会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明公开
    • 웨이퍼 세정장치
    • 装置清洁
    • KR1020100012971A
    • 2010-02-09
    • KR1020080074430
    • 2008-07-30
    • 삼성전자주식회사
    • 안승경
    • H01L21/304
    • H01L21/67051B05B1/24B05B7/1272
    • PURPOSE: An apparatus for cleaning a wafer is provided to improve the production yield by accelerating a gas and cleaning solution with a cavitation nozzle and minimize the failure of cleaning. CONSTITUTION: A chuck(11) supports a wafer(13). A cleaning liquid supply unit(10) supplies a cleaning solution for washing an organic matter on the wafer surface which is supported on the chuck. A gas supply unit(30) supplies a gas to be mixed with the cleaning solution from the cleaning liquid supply unit. A cavitation nozzle(40) mixes the gas and the cleaning solution from the gas supply unit and discharges the mixed gas. The cleaning liquid supply includes a first cleaning liquid supply unit(12) supplying a sulfuric acid and a second cleaning liquid supply(14) supplying a hydrogen peroxide.
    • 目的:提供一种用于清洁晶片的设备,以通过用气蚀喷嘴加速气体和清洁溶液来提高生产率,并最大限度地减少清洗失败。 构成:卡盘(11)支撑晶片(13)。 清洗液供给单元(10)在支撑在卡盘上的晶片表面上提供清洗有机物的清洗液。 气体供给单元(30)从清洗液供给单元供给与清洗液混合的气体。 气蚀喷嘴(40)将气体和清洁溶液从气体供应单元混合并排出混合气体。 清洗液供给装置包括供给硫酸的第一清洗液供给单元(12)和供给过氧化氢的第二清洗液供给装置(14)。