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1. 发明公开

KR1020080056376A 화학적 물리적 세정장치 无效
标题翻译：化学和物理清洁装置
公开(公告)号：KR1020080056376A
公开(公告)日：2008-06-23
申请号：KR1020060129205
申请日：2006-12-18
申请人： 주식회사 케이씨
发明人： 박종수 , 윤철남 , 김세호 , 김태욱 , 유경호
IPC分类号： H01L21/304
摘要： A chemical physical cleaning apparatus is provided to easily remove particles firmly attached to the surface of a cleaning target by an organic material by sequentially performing a chemical cleaning process and a physical cleaning process. A loading/unloading part(20) loads a cleaning target(10) and unloads the cleaning target in a reverse direction of the loading direction. A rotational cleaning module(30) removes static electricity and particles on the surface of the cleaning target loaded/unloaded by the loading/unloading part, including a first surface process part, a second surface process part and a rotation part(33). The first surface process part remove an organic material and static electricity from the surface of the cleaning target. The second surface process part removes particles from the surface of the cleaning target. The rotation part makes the first or second surface process part face toward the surface of the cleaning target by rotation.
摘要翻译：提供一种化学物理清洁装置，通过依次执行化学清洁处理和物理清洁处理，通过有机材料容易地除去牢固地附着在清洁对象表面上的颗粒。装载/卸载部件（20）装载清洁目标件（10）并沿与装载方向相反的方向卸载清洁目标物。旋转清洁模块（30）去除由装载/卸载部件装载/卸载的清洁目标表面上的静电和颗粒，包括第一表面处理部分，第二表面处理部分和旋转部分（33）。第一表面处理部件从清洁目标表面去除有机材料和静电。第二表面处理部分从清洁目标的表面去除颗粒。旋转部通过旋转使第一或第二表面处理部朝向清洁对象物的表面。

2. 发明公开

KR1020080034277A 습식세정장비의 세정수 공급장치 및 이를 이용한대전방지방법 无效
标题翻译：用于在湿地中提供清洁溶液的装置和防止静电的方法
公开(公告)号：KR1020080034277A
公开(公告)日：2008-04-21
申请号：KR1020060100283
申请日：2006-10-16
申请人： 주식회사 케이씨
发明人： 김세호 , 박종수 , 윤철남
IPC分类号： H01L21/304
摘要： A device for supplying cleaning solution in a wet cleaning station and an electrification prevention method using the same are provided to prevent generation of static electricity and improve cleaning efficiency by reducing resistivity of cleaning liquid to be sprayed on a substrate. A first line(100) transfers cleaning liquid to an injection module(500). A second line(200) is interconnected with the first line, and merges a processing water which has an adjusted resistivity value into the first line together. A processing unit(300) is installed on the second line, and controls the resistivity of the cleaning liquid which is transferred to the first line along the second line. A gas supply unit(400) supplies CO2 gas to the processing unit.
摘要翻译：提供了一种在湿式清洗站中提供清洁溶液的装置以及使用该装置的防电气化方法，以通过降低待喷涂在基材上的清洗液的电阻率来防止产生静电并提高清洁效率。第一行（100）将清洗液转移到注射模块（500）。第二线（200）与第一线相互连接，并将具有调整的电阻率值的处理水合并在一起。处理单元（300）安装在第二线路上，并且控制沿着第二线路传送到第一线路的清洁液体的电阻率。气体供应单元（400）向处理单元提供CO 2气体。

3. 发明授权

KR100691470B1 건식 세정장치의 승화성 고체입자 공급장치 有权
标题翻译： 건식세정장치의승화성고체입자공급장치
公开(公告)号：KR100691470B1
公开(公告)日：2007-03-12
申请号：KR1020050123777
申请日：2005-12-15
申请人： 주식회사 케이씨
发明人： 박종수 , 윤철남 , 김세호
IPC分类号： H01L21/304
摘要： A sublimatable solid particle supplying apparatus of a dry cleaning apparatus is provided to maintain proper detergence while using low pressure and a small amount of air by directly mixing and injecting pressure air and sublimatable solid particles. An upper plate(100) receives sublimatable solid particles and pressure air through different paths and supplies the pressure air and the sublimatable solid particles to the lower surface of a sublimatable solid particle supplying apparatus. A lower plate(300) has an injection hole for exhausting the sublimatable solid particles mixed with the pressure air. A rotation axis(600) penetrates the center part of the upper and the lower plates. A rotation mixing part(200) transfers the sublimatable solid particles, mixes the sublimatable solid particles with the pressure air, and exhausts the mixed sublimatable solid particles with the pressure air through the injection hole of the lower plate, positioned between the upper plate and the lower plate and rotating as the rotation axis rotates. A buffer support part(500) reduces the vibration of the upper and the lower plates, including a plurality of buffer protrusion parts and a support plate. The plurality of buffer protrusion part comes in contact with the lower surface of the lower plate to buffer vibration. The support plate supports and fixes the lower surface of the plurality of buffer protrusion parts.
摘要翻译：通过直接混合和注入压力空气和可升华的固体颗粒来提供干式清洁装置的可升华固体颗粒供应装置，以在使用低压和少量空气的同时保持适当的清洁。上板（100）通过不同的路径接收可升华固体颗粒和压缩空气，并将压力空气和可升华固体颗粒供应到可升华固体颗粒供应设备的下表面。下板（300）具有用于排出与压缩空气混合的可升华固体颗粒的注入孔。旋转轴（600）穿过上板和下板的中心部分。旋转混合部（200）传送可升华固体颗粒，使可升华固体颗粒与压缩空气混合，并通过位于上部板和下部板之间的下部板的注入孔用压缩空气排出混合的可升华固体颗粒下板并随着旋转轴旋转而旋转。缓冲支撑部分（500）减小包括多个缓冲突出部分和支撑板的上板和下板的振动。多个缓冲突起部分与下板的下表面接触以缓冲振动。支撑板支撑并固定多个缓冲突起部分的下表面。

