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    • 4. 发明公开
    • 실리카계 절연층 형성용 조성물, 실리카계 절연층 및 실리카계 절연층의 제조방법
    • 用于形成二氧化硅基绝缘层的组合物,基于二氧化硅的绝缘层和用于制造基于二氧化硅的绝缘层的方法
    • KR1020150017972A
    • 2015-02-23
    • KR1020130094277
    • 2013-08-08
    • 제일모직주식회사
    • 박은수곽택수나융희송현지이한송홍승희
    • H01B3/46H01B17/62C08L83/00
    • H01B19/02C08G77/54C09D183/14H01B3/18H01B3/46H01B19/04C01B33/00C08L83/00H01B17/62
    • The present invention provides an insulating layer having low permittivity and excellent mechanical properties. Provided are: an organosilane condensation polymer including a compound represented by chemical formula 1 and a compound represented by chemical formula 2; and a composition for forming silica based insulating layer including a solvent, wherein chemical formula 1 is (R^1)_3SiXSi(R^1)_3 and chemical formula 2 is (R^2)_n(Si)(OR^3)_4-n. In chemical formula 1 and 2, R^1 to R^3,X and n are defined as follows. R^1 is hydrogen, a hydroxy group, a substituted or unsubstituted C1-C20 alkoxy group, a halogen-containing group, a silicon-containing group, or a combination thereof. R^2 is hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, a vinyl Group, or a combination thereof. R^3 is hydrogen, substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, a vinyl group, or a combination thereof. X is a linking group containing a porogen. n is an integer from 0 to 3.
    • 本发明提供一种具有低介电常数和优异机械性能的绝缘层。 提供:包含由化学式1表示的化合物和由化学式2表示的化合物的有机硅烷缩聚物; 以及用于形成包含溶剂的二氧化硅基绝缘层的组合物,其中化学式1是(R 1)3 SiXSi(R 1)3和化学式2是(R 2)n(Si)(OR 3))4 -n。 在化学式1和2中,R 1至R 9,X和n定义如下。 R 1是氢,羟基,取代或未取代的C 1 -C 20烷氧基,含卤素基团,含硅基团或其组合。 R 2是氢,羟基,取代或未取代的C 1至C 30烷基,取代或未取代的C 6至C 20芳基,乙烯基或其组合。 取代或未取代的C1〜C30烷基,取代或未取代的C6〜C20芳基,乙烯基,或它们的组合。 X是含有致孔剂的连接基团。 n为0〜3的整数。