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1. 发明公开

KR1020130053033A 다수 공작물의 동시 가공장치 有权
标题翻译：一种使用多轴机器的产品组合加工系统
公开(公告)号：KR1020130053033A
公开(公告)日：2013-05-23
申请号：KR1020110118501
申请日：2011-11-14
申请人： 안동준
发明人： 김복인
IPC分类号： B23P23/00 , B23P23/02 , B23B39/16 , B23Q1/25
CPC分类号： B23Q1/25 , B23B39/18 , B23P23/02
摘要： PURPOSE: A device for simultaneously processing the number of workpieces is provided to efficiently utilize, to save a production cost by installing one or more processing devices from each device, and to minimize defective product by standardizing a process. CONSTITUTION: A device for simultaneously processing the number of workpieces comprises a plurality of worktables(300) reciprocating by a transfer member around a base(100). A plurality of columns is arranged between the worktables and is connected to a gantry(410) positioned on an upper side of the worktable. A spindle block in which a spindle(435) is adhered by being varied through the transfer member is connected to one surface of the gantry. The position of each spindle is determined to correspond to the workpiece arranged to the worktable and a processing work is simultaneously performed to the workpieces supported on the worktables.
摘要翻译：目的：提供用于同时处理工件数量的装置，以通过从每个装置安装一个或多个处理装置来有效地利用，节省生产成本，并通过标准化过程来最小化有缺陷的产品。构成：用于同时处理工件数量的装置包括多个工作台（300），所述工作台（300）由传递构件围绕基座（100）往复运动。多个列布置在工作台之间并连接到位于工作台上侧的台架（410）。通过转移构件改变主轴（435）的主轴块连接到机架的一个表面。每个主轴的位置被确定为对应于布置在工作台上的工件，同时对被支承在工作台上的工件执行加工工作。

2. 发明授权

KR101273284B1 인쇄회로기판 가공기 및 그 천공 가공 방법 有权
标题翻译：印刷电路板加工设备和钻孔方法
公开(公告)号：KR101273284B1
公开(公告)日：2013-06-11
申请号：KR1020070015959
申请日：2007-02-15
申请人： 비아 메카닉스 가부시키가이샤
发明人： 와타나베가즈오 , 구마가이노리시게 , 나가사와가쓰히로 , 야마시타다카히코 , 가마타히로유키 , 고시즈카히사히로 , 스가와라히로유키 , 미야사카도루
IPC分类号： B23Q5/22 , H05K13/00
CPC分类号： H05K3/0047 , B23B39/161 , B23B39/18 , H05K3/0008 , H05K3/0097
摘要： 본 발명은, 장치 전체를 크게 하지 않고, 가공 정밀도를 향상시킬 수 있는 인쇄회로기판 가공기 및 그 천공 가공 방법을 제공하는 것을 목적으로 한다.
X축 구동부(3a, 3b)와 Y축 구동부(7a, 7b)에 의해 스핀돌(5a, 5b)에 회전 가능하게 고정된 드릴(4a, 4b)의 축선을 가공 위치에 위치시킨 후, Z축 구동부(6a, 6b)에 의해 드릴(4a, 4b)을 인쇄회로기판(1a, 1b)에 인입시켜 천공 가공을 행하는 인쇄회로기판 가공기(M)에 있어서, X 및 Y 방향의 인접하는 각각의 축을 각각 역방향으로 이동시켜 천공 가공을 행한다.
인쇄회로기판, 테이블, X축 구동부, 크로스 슬라이드, Y축 구동부, 스핀들, Z축 구동부, 드릴, 제어 수단.

3. 发明公开

KR1020070082560A 인쇄회로기판 가공기 및 그 천공 가공 방법 有权
标题翻译：印刷电路板加工设备和钻孔方法
公开(公告)号：KR1020070082560A
公开(公告)日：2007-08-21
申请号：KR1020070015959
申请日：2007-02-15
申请人： 비아 메카닉스 가부시키가이샤
发明人： 와타나베가즈오 , 구마가이노리시게 , 나가사와가쓰히로 , 야마시타다카히코 , 가마타히로유키 , 고시즈카히사히로 , 스가와라히로유키 , 미야사카도루
IPC分类号： B23Q5/22 , H05K13/00
CPC分类号： H05K3/0047 , B23B39/161 , B23B39/18 , H05K3/0008 , H05K3/0097
摘要： A printed circuit board machining apparatus and a drilling method thereof are provided to achieve improved accuracy of machining without increasing the size of the machining apparatus. A printed circuit board machining apparatus includes a plurality of tables on which printed circuit boards(1a,1b) are mounted; an X-axis driving unit for moving the tables along the X axis; cross slides arranged on the tables; a Y-axis driving unit for moving the cross slides along the Y axis; spindles supported on the cross slides; and a Z-axis driving unit for moving the spindles along the Z axis. The axial line of a drill which is mounted on the spindle to be rotatable by the X-axis and Y-axis driving units is positioned at a machining position. Subsequently, the drill is introduced to the printed circuit board by the Z-axis driving unit and performs a drilling process. The printed circuit board machining apparatus includes a controller for controlling the X-axis and Y-axis driving units and performing a drilling process by moving at least one of the X-axis and Y-axis in a reverse direction.
摘要翻译：提供一种印刷电路板加工装置及其钻孔方法，以提高加工精度，而不增加加工装置的尺寸。一种印刷电路板加工装置，包括安装有印刷电路板（1a，1b）的多个工作台; 用于沿X轴移动台的X轴驱动单元; 横放在桌子上的幻灯片; Y轴驱动单元，用于沿着Y轴移动十字滑块; 主轴支撑在十字架上; 以及用于沿Z轴移动心轴的Z轴驱动单元。安装在主轴上以由X轴和Y轴驱动单元旋转的钻头的轴线位于加工位置。随后，通过Z轴驱动单元将钻头引入印刷电路板，并进行钻孔处理。印刷电路板加工装置包括用于控制X轴和Y轴驱动单元的控制器，并且通过沿相反方向移动X轴和Y轴中的至少一个来执行钻孔处理。

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