4. 发明公开

KR1020090069757A 포토마스크 세정장치 有权
标题翻译： PHOTOMASK清洁装置
公开(公告)号：KR1020090069757A
公开(公告)日：2009-07-01
申请号：KR1020070137534
申请日：2007-12-26
申请人： 주식회사 케이씨
发明人： 박종수 , 윤철남
IPC分类号： H01L21/304
CPC分类号： G03F1/82 , G03F7/70925
摘要： A photomask cleaning device is provided to prevent growing particle on a surface of a photomask to be cleaned since a sublimate dose not remain on the photomask after removing an adhesives. A cleaning chamber performs a cleaning process of a loaded/unloaded photomask, and a loading/unloading device performs loading/unloading of the photomask in the cleaning chamber. A gripper part(200) clamps the loaded photomask, and a cleaning process part(300) sprays sublimate on the clamped photomask and removes an adhesives attached on the photomask after removing a pellicle. The cleaning process part includes a first spray unit spraying an adhesive firstly and it also includes a second spray unit removing remaining adhesive.
摘要翻译：提供光掩模清洁装置以防止在要清洁的光掩模的表面上的生长颗粒，因为在除去粘合剂之后，在光掩模上不保留升华剂量。清洁室执行装载/卸载的光掩模的清洁处理，并且装载/卸载装置在清洁室中执行光掩模的装载/卸载。夹持器部分（200）夹紧加载的光掩模，并且清洁处理部分（300）在夹持的光掩模上升华，并且在去除防护薄膜组件之后去除附着在光掩模上的粘合剂。清洁处理部件包括首先喷涂粘合剂的第一喷涂单元，并且还包括去除残留粘合剂的第二喷涂单元。

5. 发明公开

KR1020080092525A 반도체 웨이퍼 재생장치 有权
标题翻译：半导体滤波器的装置
公开(公告)号：KR1020080092525A
公开(公告)日：2008-10-16
申请号：KR1020070035914
申请日：2007-04-12
申请人： 주식회사 케이씨
发明人： 박종수 , 윤철남 , 김세호 , 이동성
IPC分类号： H01L21/68 , H01L21/02
摘要： A rework apparatus for semiconductor wafers is provided to minimize reduction of a lifetime of a mesh net conveyer by adjusting a moving width of a nozzle according to a size of a wafer. A rework apparatus for semiconductor wafers includes a wafer loading unit(30) for loading a wafer(1) as a rework target, a rework processing unit for transferring the loaded wafer and reworking and processing the transferred wafer, and an unloading unit(60) for unloading the processed wafer from the rework processing unit. The loading unit loads the wafer into the rework processing unit and includes a sensor for detecting a size of the wafer. The rework processing unit transfers the loaded wafer and reworks the wafer by moving a media injection nozzle in a horizontal direction within a size range of the wafer.
摘要翻译：提供一种用于半导体晶片的返修装置，通过根据晶片的尺寸调节喷嘴的移动宽度来最小化网状输送机的使用寿命。一种用于半导体晶片的返修装置包括用于加载作为返工目标的晶片（1）的晶片加载单元（30），用于传送加载的晶片并重新加工和处理转移的晶片的返工处理单元，以及卸载单元（60）用于从返工处理单元卸载经处理的晶片。加载单元将晶片装载到返工处理单元中，并且包括用于检测晶片尺寸的传感器。返工处理单元通过在晶片的尺寸范围内沿水平方向移动介质注入喷嘴来传送加载的晶片并重新制造晶片。

