括含有（A）高分子量组分的树脂组合物，（B1）软化点低于50℃的热固性组分，（B2）具有软化点为在50℃至100℃之间，和（C）软化点不高于100℃的酚醛树脂，该组合物含有（A）高分子量组分11-22质量％（B1）软化点低于50℃的（B1）热固性组分的10至20质量％，（B2）热固性组分的软化点在50℃至100℃之间的10至20质量％和15〜30质量％的软化点为100℃以下的酚醛树脂，基于树脂组合物的100质量％。

8. 发明授权

KR101106412B1 최적 와이어 접합 배치를 구비하는 반도체 패키지 有权
标题翻译：具有优化线束定位的半导体封装
公开(公告)号：KR101106412B1
公开(公告)日：2012-01-17
申请号：KR1020057023529
申请日：2004-06-07
申请人： 엔엑스피 유에스에이, 인코포레이티드
发明人： 웬젤,로버트,제이. , 하퍼,피터,알.
IPC分类号： H01L21/60
CPC分类号： H01L24/06 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/66 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6616 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/05082 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/0616 , H01L2224/06163 , H01L2224/32145 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4554 , H01L2224/4809 , H01L2224/48091 , H01L2224/48092 , H01L2224/48095 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/48229 , H01L2224/48233 , H01L2224/48235 , H01L2224/4824 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48601 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48701 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48801 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49052 , H01L2224/49096 , H01L2224/49097 , H01L2224/4912 , H01L2224/4917 , H01L2224/49171 , H01L2224/49174 , H01L2224/49175 , H01L2224/49179 , H01L2224/49431 , H01L2224/854 , H01L2224/85401 , H01L2224/85424 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15313 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00013
摘要： Closely-spaced bonding wires may be used in a variety of different packaging applications to achieve improved electrical performance. In one embodiment, two adjacent bonding wires within a wire grouping are closely-spaced if a separation distance D between the two adjacent wires is met for at least 50 percent of the length of the shorter of the two adjacent wires. In one embodiment, the separation distance D is at most two times a diameter of the wire having the larger diameter of the two adjacent wires. In another embodiment, the separation distance D is at most three times a wire-to-wire pitch between the two adjacent wires. Each wire grouping may include two of more closely-spaced wires. Wire groupings of closely-spaced bonding wires may be used to form, for example, power-signal-ground triplets, signal-ground pairs, signal-power pairs, or differential signal pairs or triplets.
摘要翻译：紧密间隔的接合线可用于各种不同的包装应用中，以实现改进的电气性能。在一个实施例中，如果两条相邻导线之间的间隔距离D达到两条相邻导线中较短的长度的至少50％，则导线组内的两个相邻接合线是紧密间隔的。在一个实施例中，分离距离D为具有两个相邻线的较大直径的线的直径的至多两倍。在另一个实施例中，分离距离D至少为两条相邻线之间的线对线间距的三倍。每个线分组可以包括两个更紧密间隔的导线。紧密间隔的接合线的电线组可以用于形成例如功率 - 信号 - 接地三联体，信号 - 接地对，信号 - 功率对或差分信号对或三元组。

9. 发明授权

KR1019970000219B1 반도체 장치 및 그 제조 방법 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：KR1019970000219B1
公开(公告)日：1997-01-06
申请号：KR1019910015564
申请日：1991-09-06
申请人： 세이코 엡슨 가부시키가이샤
发明人： 오쯔끼데쯔야
IPC分类号： H01L23/04
CPC分类号： H01L23/49861 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/49 , H01L2224/16 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/49179 , H01L2924/00014 , H01L2924/09701 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： 내용 없음.

10. 发明公开

KR1019960015826A 캐필러리를 사용한 와이어 본딩방법 및 장치 失效
标题翻译：引线键合方法和使用毛细管的装置
公开(公告)号：KR1019960015826A
公开(公告)日：1996-05-22
申请号：KR1019950035299
申请日：1995-10-13
申请人： 텍사스 인스트루먼츠 인코포레이티드
发明人： 로데릭엘.퀴크 , 존더블유.오커트
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L23/4952 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/49179 , H01L2224/78268 , H01L2224/78301 , H01L2224/78801 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01039 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/20752 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： 볼본드및 스티치본드를형성하는와이어본딩장치는절삭된캐필러리(20)를갖는본드헤드, 본드헤드(42)를홀딩하는캐리어(43), 캐리어(43)가위에장착된베어링(44), 및베어링(44)이위에장착된베어링테이블(46)을포함한다. 베어링테이블(46) 및베어링(44)은캐필러리(20)에대해서 z축에관한회전운동을제공한다. 캐리어베어링테이블(46)이위에장착된 x-y테이블(48)은캐필러리(20)에대해서 x 및 y방향으로의이동을제공한다. 고정된작업홀더(50)는반도체다이(11) 및캐필러리(20)에인접한리드프레임(52)을지지한다. 절삭캐필러리(20)와작업홀더(50)간에상대적인회전이제공됨에따라서리드프레임(52)에대한캐필러리(20)의적절한방위가제공되어리드프레임(52) 상에서고품질의스티치본드를형성할수 있고아울러미세한피치의볼 본드를반도체다이(11) 사에형성할수 있다.
摘要翻译：用于形成球焊和线迹结合的打线接合设备包括具有切割毛细管20的接合头，用于保持接合头42的载体43，安装在载体43上的轴承44，以及安装在轴承（44）的相对侧上的轴承台（46）。轴承台46和轴承44提供围绕z轴相对于毛细管20的旋转运动。安装在载体支承台46上的x-y台48提供相对于毛细管20在x和y方向上的移动。固定工件夹具50支撑与毛细管20相邻的半导体管芯11和引线框架52。当毛细管20与工件夹具50之间的相对旋转被提供时，提供毛细管20相对于引线框架52的适当定向以在引线框架52上提供高质量的针脚结合并且可以在半导体管芯11的纱线上形成细间距的球接合。

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