6. 发明授权

KR100852623B1 반도체 웨이퍼 이송용 진공흡착장치 有权
标题翻译：用于传输半导体波形的真空吸收器
公开(公告)号：KR100852623B1
公开(公告)日：2008-08-18
申请号：KR1020070031523
申请日：2007-03-30
申请人： 주식회사 케이씨
发明人： 박종수 , 윤철남 , 김세호 , 이동성
IPC分类号： H01L21/677
CPC分类号： H01L21/67742 , H01L21/6838 , H01L21/68707 , Y10S414/141
摘要： A vacuum absorption apparatus for transferring a semiconductor wafer is provided to avoid an obstacle to various processes for fabricating, inspecting or recycling a semiconductor wafer by preventing a wafer from being attached to a portion under a vacuum-absorbed wafer during a wafer transfer process. A vacuum absorption apparatus for transferring a semiconductor wafer includes a plurality of absorption units(11,12,13,14) for absorbing a wafer by vacuum pressure. The plurality of absorption units are separated from the absorption surface of the wafer. An air injection unit injects air to a gap between upper and lower wafers(w,w') such that the gap is generated in absorbing the wafer, so that the wafers are separated from each other.
摘要翻译：提供了用于传送半导体晶片的真空吸收装置，以避免在晶片转移过程中通过防止晶片附着到真空吸收晶片下方的部分来制造，检查或再循环半导体晶片的各种工艺的障碍。用于转移半导体晶片的真空吸收装置包括用于通过真空压力吸收晶片的多个吸收单元（11,12,13,14）。多个吸收单元与晶片的吸收表面分离。空气喷射单元将空气喷射到上部和下部晶片（w，w'）之间的间隙，使得在吸收晶片时产生间隙，使得晶片彼此分离。

7. 发明授权

KR100795548B1 노즐 세정 장치 및 이를 포함하는 슬릿 코터 有权
标题翻译：喷嘴清洁装置及其包装盒
公开(公告)号：KR100795548B1
公开(公告)日：2008-01-21
申请号：KR1020060067909
申请日：2006-07-20
申请人： 주식회사 케이씨
发明人： 권오경 , 윤철남 , 유용근 , 이동성
IPC分类号： G02F1/13
CPC分类号： B41J2/165 , G02F1/1303
摘要： A nozzle cleaning apparatus and a slit coater including the same are provided to remove impurities attached to an outlet of a slit nozzle through a non-contact method, thereby removing the necessity for stopping a coating work process for component replacement and accordingly helping maintenance. In a main body(350), a groove(352) recessed from an upside of the main body and having inner walls and bottom is formed. An ejector(358) ejects sublimated solid particles towards an outlet of a nozzle formed in the inner wall of the groove. A discharge pipe is formed in the bottom of the groove and connected with the outside of the main body so as to discharge the cleaned sublimated solid particles. A vacuum pump is connected to the discharge pipe.
摘要翻译：提供一种喷嘴清洁装置和包括该喷嘴清洁装置的狭缝涂布机，以通过非接触方式除去附着在狭缝喷嘴的出口上的杂质，从而消除了为了更换部件而停止涂布工作的必要性，从而有助于维护。在主体（350）中，形成有从主体的上侧凹陷并具有内壁和底部的凹槽（352）。喷射器（358）将升华的固体颗粒喷射到形成在凹槽的内壁中的喷嘴的出口。排出管形成在槽的底部并与主体的外部连接，以便排出已清洁的升华的固体颗粒。真空泵连接到排放管。

8. 发明公开

KR1020040101885A 웨이퍼 소잉 장치 无效
标题翻译：带喷嘴式喷涂单元和吸收单元的抛光设备
公开(公告)号：KR1020040101885A
公开(公告)日：2004-12-03
申请号：KR1020030073722
申请日：2003-10-22
申请人： 주식회사 케이씨
发明人： 윤철남
IPC分类号： H01L21/78
摘要： PURPOSE: A wafer sawing apparatus is provided to improve the productivity by performing simultaneously a plurality of processes using a nozzle-like spraying unit and a suction unit. CONSTITUTION: A wafer sawing apparatus includes a sawing unit, a nozzle-like spraying unit, and a suction unit. The sawing unit(20) is used for sawing a wafer(30). The nozzle-like spraying unit(40) is used for cooling the wafer and removing particles(25) from the wafer by spraying aerosol on a sawn portion of the wafer. The suction unit(50) is used for absorbing the particles.
摘要翻译：目的：提供晶片锯切装置，通过使用喷嘴状喷射单元和抽吸单元同时执行多个处理来提高生产率。构成：晶片锯切装置包括锯切单元，喷嘴状喷射单元和抽吸单元。锯切单元（20）用于锯切晶片（30）。喷嘴状喷射单元（40）用于冷却晶片并通过在晶片的锯切部分上喷射气溶胶从晶片去除颗粒（25）。抽吸单元（50）用于吸收颗粒。

9. 发明公开

KR1020020069794A 표면 세정을 위한 승화성 고체 입자 분사용 노즐 有权
标题翻译：用于喷涂表面清洁的底部固体颗粒的喷嘴
公开(公告)号：KR1020020069794A
公开(公告)日：2002-09-05
申请号：KR1020010010240
申请日：2001-02-28
申请人： 주식회사 케이씨
发明人： 윤철남 , 고세종
IPC分类号： H01L21/304
CPC分类号： H01L21/3046 , B24C1/003 , B24C3/322 , B24C5/04 , Y10S134/902
摘要： PURPOSE: A nozzle for spraying sublimated solid particles for surface cleaning is provided to prevent a cleaning media supplying path from being stopped up by a counterflow of carrier gas, by making the cleaning media supplying paths and a venturi path form an acute angle at a position where cleaning media and the carrier gas are mixed. CONSTITUTION: A space where high pressure carrier gas is supplied through a carrier gas supplying pipe(12) is formed inside a base block(1). A sub block(2) has a space where the sublimated solid particles decompressed by a regulator(11) is supplied as cleaning media through the cleaning media supplying pipe(14). The first venturi block(3) is connected to the base block and the sub block. The first venturi block has a venturi path(15) for adiabatically expanding the carrier gas supplied for the space of the base block and a cleaning media spraying path for making the venturi path communicate with the space of the sub block. The second venturi block(4) has a venturi path(17) for adiabatically expanding mixture gas sprayed from the first venturi block, connected to the first venturi block.
摘要翻译：目的：提供用于喷射升华的固体颗粒进行表面清洁的喷嘴，以防止清洁介质供给路径被载气的逆流阻止，通过使清洁介质供给路径和文丘里路径在位置处形成锐角其中清洁介质和载气混合。构成：在基座（1）内形成有通过载气供给管（12）供给高压载气的空间。子块（2）具有通过调节器（11）减压的升华的固体颗粒通过清洁介质供给管（14）作为清洁介质供给的空间。第一文丘里块（3）连接到基块和子块。第一文氏管块具有文丘里路径（15），用于绝热地膨胀为基块的空间供应的载气，以及用于使文丘里路径与子块的空间通信的清洁介质喷射路径。第二文丘里管块（4）具有文丘里路径（17），用于绝热膨胀从第一文丘里管块喷射的混合气体，其连接到第一文丘里管块。

10. 发明公开

KR1020010082973A 반도체 장비 부품 세정을 위한 노즐 有权
标题翻译：用于清洁半导体设备组件的喷嘴
公开(公告)号：KR1020010082973A
公开(公告)日：2001-08-31
申请号：KR1020000008560
申请日：2000-02-22
申请人： 주식회사 케이씨
发明人： 윤철남
IPC分类号： H01L21/00
摘要： PURPOSE: A nozzle is to increase solidification ratio by solidifying a cleaning media through a regulator and an orifice and a space in the first and second orifice block to be subjected to repeated condensation and solidification. CONSTITUTION: A regulator(11) is connected to a chamber containing a cleaning media through a channel and discharges a particle of cleaning media into a snow particle through a pressure relief. A cleaning media supplying part(7) is connected to the regulator. A base block(1) is engaged with the cleaning media supplying part and has a space(1a) receiving the snow particle temporarily through the regulator. A carrier gas supplying part(9) connected to the base block puts a carrier gas into the space. The first orifice block(21) connected to a tip of the base block adiabatically expands a cleaning media formed of a snow particle to increase a size of a solidified particle and solidifies a cleaning media particle of spray state. The second orifice block(23) repeatedly and adiabatically expands the cleaning media which has passed the first orifice block to further increase the size of the solidified particle through the first orifice block to increase a solidification ratio.
摘要翻译：目的：喷嘴通过固化清洁介质通过调节器和孔口以及第一和第二孔板中的空间来增加凝固比，以进行反复冷凝和凝固。构成：调节器（11）通过通道连接到容纳清洁介质的室，并通过压力释放将清洁介质的颗粒排放到雪粒子中。清洁介质供应部分（7）连接到调节器。基座（1）与清洁介质供应部分接合，并且具有通过调节器临时接收雪粒子的空间（1a）。与基座连接的载气供给部（9）将载气放入空间。连接到基座的尖端的第一孔口块（21）绝热地膨胀由雪粒子形成的清洁介质，以增加固化颗粒的尺寸并固化喷雾状态的清洁介质颗粒。第二孔块（23）重复并绝热地膨胀已经通过第一孔块的清洁介质，以进一步增加通过第一孔块的固化颗粒的尺寸以增加凝固比。

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